HK1249192A1 - 曝光裝置、平面顯示器之製造方法、以及元件製造方法 - Google Patents
曝光裝置、平面顯示器之製造方法、以及元件製造方法Info
- Publication number
- HK1249192A1 HK1249192A1 HK18108661.1A HK18108661A HK1249192A1 HK 1249192 A1 HK1249192 A1 HK 1249192A1 HK 18108661 A HK18108661 A HK 18108661A HK 1249192 A1 HK1249192 A1 HK 1249192A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- manufacturing
- flat
- panel display
- exposure device
- display manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 2
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
- G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
- G01D5/36—Forming the light into pulses
- G01D5/38—Forming the light into pulses by diffraction gratings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015194829 | 2015-09-30 | ||
PCT/JP2016/078842 WO2017057587A1 (ja) | 2015-09-30 | 2016-09-29 | 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1249192A1 true HK1249192A1 (zh) | 2018-10-26 |
Family
ID=58423733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK18108661.1A HK1249192A1 (zh) | 2015-09-30 | 2018-07-04 | 曝光裝置、平面顯示器之製造方法、以及元件製造方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US20180364595A1 (zh) |
JP (2) | JP6791154B2 (zh) |
KR (1) | KR20180059814A (zh) |
CN (2) | CN108139677B (zh) |
HK (1) | HK1249192A1 (zh) |
TW (2) | TWI727975B (zh) |
WO (1) | WO2017057587A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6562626B2 (ja) * | 2014-12-10 | 2019-08-21 | キヤノン株式会社 | 顕微鏡システム |
CN111929992A (zh) | 2015-09-30 | 2020-11-13 | 株式会社尼康 | 移动体装置、曝光装置、平面显示器的制造方法、及元件制造方法、以及物体的移动方法 |
CN108139685B (zh) | 2015-09-30 | 2020-12-04 | 株式会社尼康 | 曝光装置、平面显示器的制造方法、组件制造方法、及曝光方法 |
WO2019234664A1 (en) | 2018-06-06 | 2019-12-12 | Minoryx Therapeutics S.L. | 5-[[4-[2-[5-(1-hydroxyethyl)pyridin-2-yl]ethoxy]phenyl]methyl]-1,3-thiazolidine-2,4-dione and its salts for use in the treatment of mitochondrial diseases |
IT202100006692A1 (it) * | 2021-03-19 | 2022-09-19 | Lika Electronic S R L | Apparecchiatura di trasduzione di posizione/spostamenti e sistema e metodo correlati |
CN114043004A (zh) * | 2021-11-02 | 2022-02-15 | 湖南红宝科技开发有限公司 | 一种用于新能源汽车配件加工的切割平台 |
Family Cites Families (30)
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US5729331A (en) | 1993-06-30 | 1998-03-17 | Nikon Corporation | Exposure apparatus, optical projection apparatus and a method for adjusting the optical projection apparatus |
JPH07270122A (ja) * | 1994-03-30 | 1995-10-20 | Canon Inc | 変位検出装置、該変位検出装置を備えた露光装置およびデバイスの製造方法 |
JP2001215718A (ja) | 1999-11-26 | 2001-08-10 | Nikon Corp | 露光装置及び露光方法 |
US6639686B1 (en) | 2000-04-13 | 2003-10-28 | Nanowave, Inc. | Method of and apparatus for real-time continual nanometer scale position measurement by beam probing as by laser beams and the like of atomic and other undulating surfaces such as gratings or the like relatively moving with respect to the probing beams |
JP2003004040A (ja) | 2001-06-19 | 2003-01-08 | Thk Co Ltd | 転がり案内装置 |
US7956876B2 (en) | 2005-03-15 | 2011-06-07 | Sharp Kabushiki Kaisha | Drive method of display device, drive unit of display device, program of the drive unit and storage medium thereof, and display device including the drive unit |
MX2007003252A (es) * | 2005-03-29 | 2007-10-11 | Nippon Kogaku Kk | Aparato expositor, metodo de produccion del mismo y metodo de produccion del micro-dispositivo. |
US8027021B2 (en) * | 2006-02-21 | 2011-09-27 | Nikon Corporation | Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method |
US7636165B2 (en) * | 2006-03-21 | 2009-12-22 | Asml Netherlands B.V. | Displacement measurement systems lithographic apparatus and device manufacturing method |
CN103645608B (zh) * | 2006-08-31 | 2016-04-20 | 株式会社尼康 | 曝光装置及方法、组件制造方法以及决定方法 |
TWI653511B (zh) | 2006-08-31 | 2019-03-11 | 日商尼康股份有限公司 | Exposure apparatus, exposure method, and component manufacturing method |
WO2008129762A1 (ja) | 2007-03-05 | 2008-10-30 | Nikon Corporation | 移動体装置、パターン形成装置及びパターン形成方法、デバイス製造方法、移動体装置の製造方法、並びに移動体駆動方法 |
TW200846626A (en) * | 2007-03-08 | 2008-12-01 | Nikon Corp | Position measurement module, position measurement apparatus, stage apparatus, exposure apparatus, and method for manufacturing decive |
JP5169492B2 (ja) | 2007-05-30 | 2013-03-27 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
US8243257B2 (en) * | 2007-07-24 | 2012-08-14 | Nikon Corporation | Position measurement system, exposure apparatus, position measuring method, exposure method and device manufacturing method, and tool and measuring method |
US8237919B2 (en) * | 2007-08-24 | 2012-08-07 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads |
US8269945B2 (en) | 2007-12-28 | 2012-09-18 | Nikon Corporation | Movable body drive method and apparatus, exposure method and apparatus, pattern formation method and apparatus, and device manufacturing method |
CN102566320B (zh) * | 2007-12-28 | 2015-01-28 | 株式会社尼康 | 曝光装置、曝光方法以及器件制造方法 |
US8792079B2 (en) | 2007-12-28 | 2014-07-29 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method having encoders to measure displacement between optical member and measurement mount and between measurement mount and movable body |
DE102008010284A1 (de) * | 2008-02-21 | 2009-08-27 | Dr. Johannes Heidenhain Gmbh | XY-Tisch mit einer Messanordnung zur Positionsbestimmung |
TW201100975A (en) | 2009-04-21 | 2011-01-01 | Nikon Corp | Moving-object apparatus, exposure apparatus, exposure method, and device manufacturing method |
US8355116B2 (en) * | 2009-06-19 | 2013-01-15 | Nikon Corporation | Exposure apparatus and device manufacturing method |
NL2005013A (en) * | 2009-07-31 | 2011-02-02 | Asml Netherlands Bv | Positioning system, lithographic apparatus and method. |
NL2005545A (en) * | 2009-11-17 | 2011-05-18 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
US8988655B2 (en) | 2010-09-07 | 2015-03-24 | Nikon Corporation | Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method |
NL2008272A (en) * | 2011-03-09 | 2012-09-11 | Asml Netherlands Bv | Lithographic apparatus. |
KR101792276B1 (ko) * | 2012-08-23 | 2017-11-02 | 매그나칩 반도체 유한회사 | 반도체 소자 및 그 소자의 제조 방법 |
EP3723111B1 (en) * | 2012-10-02 | 2021-09-08 | Nikon Corporation | Exposure apparatus, exposure method and device manufacturing method |
JP5935896B2 (ja) * | 2012-10-04 | 2016-06-15 | 日産自動車株式会社 | ブリーザ構造 |
CN106415397B (zh) * | 2014-03-28 | 2018-09-21 | 株式会社尼康 | 移动体装置、曝光装置、平板显示器的制造方法、组件制造方法及移动体驱动方法 |
-
2016
- 2016-09-29 WO PCT/JP2016/078842 patent/WO2017057587A1/ja active Application Filing
- 2016-09-29 JP JP2017543566A patent/JP6791154B2/ja active Active
- 2016-09-29 US US15/763,819 patent/US20180364595A1/en not_active Abandoned
- 2016-09-29 CN CN201680057154.1A patent/CN108139677B/zh active Active
- 2016-09-29 KR KR1020187009712A patent/KR20180059814A/ko not_active Application Discontinuation
- 2016-09-29 CN CN202110601500.0A patent/CN113359395A/zh active Pending
- 2016-09-30 TW TW105131975A patent/TWI727975B/zh active
- 2016-09-30 TW TW110113777A patent/TW202132925A/zh unknown
-
2018
- 2018-07-04 HK HK18108661.1A patent/HK1249192A1/zh unknown
-
2020
- 2020-02-21 US US16/797,602 patent/US11392048B2/en active Active
- 2020-11-04 JP JP2020184460A patent/JP7060059B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US11392048B2 (en) | 2022-07-19 |
KR20180059814A (ko) | 2018-06-05 |
TWI727975B (zh) | 2021-05-21 |
JP2021015302A (ja) | 2021-02-12 |
CN108139677B (zh) | 2021-06-22 |
JP6791154B2 (ja) | 2020-11-25 |
TW201723673A (zh) | 2017-07-01 |
WO2017057587A1 (ja) | 2017-04-06 |
CN113359395A (zh) | 2021-09-07 |
CN108139677A (zh) | 2018-06-08 |
US20200192232A1 (en) | 2020-06-18 |
JP7060059B2 (ja) | 2022-04-26 |
TW202132925A (zh) | 2021-09-01 |
US20180364595A1 (en) | 2018-12-20 |
JPWO2017057587A1 (ja) | 2018-08-09 |
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