US20180364595A1 - Exposure apparatus, flat panel display manufacturing method, and device manufacturing method - Google Patents

Exposure apparatus, flat panel display manufacturing method, and device manufacturing method Download PDF

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US20180364595A1
US20180364595A1 US15/763,819 US201615763819A US2018364595A1 US 20180364595 A1 US20180364595 A1 US 20180364595A1 US 201615763819 A US201615763819 A US 201615763819A US 2018364595 A1 US2018364595 A1 US 2018364595A1
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measured
exposure apparatus
section
substrate
movable body
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US15/763,819
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Akinori Shirato
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Nikon Corp
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Nikon Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
    • G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
    • G01D5/36—Forming the light into pulses
    • G01D5/38—Forming the light into pulses by diffraction gratings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels

Definitions

  • the present invention relates to exposure apparatuses, flat panel display manufacturing methods, and device manufacturing methods.
  • exposure apparatuses are used such as an exposure apparatus of a step-and-scan method (a so-called scanning stepper (also called a scanner)) that transfers a pattern formed on a mask irradiated with an energy beam, while a mask (photomask) or a reticle (hereinafter collectively called a “mask”) and a glass plate or a wafer (hereinafter collectively called a “substrate”) are moved synchronously along a predetermined scanning direction (scan direction).
  • a scanning stepper also called a scanner
  • a mask photomask
  • a reticle hereinafter collectively called a “mask”
  • substrate glass plate or a wafer
  • an exposure apparatus equipped with an optical interferometer system that obtains position information within a horizontal plane of a substrate subject to exposure using a bar mirror (long mirror) that a substrate stage device has (refer to PTL 1).
  • an exposure apparatus that irradiates an object held by a movable body which moves in a first direction and a second direction orthogonal to each other with an illumination light via an optical system, while the movable body is moving in the first direction, comprising: a first measured section measured based on movement of the movable body in the first direction; a first measuring section measuring the first measured section while relatively moving in the first direction with respect to the first measured section, based on movement of the movable body in the first direction; a plurality of second measured sections arranged at different positions in the first direction, being measured based on movement of the movable body in the second direction; and a plurality of second measuring sections arranged at each of the plurality of second measured sections that measures the second measured sections while relatively moving in the second direction with respect to the second measured section, based on movement of the movable body in the second direction.
  • an exposure apparatus that irradiates an object held by a movable body which moves in a first direction and a second direction orthogonal to each other with an illumination light via an optical system, while the movable body is moving in the first direction, comprising: a plurality of measured sections arranged at positions different in the first direction measured based on movement of the movable body in the second direction to obtain position information in the second direction of the movable body; and a plurality of measuring sections provided at each of the plurality of measured sections that measures the measured sections while relatively moving in the second direction with respect to the measured section, based on movement of the object in the second direction.
  • an exposure apparatus that irradiates an object held within a plane including a first direction and a second direction orthogonal to each other movable in the first direction and the second direction with an illumination light via an optical system, while the object is moved in the first direction, comprising: a plurality of measured sections arranged at positions different in the first direction measured based on movement of the object in the second direction to obtain position information in the second direction of the object; and a plurality of measuring sections provided at each of the plurality of measured sections that measures the measured sections while relatively moving in the second direction with respect to the measured section, based on movement of the object in the second direction.
  • an exposure apparatus that irradiates an object held by a movable body which moves in a first direction and a second direction orthogonal to each other with an illumination light via an optical system, while the movable body is moving in the first direction, comprising: a first measured section measured based on movement of the movable body in the first direction; and a first measuring section measuring the first measured section while relatively moving in the first direction with respect to the first measured section, based on movement of the movable body in the first direction when being arranged facing the first measured section, wherein the first measuring section includes a plurality of first measuring sections that moves in the second direction based on movement of the movable body in the second direction and is arranged facing the first measured section at different positions in the second direction.
  • an exposure apparatus that irradiates an object held by a movable body which moves in a first direction and a second direction orthogonal to each other with an illumination light via an optical system, while the movable body is moving in the first direction, comprising: a plurality of first measured sections arranged at different positions in the second direction, being measured based on movement of the movable body in the first direction; and a plurality of first measuring sections that measures the first measured sections while relatively moving in the first direction with respect to the first measured sections, based on movement of the movable body in the first direction, at a position to measure the plurality of first measured sections.
  • an exposure apparatus that irradiates an object held by a movable body which moves in a first direction and a second direction orthogonal to each other with an illumination light via an optical system, while the movable body is moving in the first direction, comprising: a measured section measured based on movement of the movable body in the first direction; and a measuring section measuring the measured section while relatively moving in the first direction with respect to the measured section, based on movement of the movable body in the first direction when being arranged facing the measured section, wherein the measured section is movable to a first position and a second position different from each other in the second direction, and the measuring section includes a first measuring section arranged facing the measured section which has moved to the first position, and a second measuring section arranged facing the measure section which has moved to the second position.
  • a making method of a flat panel display comprising: exposing the object using the exposure apparatus according to any one of the first one to sixth aspects, and developing the object which has been exposed.
  • a device manufacturing method comprising: exposing the object using any one of the exposure apparatus according to any one of the first to sixth aspects; and developing the object which has been exposed.
  • FIG. 1 is a view schematically showing a structure of a liquid crystal exposure apparatus according to a first embodiment.
  • FIG. 2A is a view schematically showing a structure of a mask encoder system that the liquid crystal exposure apparatus in FIG. 1 is equipped with
  • FIG. 2B is an enlarged view of a part of the mask encoder system (part A in FIG. 2A ).
  • FIG. 3A is a view schematically showing a structure of a substrate encoder system that liquid crystal exposure apparatus in FIG. 1 is equipped with, and FIGS. 3B and 3C are enlarged views of a part of the substrate encoder system (section B in FIG. 3A ).
  • FIG. 4 is a side view of a head unit that the substrate encoder system has.
  • FIG. 5 is a sectional view of line C-C in FIG. 4 .
  • FIG. 6 is a conceptual diagram of the substrate encoder system.
  • FIG. 7 is a block diagram showing an input/output relation of a main controller that mainly structures a control system of the liquid crystal exposure apparatus.
  • FIG. 8A is a view (No. 1) showing an operation of the mask encoder system at the time of exposure operation
  • FIG. 8B is a view (No. 1) showing an operation of the substrate encoder system at the time of exposure operation.
  • FIG. 9A is a view (No. 2) showing an operation of the mask encoder system at the time of exposure operation.
  • FIG. 9B is a view (No. 2) showing an operation of the substrate encoder system at the time of exposure operation.
  • FIG. 10A is a view (No. 3) showing an operation of the mask encoder system at the time of exposure operation
  • FIG. 10B is a view (No. 3) showing an operation of the substrate encoder system at the time of exposure operation.
  • FIG. 11A is a view (No. 4) showing an operation of the mask encoder system at the time of exposure operation
  • FIG. 11B is a view (No. 4) showing an operation of the substrate encoder system at the time of exposure operation.
  • FIG. 12A is a view (No. 5) showing an operation of the mask encoder system at the time of exposure operation
  • FIG. 12B is a view (No. 5) showing an operation of the substrate encoder system at the time of exposure operation.
  • FIG. 13A is a view (No. 6) showing an operation of the mask encoder system at the time of exposure operation
  • FIG. 13B is a view (No. 6) showing an operation of the substrate encoder system at the time of exposure operation.
  • FIG. 14A is a view (No. 7) showing an operation of the mask encoder system at the time of exposure operation
  • FIG. 14B is a view (No. 7) showing an operation of the substrate encoder system at the time of exposure operation.
  • FIG. 15A is a view (No. 8) showing an operation of the mask encoder system at the time of exposure operation
  • FIG. 15B is a view (No. 8) showing an operation of the substrate encoder system at the time of exposure operation.
  • FIGS. 16A to 16E are views (No. 1 to No. 5) used to explain a linkage process of head outputs in the mask encoder system and the substrate encoder system.
  • FIG. 17A is a view showing a substrate encoder system according to a comparative example
  • FIG. 17B is a view used to explain an effect of the substrate encoder system according to the embodiment.
  • FIGS. 18A and 18B are views (No. 1 and No. 2) showing a substrate encoder system according to a second embodiment.
  • FIGS. 19A and 19B are views showing a substrate according to a first modified example and a second modified example
  • FIGS. 19C and 19D are views showing a mask according to the first modified example and the second modified example.
  • FIGS. 20A and 20B are views (No. 1 and No. 2) used to explain a structure of a measurement system for obtaining the distance between a pair of heads.
  • FIGS. 21A and 21B are views (No. 1 and No. 2) used to explain a structure of a measurement system for obtaining the tilt amount of a Y slide table.
  • FIGS. 22A to 22C are views showing modified examples (No. 1 to No. 3) of arrangements of heads and scales.
  • FIGS. 23A and 23B are views showing modified examples (No. 4 and No. 5) of arrangements of heads and scales.
  • FIGS. 24A and 24B are views (No. 1 and No. 2) used to explain a structure of a vertical drive mechanism of encoder heads.
  • FIGS. 25A and 25B are views (No. 1 and No. 2) used to explain a first concept of a relative position measurement system between a substrate encoder system and a mask encoder system.
  • FIG. 26 is a view showing a concrete example of a relative position measurement system between the substrate encoder system and the mask encoder system, based on the first concept.
  • FIGS. 27A and 27B are views (No. 1 and No. 2) used to explain a second concept of a relative position measurement system between a substrate encoder system and a mask encoder system.
  • FIGS. 28A to 28C are views showing a concrete example of a relative position measurement system between the substrate encoder system and the mask encoder system, based on the second concept (No. 1).
  • FIGS. 29A to 29C are views showing a concrete example of a relative position measurement system between the substrate encoder system and the mask encoder system, based on the second concept (No. 2).
  • FIG. 30 is a view showing a concrete example of a relative position measurement system between a substrate encoder system and a mask encoder system, based on a third concept (No. 1).
  • FIG. 31 is a view showing a concrete example of a relative position measurement system between the substrate encoder system and the mask encoder system, based on the third concept (No. 2).
  • FIG. 32 is a view used to explain a structure of a substrate alignment measurement system.
  • FIG. 33 is a view used to explain another structure of the substrate alignment measurement system.
  • FIGS. 34A to 34C are views (No. 1 to No. 3) used to explain a structure of a modified example in a second embodiment.
  • FIGS. 35A to 35C are views (No. 1 to No. 3) used to explain a structure of another modified example in the second embodiment.
  • FIG. 36 is a view showing an irradiation point of a measurement beam on an encoder scale.
  • FIGS. 1 to 17B a first embodiment will be described, using FIGS. 1 to 17B .
  • FIG. 1 schematically shows a structure of a liquid crystal exposure apparatus 10 according to the first embodiment.
  • Liquid crystal exposure apparatus 10 is a projection exposure apparatus of a step-and-scan method, or a so-called scanner whose exposure target is a rectangular (square-shaped) glass substrate P (hereinafter simply referred to as substrate P) used in, for example, a liquid crystal display device (flat panel display) or the like.
  • Liquid crystal exposure apparatus 10 has an illumination system 12 , a mask stage device 14 that holds a mask M on which a circuit pattern and the like is formed, a projection optical system 16 , an apparatus main section 18 , a substrate stage device 20 that holds substrate P whose surface (a surface facing a +Z side in FIG. 1 ) is coated with a resist (sensitive agent), a control system for these parts and the like.
  • a direction in which mask M and substrate P are relatively scanned with respect to projection optical system 16 at the time of exposure will be described as an X-axis direction
  • a direction orthogonal to the X-axis within a horizontal plane will be described as a Y-axis direction
  • a direction orthogonal to the X-axis and the Y-axis will be described as a Z-axis direction
  • rotation directions around the X-axis, the Y-axis, and the Z-axis will be described as ⁇ x, ⁇ y, and ⁇ z directions, respectively.
  • positions in the X-axis, the Y-axis, and the Z-axis directions will each be described as an X position, a Y position, and a Z position, respectively.
  • Illumination system 12 is structured similarly to the illumination system disclosed in, for example, U.S. Pat. No. 5,729,331 and the like. Illumination system 12 irradiates mask M with a light emitted from a light source not shown (e.g., a mercury lamp) serving as an exposure illumination light (illumination light) IL, via parts not shown such as a reflection mirror, a dichroic mirror, a shutter, a wavelength selection filter, and various kinds of lenses.
  • a light source not shown e.g., a mercury lamp
  • illumination light IL an exposure illumination light (illumination light) IL
  • parts not shown such as a reflection mirror, a dichroic mirror, a shutter, a wavelength selection filter, and various kinds of lenses.
  • illumination light IL light such as an i-line (wavelength 365 nm), a g-line (wavelength 436 nm), or an h-line (wavelength 405 nm) (or a synthetic light of the i-line, the g-line, and the h-line described above) is used.
  • Mask stage device 14 includes a mask holder 40 that holds mask M by vacuum chucking, a mask driving system 91 (not illustrated in FIG. 1 , refer to FIG. 7 ) that drives mask holder 40 in a scanning direction (the X-axis direction) in predetermined long strokes as well as finely drive mask holder 40 appropriately in the Y-axis direction and the ⁇ z direction, and a mask position measurement system that obtains position information (including rotation amount information in the ⁇ z direction; the same hereinafter) of mask holder 40 within the XY plane.
  • Mask holder 40 consists of a frame shaped member in which an opening section in a rectangular shape in a planar view is formed, as is disclosed in, for example, U.S. Patent Application Publication No.
  • Mask holder 40 is mounted on a pair of mask guides 42 fixed to an upper mount section 18 a , which is a part of apparatus main section 18 , via an air bearing (not shown).
  • Mask drive system 91 includes a linear motor (not shown).
  • the mask position measurement system is equipped with a mask encoder system 48 including a pair of encoder head units 44 (hereinafter simply referred to as a head unit 44 ) fixed to an upper mount section 18 a via an encoder base 43 , and a plurality of encoder scales 46 (overlapping in a depth direction of the page surface in FIG. 1 , refer to FIG. 2A ) arranged at a lower surface of mask holder 40 corresponding to the pair of head units 44 described above.
  • a mask encoder system 48 including a pair of encoder head units 44 (hereinafter simply referred to as a head unit 44 ) fixed to an upper mount section 18 a via an encoder base 43 , and a plurality of encoder scales 46 (overlapping in a depth direction of the page surface in FIG. 1 , refer to FIG. 2A ) arranged at a lower surface of mask holder 40 corresponding to the pair of head units 44 described above.
  • the structure of mask encoder system 48 will be described in detail later in the description.
  • Projection optical system 16 is placed below mask stage device 14 .
  • Projection optical system 16 is a so-called multi-lens projection optical system having a structure similar to the projection optical system disclosed in U.S. Pat. No. 6,552,775 and the like, and is equipped with a plurality of ( 11 in the embodiment; refer to FIG. 2A ) optical systems which forms an upright normal image with a double telecentric equal magnifying system.
  • liquid crystal exposure apparatus 10 when an illumination area on mask M is illuminated with illumination light IL from illumination system 12 , by the illumination light having passed mask M, a projection image (partial upright image) of the circuit pattern of mask M within the illumination area is formed on an irradiation area (exposure area) of the illumination light on substrate P conjugate with the illumination area, via projection optical system 16 . And, by substrate P being relatively moved in the scanning direction with respect to the exposure area (illumination light IL) along with mask M being relatively moved in the scanning direction with respect to the illumination area (illumination light IL), scanning exposure of a shot area on substrate P is performed, and the pattern formed on mask M is transferred onto the shot area.
  • Apparatus main section 18 supports mask stage device 14 described above and projection optical system 16 , and is installed on a floor 11 of a clean room via a plurality of vibration isolation devices 19 .
  • Apparatus main section 18 is structured similarly to the apparatus main section disclosed in U.S. Patent Application Publication No. 2008/0030702, and has upper mount section 18 a (also called an optical surface plate) that supports projection optical system 16 described above, a lower mount section 18 b where substrate stage device 20 is arranged, and a pair of middle mount sections 18 c.
  • Substrate stage device 20 is a device used to position substrate P with high precision with respect to projection optical system 16 (exposure light IL), and moves substrate P in predetermined strokes along the horizontal plane (the X-axis direction and the Y-axis direction), along with finely moving substrate P in directions of six degrees of freedom. While the structure of substrate stage device 20 is not limited in particular, a stage device of a so-called coarse/fine movement structure is preferably used, including a gantry type two-dimensional coarse movement stage and a fine movement stage finely moved with respect to the two-dimensional coarse movement stage, as is disclosed in U.S. Patent Application Publication No. 2008/129762, U.S. Patent Application Publication No. 2012/0057140 and the like.
  • Substrate stage device 20 is equipped with a substrate holder 34 .
  • Substrate holder 34 consists of a plate-like member having a rectangular shape in a planar view, and substrate P is mounted on its upper surface.
  • Substrate holder 34 is moved in the X-axis direction and/or the Y-axis direction with respect to projection optical system 16 in predetermined long strokes and is also finely moved in directions of six degrees of freedom, by a plurality of linear motors (e.g., voice coil motors) structuring a part of a substrate drive system 93 (not shown in FIG. 1 , refer to FIG. 7 ).
  • linear motors e.g., voice coil motors
  • liquid crystal exposure apparatus 10 has a substrate position measurement system for measuring position information of substrate holder 34 (namely, substrate P) in directions of six degrees of freedom.
  • the substrate position measurement system includes a Z tilt position measurement system 98 for acquiring position information of substrate P in the Z-axis, the ⁇ x, and ⁇ y directions (hereinafter referred to as Z tilt direction), and a substrate encoder system 50 for acquiring position information of substrate P in the XY plane, as is shown in FIG. 7 .
  • Z tilt position measurement system 98 is not limited in particular, a measurement system can be used that obtains position information of substrate P in the Z tilt direction with apparatus main section 18 (lower mount section 18 b ) serving as a reference, using a plurality of sensors attached to a system including substrate holder 34 , as is disclosed in U.S. Patent Application Publication No. 2010/0018950 and the like.
  • the structure of substrate encoder system 50 will be described later in the description.
  • FIGS. 2A and 2B the structure of mask encoder system 48 will be described, using FIGS. 2A and 2B .
  • a plurality of encoder scales 46 (hereinafter will be simply referred to as scales 46 ) is placed.
  • the plurality of scales 46 are illustrated in a solid line placed on the upper surface of mask holder 40 , the plurality of scales 46 are actually placed at the lower surface side of mask holder 40 so that the Z position of the lower surface of each of the plurality of scales 46 coincides with the Z position of the lower surface (pattern surface) of mask M, as is shown in FIG. 1 .
  • each of the plurality of scales 46 is substantially identical, except for the point that the scales are arranged symmetrically in the vertical direction of the page surface on the +Y side and the ⁇ Y side of mask M.
  • Scale 46 consists of a plate-shaped (strip-shaped) member rectangular in a planar view extending in the X-axis direction, made of quartz glass.
  • Mask holder 40 is formed of ceramics, and the plurality of scales 46 is fixed to mask holder 40 .
  • an X scale 47 x is formed on the lower surface (a surface facing the ⁇ Z side in the embodiment) of scale 46 at an area on one side in the width direction (the ⁇ Y side in FIG. 2B ). Also, on the lower surface of scale 46 at an area on the other side in the width direction (the +Y side in FIG. 2B ), a Y scale 47 y is formed.
  • X scale 47 x is structured by a reflective diffraction grating (an X grating) having a plurality of grid lines (one-dimensional gratings) extending in the Y-axis direction formed at a predetermined pitch in the X-axis direction (the X-axis direction serving as a periodic direction).
  • Y scale 47 y is structured by a reflective diffraction grating (a Y grating) having a plurality of grid lines (one-dimensional gratings) extending in the X-axis direction formed at a predetermined pitch in the Y-axis direction (the Y-axis direction serving as a periodic direction).
  • the plurality of grid lines is formed at a spacing of 10 nm or less. Note that in FIGS. 2A and 2B , for convenience of illustration, the spacing (pitch) between the grids is shown much wider than the actual spacing. The same applies to other drawings as well.
  • a pair of encoder bases 43 is fixed on the upper surface of upper mount section 18 a .
  • the pair of encoder bases 43 is placed so that one of the pair is at the ⁇ X side of mask guide 42 on the +X side, and the other is at the +X side of mask guide 42 on the ⁇ X side (that is, placed in the area between the pair of mask guides 42 ).
  • a part of projection optical system 16 described above is arranged in between the pair of encoder bases 43 .
  • Encoder base 43 as is shown in FIG. 2A , consists of a member extending in the X-axis direction.
  • Encoder head unit 44 (hereinafter simply referred to as head unit 44 ) is fixed in the center in the longitudinal direction to each of the pair of encoder bases 43 . That is, head unit 44 is fixed to apparatus main section 18 (refer to FIG. 1 ), via encoder base 43 . Since the pair of head units 44 is substantially identical, except for the point that the head units are arranged symmetrically in the vertical direction of the page surface on the +Y side and the ⁇ Y side of mask M, the description below is on only one of the head units (on the ⁇ Y side).
  • head unit 44 has a unit base 45 consisting of a plate-shaped member having a rectangular shape in a planar view. Fixed to unit base 45 are a pair of X heads 49 x arranged separately to each other in the X-axis direction and a pair of Y heads 49 y arranged separately to each other in the X-axis direction. That is, mask encoder system 48 has a total of four X heads 49 x , as well as a total of four Y heads 49 y . Note that in FIG.
  • the pair of X heads 49 x and the pair of Y heads 49 y may each be arranged independently. Also, in FIG. 2B , to facilitate understanding, while the pair of X heads 49 x and the pair of Y heads 49 y are illustrated to be arranged above (the +Z side of) scale 46 , the pair of X heads 49 x is actually arranged below X scale 47 y and the pair of Y heads 49 y is actually arranged below Y scale 47 y (refer to FIG. 1 ).
  • unit base 45 itself is also formed of a material whose coefficient of thermal expansion is lower than scale 46 (or is about the same as scale 46 ), so that the distance between the pair of X heads 49 x and the distance between the pair of Y heads 49 y do not change due to temperature change or the like.
  • X head 49 x and Y head 49 y are encoder heads of a so-called diffraction interference method as is disclosed in, for example, U.S. Patent Application Publication No. 2008/0094592 that irradiate corresponding scales (X scale 47 x , Y scale 47 y ) with measurement beams, and by receiving the beams from the scales, supply displacement amount information of mask holder 40 (namely mask M; refer to FIG. 2A ) to main controller 90 (refer to FIG. 7 ).
  • mask encoder system 48 four X heads 49 x and X scale 47 x (differs depending on the X position of mask holder 40 ) facing the X heads 49 x structure four X linear encoders 92 x (not shown in FIG. 2B , refer to FIG. 7 ) for obtaining position information of mask M in the X-axis direction, and four Y heads 49 y and Y scale 47 y (differs depending on the X position of mask holder 40 ) facing the Y heads 49 y structure four Y linear encoders 92 y (not shown in FIG. 2B , refer to FIG. 7 ) for obtaining position information of mask M in the Y-axis direction.
  • Main controller 90 obtains position information of mask holder 40 (refer to FIG. 2A ) in the X-axis direction and the Y-axis direction, based on an output of four X linear encoders 92 x and four Y linear encoders 92 y , at a resolution of, for example, 10 nm or less. Also, main controller 90 obtains ⁇ z position information (rotation amount information) of mask holder 40 , based on an output of at least two of the four X linear encoders 92 x (or four Y linear encoders 92 y ). Main controller 90 controls the position in the XY plane of mask holder 40 using mask drive system 91 , based on position information within the XY plane of mask holder 40 obtained from measurement values of mask encoder system 48 described above.
  • the spacing between each of the pair of X heads 49 x and the pair of Y heads 49 y that one head unit 44 has is set larger than scales 46 adjacent to each other.
  • mask encoder system 48 can supply position information of mask holder 40 (refer to FIG. 2A ) to main controller 90 (refer to FIG. 7 ) without the position information being cut off.
  • mask encoder system 48 goes through; a first state (the state shown in FIG. 2B ) in which the pair of heads 49 x both face X scale 47 x on the +X side of the adjacent pair of X scales 47 x , a second state in which X head 49 x on the ⁇ X side faces an area between the above adjacent pair of X scales 47 x (facing neither of the X scales 47 x ) and X head 49 x on the +X side faces X scale 47 x on the +X side, a third state in which X head 49 x on the ⁇ X side faces X scale 47 x on the ⁇ X side and X head 49 x on the +X side faces X scale 47 x on the +X side, a fourth state in which X head 49 x on the ⁇ X side faces X scale 47 x on the ⁇ X side and X head 49 x
  • Main controller 90 in the first state, the third state, and the fifth state described above, obtains X position information of mask holder 40 , based on an average value of the output of the pair of X heads 49 x . Also, main controller 90 , in the second state described above, obtains X position information of mask holder 40 , based on only the output of X head 49 x on the +X side, and in the fourth state described above, obtains X position information of mask holder 40 , based on only the output of X head 49 on the ⁇ X side. Accordingly, measurement values of mask encoder system 48 are not cut off.
  • a linkage process is performed on the output of the heads when the state moves between the first, the third and the fifth states described above, namely the state in which both heads of the pair face the scale and the output is supplied from each of the heads of the pair, and the second and the fourth states, namely the state in which only one of the heads of the pair faces the scale and the output is supplied from only one of the heads of the pair.
  • the linkage process of the heads will be described below, using FIGS. 16A to 16E . Note that to simplify the description, in FIGS. 16A to 16E , a two-dimensional grating (grating) is to be formed on scale 46 .
  • each of the heads 49 X and 49 Y are to be ideal values. Also, in the description below, while the linkage process of the pair of X heads 49 X that are adjacent (to be referred to as 49 X 1 and 49 X 2 for convenience) will be described, a similar linkage process is performed also on the pair of Y heads 49 Y that are adjacent (to be referred to as 49 Y 1 and 49 Y 2 for convenience).
  • each of the pair of X heads 49 X 1 and 49 X 2 obtain X position information of mask holder 40 (refer to FIG. 2A ) using, of the pair of scales 46 that are adjacent (referred to as 46 1 and 46 2 for convenience), scale 46 2 on the +X side, the pair of X heads 49 X 1 and 49 X 2 both output X coordinate information.
  • the outputs of the pair of X heads 49 X 1 and 49 X 2 become the same value.
  • the output of X head 49 X 1 moves outside the measurement range of scale 46 2 when mask holder 40 is moved in the +X direction as is shown in FIG. 16B , the output of X head 49 X 1 is invalidated before X head 49 X 1 moves outside the measurement range. Accordingly, the X position information of mask holder 40 is obtained based only on the output of X head 49 X 2 .
  • X head 49 X 1 faces scale 46 1 on the ⁇ X side. While X head 49 X 1 outputs the X position information of mask holder 40 immediately after measurement becomes possible using scale 46 1 , because counting is resumed from an undefined value (or zero) for the output of X head 49 X 1 , the output cannot be used for calculating the X position information of mask holder 40 . Accordingly, in this state, linkage process of each of the outputs of the pair of X heads 49 X 1 and 49 X 2 becomes required.
  • a process is performed to correct the output of X head 49 X 1 regarded as an undefined value (or zero) using the output of X head 49 X 2 (so that the output becomes the same value as that of X head 49 X 2 ).
  • the linkage process is completed before mask holder 40 further moves in the +X direction and X head 49 X 2 moves outside the measurement range of scale 46 2 , as is shown in FIG. 16D .
  • the output of X head 49 X 2 is invalidated before X head 49 X 2 moves outside the measurement range. Accordingly, the X position information of mask holder 40 (refer to FIG. 2A ) is obtained based only on the output of X head 49 X 1 . Then, the linkage process using the output of X head 49 X 1 is performed with respect to X head 49 X 2 , immediately after mask holder 40 is moved further in the +X direction and measurement becomes possible with each of the pair of X heads 49 X 1 and 49 X 2 using scale 46 1 as is shown in FIG. 16E . Hereinafter, the X position information of mask holder 40 is obtained, based on the outputs of each of the pair of X heads 49 X 1 and 49 X 2 .
  • Substrate encoder system 50 is equipped with a plurality of encoder scales 52 (overlapping in the depth of the page surface in FIG. 1 , refer to FIG. 3A ) arranged at substrate stage device 20 , a plurality of (two, in the embodiment) encoder bases 54 fixed to the lower surface of upper mount section 18 a , a plurality of encoder scales 56 fixed to the lower surfaces of encoder bases 54 , and a plurality of (two for one encoder base 54 , in the embodiment) encoder head units 60 (hereinafter simply referred to as head units 60 ).
  • head units 60 hereinafter simply referred to as head units 60 ).
  • encoder base 54 on the ⁇ X side is hidden in the depth side of the page surface of encoder base 54 on the +X side.
  • the two head units 60 corresponding to encoder base 54 on the ⁇ X side are hidden in the depth side of the page surface of the two head units 60 corresponding to encoder base 54 on the +X side.
  • the plurality of (two) encoder bases 54 is arranged at positions different from each other in the X-axis direction.
  • the two encoder bases 54 are arranged separately in the X-axis direction.
  • the two encoder bases 54 are arranged separately.
  • each of the encoder bases 54 is preferably arranged at a position near the projection center (the center of the entire illumination light emitted from the first lens module and the second lens module) of projection optical system 16 to reduce Abbe error of the encoder system consisting of scale 56 provided on each of the encoder bases 54 and head unit 60 for measuring the scales.
  • FIG. 3A when the two encoder bases 52 are moved approaching each other in the X-axis direction toward the center of the projection area of projection optical system 16 in FIG.
  • one of the encoder base 54 is arranged at a position partly overlapping (in the X-axis direction) the emitting area of illumination light from the first lens module, and the other of the encoder base 54 is arranged at a position partly overlapping (in the X-axis direction) the emitting area of illumination light from the second lens module.
  • the encoder bases 54 will be in a state in contact with each other in the X-axis direction.
  • scales 52 in substrate stage device 20 of the embodiment, in each of the areas on the +Y side and on the ⁇ Y side of substrate P, four encoder scales 52 (hereinafter simply referred to as scales 52 ) are arranged at a predetermined spacing in the X-axis direction. That is, substrate stage device 20 has a total of eight scales 52 .
  • Each of the plurality of scales 52 is substantially identical, except for the point that the scales are arranged symmetrically in the vertical direction of the page surface on the +Y side and the ⁇ Y side of substrate P.
  • Scale 52 similarly to scale 46 (each refer to FIG. 2A ) of mask encoder system 48 described above, consists of a rectangular plate-shaped (strip-shaped) member in a planar view extending in the X-axis direction, made of quartz glass.
  • the position arranged of the plurality of scales 52 is not limited to this, and for example, may be arranged separately (however, moving integrally with substrate holder 34 in directions of six degrees of freedom) on the outer side of substrate holder 34 in a state with a predetermined gap between substrate holder 34 .
  • X scales 53 x are formed on one side (the ⁇ Y side in FIG. 3B ) of the width direction in areas on the upper surface of scales 52 .
  • Y scales 53 y are formed on the other side (the +Y side in FIG. 3B ) of the width direction in areas on the upper surface of scales 52 . Since the structure of X scales 53 x and Y scales 53 y is the same as X scales 47 x and Y scales 47 y (each refer to FIG. 2B ) formed on scales 46 (each refer to FIG. 2A ) of mask encoder system 48 described above, the description thereabout will be omitted.
  • the two encoder bases 54 (and the corresponding two head units 60 ) are arranged separately in the X-axis direction. Since the structure of the two encoder bases 54 is substantially the same except for the point that the arrangement is different, in the description below, one of the encoder base 54 and the pair of head units 60 corresponding to encoder base 54 will be described.
  • Encoder base 54 is equipped with a first section 54 a , which consists of a plate-like member extending in the Y-axis direction fixed to the lower surface of upper mount section 18 a , and a second section 54 b , which consists of a member having a U-shaped XZ section extending in the Y-axis direction fixed to the lower surface of the first section 54 a , and as a whole, is formed in a cylindrical shape extending in the Y-axis direction.
  • a first section 54 a which consists of a plate-like member extending in the Y-axis direction fixed to the lower surface of upper mount section 18 a
  • a second section 54 b which consists of a member having a U-shaped XZ section extending in the Y-axis direction fixed to the lower surface of the first section 54 a , and as a whole, is formed in a cylindrical shape extending in the Y-axis direction.
  • encoder bases 54 and projection optical system 16 are arranged mechanically separate (in a non-contact state). Note that encoder bases 54 may also be arranged separately on the +Y side and the ⁇ Y side of projection optical system 16 .
  • a pair of Y linear guides 63 a is fixed, as is shown in FIG. 5 .
  • Each of the pair of Y linear guides 63 a consists of a member extending in the Y-axis direction, and is placed parallel to each other at a predetermined spacing in the X-axis direction.
  • scales 56 To the lower surface of encoder base 54 , a plurality of encoder scales 56 (hereinafter simply referred to as scales 56 ) are fixed.
  • scales 56 are placed, as shown in FIG. 1 , with two scales in the area further to the +Y side than projection optical system 16 , and two scales in the area further to the ⁇ Y side of projection optical system 16 , and with the scales arranged separately in the Y-axis direction. That is, four scales 56 are fixed to encoder base 54 in total.
  • Scales 56 consisting of plate-like (strip-shaped) members with a rectangular-shape in a planar view extending in the Y-axis direction, are made of quartz glass, similarly to scales 52 arranged on substrate stage device 20 . Note that to facilitate understanding, although FIG. 3A illustrates the plurality of scales 56 in a solid line placed on the upper surface of encoder base 54 , the plurality of scales 56 is actually placed at the lower surface side of encoder base 54 , as is illustrated in FIG. 1 .
  • X scales 57 x are formed in areas on one side (the +X side in FIG. 3C ) in the width direction at the lower surface of scales 56 .
  • Y scales 57 y are formed in areas on the other side (the ⁇ X side in FIG. 3C ) in the width direction at the lower surface of scales 56 . Since the structure of X scales 57 x and Y scales 57 y is the same as X scales 47 x and Y scales 47 y (each refer to FIG. 2B ) formed on scales 46 (each refer to FIG. 2A ) of mask encoder system 48 described above, the description thereabout will be omitted.
  • the two head units 60 are arranged apart in the Y-axis direction below encoder base 54 . Since each of the two head units 60 is substantially the same except for the point that the units are placed symmetrically in the lateral direction of the page surface in FIG. 1 , hereinafter only one of the units (at the ⁇ Y side) will be described.
  • Head unit 60 as it can be seen from FIG. 4 , is equipped with Y slide table 62 , a pair of X heads 64 x , a pair of Y heads 64 y (not shown in FIG. 4 because of being hidden behind the pair of X heads 64 x in the depth of the page surface, refer to FIG.
  • a pair of X heads 66 x (one of the X heads 66 x is not shown in FIG. 4 , refer to FIG. 3B ), a pair of Y heads 66 y (one of the Y heads 66 y is not shown in FIG. 4 , refer to FIG. 3B ), and a belt driver 68 for moving Y slide table 62 in the Y-axis direction.
  • Y slide table 62 and belt driver 68 are provided at the lower surface of upper mount section 18 a of apparatus main section 18 (refer to FIG. 4 ), Y slide table 62 and belt driver 68 may be provided at middle mount section 18 c.
  • Y slide table 62 which consists of a plate-like member having a rectangular-shape in a planar view, is placed below encoder base 54 via a predetermined clearance with respect to encoder base 54 . Also, the Z position of Y slide table 62 is set to be on the +Z side than that of substrate holder 34 which substrate stage device 20 has (each refer to FIG. 1 ), regardless of the Z tilt position of substrate holder 34 .
  • a plurality of Y slide members 63 b (two (refer to FIG. 4 ) with respect to one Y linear guide 63 a ) is fixed that engages with the above Y linear guide 63 a in a freely slidable manner in the Y-axis direction via a rolling body not shown (for example, a plurality of balls of a circulation type).
  • Y linear guide 63 a and Y slide member 63 b corresponding to Y linear guide 63 a structure a mechanical Y linear guide device 63 , as is disclosed in, for example, U.S. Pat. No. 6,761,482, and Y slide table 62 is guided straightforward in the Y-axis direction with respect to encoder base 54 , via the pair of Y linear guide devices 63 .
  • Belt driver 68 is equipped with a rotary driver 68 a , a pulley 68 b , and a belt 68 c .
  • belt driver 68 can be arranged independently for driving slide table 62 at the ⁇ Y side and for driving slide table 62 at the +Y side (not shown in FIG. 4 , refer to FIG. 3A ), or the pair of Y slide tables 62 may be moved integrally by a single belt driver 68 .
  • Rotary driver 68 a which is fixed to encoder base 54 , is equipped with a rotary motor (not shown). The number of rotation and the rotation direction of the rotary motor are controlled by main controller 90 (refer to FIG. 7 ).
  • Pulley 68 b is rotationally driven around an axis parallel to the X-axis by rotary driver 68 a .
  • belt driver 68 has another pulley which is arranged separately in the Y-axis direction with respect to pulley 68 b described above and is attached to encoder base 54 in a state freely rotatable around the axis parallel to the X-axis.
  • Belt 68 c has one end and the other end connected to Y slide table 62 , along with having two places at the mid portion in the longitudinal direction of the belt wound around the above pulley 68 b and the another pulley (not shown), in a state where a predetermined tension is given to the pulleys.
  • a part of belt 68 c is inserted into encoder base 54 , for example, to suppress adhesion and the like of dust from belt 68 c on scales 52 and 56 .
  • Y slide table 62 is pulled by belt 68 c and moves back and forthwith predetermined strokes in the Y-axis direction, by pulley 68 b being rotationally driven.
  • Main controller 90 (refer to FIG. 7 ) synchronously drives, as appropriate, one of the head units 60 (the +Y side) below two scales 56 arranged further to the +Y side than projection optical system 16 , and the other of the head units 60 (the ⁇ Y side) below two scales 56 placed further to the ⁇ Y side than projection optical system 16 , with predetermined strokes in the Y-axis direction.
  • belt driver 68 including toothed pulley 68 b and toothed belt 68 c is used as an actuator for moving Y slide table 62
  • the present embodiment is not limited to this, and a friction wheel device including a pulley without teeth and a belt may also be used.
  • the flexible member that pulls Y slide table 62 is not limited to a belt, and may also be members such as a rope, a wire, or a chain. Also, the kind of actuator for moving Y slide table 62 is not limited to belt driver 68 , and may be other drivers such as a linear motor or a feed screw device.
  • Y slide table 62 itself is formed of a material having a thermal expansion coefficient lower than scales 52 and 56 (or equal to scales 52 and 56 ), so that the distance does not change between the heads of each pair; the pair of Y heads 64 y , the pair of X heads 64 x , the pair of Y heads 66 y , and the pair of X heads 66 x due to, for example, temperature change.
  • Substrate encoder system 50 supplies information on displacement quantity of Y slide table 62 (not shown in FIG. 6 ; refer to FIGS. 4 and 5 ) to main controller 90 (refer to FIG. 7 ) by receiving beams from the scales corresponding to the above X heads 64 x and Y heads 64 y.
  • X heads 64 x and X scales 57 x (differ according to the Y position of Y slide table 62 ) facing the X heads 64 x structure eight X linear encoders 96 x (not shown in FIG. 6 ; refer to FIG. 7 ) used for acquiring position information in the Y-axis direction of each of the four Y slide tables 62 (that is, four head units 60 (refer to FIG.
  • Y heads 64 y and Y scales 57 y (differ according to the Y position of Y slide table 62 ) facing the Y heads 64 y structure eight Y linear encoders 96 y (not shown in FIG. 6 ; refer to FIG. 7 ) used for acquiring position information in the Y-axis direction of each of the four Y slide tables 62 .
  • Main controller 90 obtains position information in the X-axis direction and the Y-axis direction of each of the four head units 60 (refer to FIG. 1 ) at a resolution of, for example, 10 nm or less, based on the output of the eight X linear encoders 96 x and eight Y linear encoders 96 y , as is shown in FIG. 7 . Also, main controller 90 obtains ⁇ z position information (rotation quantity information) of head unit 60 , based on outputs of two X linear encoders 96 x (or two Y linear encoders 96 y ) corresponding to one head unit 60 . Main controller 90 controls the position of head unit 60 within the XY plane using belt driver 68 , based on the position information of each of the four head units 60 within the XY plane.
  • two scales 56 are placed at a predetermined spacing in the Y-axis direction in areas at the +Y side and ⁇ Y side of projection optical system 16 , as is described above.
  • the spacing between each of the heads of the pair of X heads 64 x and each of the heads of the pair of Y heads 64 y that one head unit 60 has is set wider than the spacing between the adjacent scales 56 , as shown in FIG. 3C .
  • Substrate encoder system 50 therefore, is able to obtain position information of Y slide table 62 (head unit 60 ) without interrupting the measurement values. Accordingly, linkage process (refer to FIGS. 16A to 16E ) of the output of the heads similar to that of the output of the heads of mask encoder system 48 described above is also performed here.
  • Substrate encoder system 50 supplies information on displacement quantity of substrate holder 34 (not shown in FIG. 6 ; refer to FIG. 1 ) to main controller 90 (refer to FIG. 7 ), by receiving beams from the scales corresponding to the above X heads 66 x and Y heads 66 y.
  • substrate encoder system 50 eight (2 ⁇ 4) X heads 66 x and X scales 53 x (different depending on the X position of substrate holder 34 ) facing X heads 66 x structure eight X linear encoders 94 x (not shown in FIG. 6 ; refer to FIG. 7 ) for obtaining positional information of substrate P in the X-axis direction, and eight (2 ⁇ 4) Y heads 66 y and Y scale 53 y (different depending on the X position of substrate holder 34 ) facing Y heads 66 y structure eight Y linear encoders 94 y (not shown in FIG. 6 ; refer to FIG. 7 ) for obtaining position information of substrate P in the Y-axis direction.
  • Main controller 90 obtains position information of substrate holder 34 (refer to FIG. 1 ) in the X-axis direction and the Y-axis direction with respect to apparatus main section 18 (refer to FIG. 1 ) at a resolution of, for example, 10 nm or less, based on the outputs of the eight X linear encoders 94 x and the eight Y linear encoders 94 y , and the outputs of the eight X linear encoders 96 x and the eight Y linear encoders 96 y (that is, the position information of the four head units 60 in the XY plane).
  • main controller 90 obtains position information in the X-axis direction of substrate P mounted on substrate holder 34 , based on the output of X linear encoder 94 x for measuring the position of the substrate holder in the X direction when substrate holder 34 moves in the X direction and the output of X linear encoder 96 x for measuring the position of head unit 60 in the X direction. Also, main controller 90 obtains position information in the Y-axis direction of substrate P mounted on substrate holder 34 , based on the output of Y linear encoder 94 y and the output of Y linear encoder 96 y for measuring the Y direction position of head unit 60 moved in the Y direction synchronously with the movement of substrate holder 34 in the Y direction.
  • main controller 90 obtains ⁇ z position information (rotation quantity information) of substrate holder 34 , based on at least two outputs of the eight X linear encoders 94 x (or eight Y linear encoders 94 y ).
  • Main controller 90 controls the position of substrate holder 34 within the XY plane using substrate drive system 93 , based on position information of substrate holder 34 within the XY plane acquired from the measurement values of the above substrate encoder system 50 .
  • scales 52 are arranged which are placed at a predetermined spacing in the X-axis direction in each of the areas at the +Y side and the ⁇ Y side of substrate P as is described above.
  • the spacing between each head of the pair of X heads 66 x and each head of the pair of Y heads 66 y that one head unit 60 has is set wider than the spacing between the adjacent scales 52 , as shown in FIG. 3B .
  • substrate encoder system 50 is able to obtain position information of substrate holder 34 (refer to FIG. 3A ) without interrupting the measurement values. Accordingly, linkage process (refer to FIGS. 16A to 16E ) of the output of the heads similar to that of the output of the heads of mask encoder system 48 described above is also performed here.
  • spacing between each of the heads and spacing between each of the scales are set so that at least three heads constantly face either of the scales. This allows a state to be maintained in which position information in directions of three degrees of freedom (X, Y, ⁇ z) within the horizontal plane of substrate holder 34 can be obtained constantly during the exposure operation.
  • a dust-proof cover 55 consists of a member extending in the Y-axis direction that has a U-shape XZ section, and a second section 54 b of encoder base 54 and Y slide table 62 are inserted, via a predetermined clearance, in between a pair of opposing surfaces.
  • openings are formed through which X heads 66 x and Y head 66 y pass. This suppresses adhesion of dust generated from parts such as Y linear guide device 63 and belt 68 c on scales 52 .
  • a pair of dust-proof plates 55 a (not shown in FIG. 4 ) is fixed to the lower surface of encoder base 54 .
  • Scales 56 are placed between the pair of dust-proof plates 55 a , which suppress adhesion of dust generated from parts such as Y linear guide device 63 on scales 56 .
  • FIG. 7 is a block diagram showing an input/output relation of main controller 90 , which mainly structures a control system of liquid crystal exposure apparatus 10 (refer to FIG. 1 ) and has overall control over each section.
  • Main controller 90 which includes a work station (or a microcomputer) or the like, has overall control over each section of liquid crystal exposure apparatus 10 .
  • liquid crystal exposure apparatus 10 (refer to FIG. 1 ) having the structure described above, under the control of main controller 90 (refer to FIG. 7 ), a mask loader not shown performs loading of mask M onto mask stage device 14 , and a substrate loader not shown performs loading of substrate P onto substrate stage device 20 (substrate holder 34 ).
  • Main controller 90 then executes alignment measurement (detection of a plurality of alignment marks on substrate P) using an alignment detection system not shown, and then, when the alignment measurement has been completed, sequentially performs an exposure operation of a step-and-scan method on a plurality of shot areas set on substrate P.
  • FIGS. 8A to 15B an example of an operation of mask stage device 14 and substrate stage device 20 at the time of exposure operation will be described, using FIGS. 8A to 15B . Note that, in the description below, while the case of setting four shot areas on one substrate P (in the case of four pieces) will be described, the number and placement of the shot areas set on one substrate P can be appropriately changed.
  • FIG. 8A shows mask stage device 14 which has completed alignment operation
  • FIG. 8B shows substrate stage device 20 (members other than substrate holder 34 are not shown. The same applies to the description below) which has completed alignment operation.
  • Exposure processing is performed from a first shot area S 1 which is set at the ⁇ Y side and also the +X side of substrate P, as shown in FIG. 8B .
  • positioning of mask M is performed based on the output of mask encoder system 48 (refer to FIG. 7 ), so that the edge at the +X side of mask M is positioned slightly to the ⁇ X side than the illumination area (in the state shown in FIG. 8A , however, illumination light IL is not irradiated yet on mask M) of illumination light IL irradiated from illumination system 12 (refer to FIG. 1 for each section), as shown in FIG. 8A .
  • the edge at the +X side of mask M is placed to the ⁇ X side with respect to the illumination area, only by an entrance length necessary to perform scanning exposure at a predetermined speed (that is, acceleration distance necessary to reach the predetermined speed), and at the position, scales 46 are arranged so that the position of mask M can be measured with mask encoder system 48 .
  • Main controller 90 (refer to FIG. 7 ) also performs position control of mask holder 40 within a range in which at least three heads (three heads of four heads 49 x and four heads 49 y ) do not move off (do not move outside the measurement range) of scales 46 .
  • substrate stage device 20 positioning of substrate P is performed based on the output of substrate encoder system 50 (refer to FIG. 8 ), so that the edge at the +X side of the first shot area S 1 is positioned slightly to the ⁇ X side than the exposure area (in the state shown in FIG. 8B , however, illumination light IL is not irradiated yet on substrate P) on which illumination light IL (refer to FIG. 1 ) from projection optical system 16 is irradiated, as shown in FIG. 8B .
  • the edge at the +X side of the first shot area S 1 of substrate P is placed to the ⁇ X side with respect to the exposure area, only by an entrance length necessary to perform scanning exposure at a predetermined speed (that is, acceleration distance necessary to reach the predetermined speed), and at the position, scales 52 are arranged so that the position of substrate P can be measured with substrate encoder system 50 .
  • Main controller 90 (refer to FIG. 7 ) also performs position control of substrate holder 34 within a range in which at least three heads (three heads of eight heads 66 x and eight heads 66 y ) do not move off (do not move outside the measurement range) of scales 52 .
  • scales 46 and 52 are arranged similarly so that mask encoder system 48 and substrate encoder system 50 can measure the position of mask M and substrate P, respectively, until mask M and substrate P has finished moving further by a deceleration distance necessary for deceleration to a predetermined speed from the speed at the time of scanning exposure.
  • the position of mask M and substrate P may each be measured by measurement systems different from mask encoder system 48 and substrate encoder system 50 , during at least one of the operations of acceleration and deceleration.
  • mask holder 40 is moved in the +X direction (acceleration, constant speed drive, and deceleration) as shown in FIG. 9A , and synchronously with mask holder 40 , substrate holder 34 is moved in the +X direction (acceleration, constant speed drive, and deceleration) as shown in FIG. 9B .
  • main controller 90 (refer to FIG. 7 ) performs position control of mask M based on the output of mask encoder system 48 (refer to FIG. 7 ) as well as perform position control of substrate P based on the output of substrate encoder system 50 (refer to FIG. 7 ).
  • the four head units 60 are to be in a stationary state.
  • illumination light IL (refer to FIG. 1 for each part) that has passed through mask M and projection optical system 16 is irradiated on substrate P, and by this operation, the mask pattern that mask M has is transferred to shot area S 1 .
  • substrate holder 34 is moved (Y stepped) based on the output of substrate encoder system 50 (refer to FIG. 7 ) in the ⁇ Y direction by a predetermined distance (a distance almost half of the dimension in the width direction of substrate P), for exposure operation of a second shot area S 2 set at the +Y side of the first shot area S 1 , as shown in FIG. 10B .
  • mask holder 40 is stationary in a state where the edge of mask M at the ⁇ X side is positioned slightly to the +X side than the illumination area (in the state shown in FIG. 10A , however, mask M is not illuminated), as shown in FIG. 10A .
  • main controller 90 moves the four head units 60 in the Y-axis direction via the corresponding belt driver 68 (refer to FIG. 7 ) based on the output of Y linear encoder 94 y and the output of Y linear encoder 96 y (refer to FIG. 7 ) of substrate encoder system 50 (refer to FIG. 7 ), to move substrate holder 34 in the Y-axis direction to a target position via substrate drive system 93 (refer to FIG.
  • main controller 90 moves the four head units 60 synchronously with substrate holder 34 (so that the four head units 60 follow substrate holder 34 , namely, follow the movement of substrate P mounted on substrate holder 34 in the Y-axis direction (stepping direction)). Also, main controller 90 (refer to FIG.
  • each of the measurement beams irradiated from X heads 66 x and Y heads 66 y does not move off of X scales 53 x and Y scales 53 y (each refer to FIG. 6 ) regardless of the Y position (including when substrate holder 34 is moving) of substrate holder 34 .
  • the four head units 60 should move synchronously with substrate holder 34 in the Y-axis direction, at a degree in which each of the measurement beams irradiated from X heads 66 x and Y heads 66 y while substrate holder 34 is moved in the Y-axis direction (during the Y stepping operation) does not move away from X scales 53 x and Y scales 53 y , that is, at a degree in which measurement by the measurement beams from X heads 66 x and Y heads 66 y is not interrupted (measurement can be continued).
  • movement of Y slide table 62 (X heads 64 x , 66 x , Y heads 64 y , 66 y ) in the stepping direction may be started prior to substrate holder 34 , before movement of substrate holder 34 in the stepping direction (the Y-axis direction) is started.
  • This allows acceleration of each of the heads to be suppressed, and furthermore, allows tilt (inclining forward in the advancing direction) of each of the heads to be suppressed.
  • movement of Y slide table 62 in the stepping direction may be started later than substrate holder 34 .
  • mask holder 40 is moved in the ⁇ X direction based on the output of mask encoder system 48 (refer to FIG. 7 ), and synchronously with mask holder 40 , as shown in FIG. 11B , substrate holder 34 is moved in the ⁇ X direction based on the output of substrate encoder system 50 (refer to FIG. 7 ).
  • This allows the mask pattern to be transferred onto the second shot area S 2 .
  • the four head units 60 are to be in a stationary state also on this operation.
  • mask stage device 14 positioning of mask M is performed based on the output of mask encoder system 48 (refer to FIG. 7 ), so that mask holder 40 is moved in the +X direction and the edge at the ⁇ X side of mask M is positioned slightly to the +X side than the illumination area, as shown in FIG. 12A . Also, in substrate stage device 20 , positioning of substrate P is performed based on the output of substrate encoder system 50 (refer to FIG.
  • FIGS. 12A and 12B of mask holder 40 and substrate holder 34 At the time of moving operations shown in FIGS. 12A and 12B of mask holder 40 and substrate holder 34 , illumination light IL is not irradiated with respect to mask M (refer to FIG. 12A ) and substrate P (refer to FIG. 12B ) from illumination system 12 (refer to FIG. 1 ). That is, the moving operations shown in FIGS. 12A and 12B of mask holder 40 and substrate holder 34 are simply positioning operations (X stepping operations) of mask M and substrate P.
  • mask stage device 14 When the X stepping operations of mask M and substrate P are completed, in mask stage device 14 , as shown in FIG. 13A , mask holder 40 is moved in the ⁇ X direction based on the output of mask encoder system 48 (refer to FIG. 7 ), and synchronously with mask holder 40 , as shown in FIG. 13B , substrate holder 34 is moved in the ⁇ X direction based on the output of substrate encoder system 50 (refer to FIG. 7 ). This allows the mask pattern to be transferred onto the third shot area S 3 .
  • the four head units 60 are to be in a stationary state also on this operation.
  • substrate holder 34 is moved (Y step drive) in the +Y direction by a predetermined distance for exposure operation of a fourth shot area S 4 set at the ⁇ Y side of the third shot area S 3 , as is shown in FIG. 14B .
  • mask holder 40 is to be in a stationary state (refer to FIG. 14A ).
  • the four head units 60 are also moved in the +Y direction synchronously with substrate holder 34 (so as to follow substrate holder 34 ).
  • mask holder 40 is moved in the +X direction based on the output of mask encoder system 48 (refer to FIG. 7 ), and synchronously with mask holder 40 , as shown in FIG. 15B , substrate holder 34 is moved in the +X direction based on the output of substrate encoder system 50 (refer to FIG. 7 ).
  • This allows the mask pattern to be transferred onto the fourth shot area S 4 .
  • the four head units 60 are to be in a stationary state also on this operation.
  • Y scale 53 y has a plurality of grid lines extending in the X-axis direction. Also, as is shown in FIG. 36 , an irradiation point 66 y (the same code as the Y head is used for convenience) of the measurement beam from Y head 66 y irradiated on Y scale 53 y is elliptic, with the long axis direction being in the Y-axis direction. With Y linear encoder 94 y (refer to FIG.
  • main controller 90 controls position (Y position) in the stepping direction of head unit 60 during the scanning exposure operation described above, so that Y head 66 y that head unit 60 (refer to FIG. 4B ) has does not cross over the plurality of grid lines forming Y scale 53 y , that is, the output from Y head 66 y does not change (the change remains zero), when substrate holder 34 is moved in the scanning direction (the X-axis direction).
  • the Y position of Y head 66 y is measured by a sensor having resolution higher than the pitch between the grid lines that structure Y scale 53 , and just before the irradiation point of the measurement beam from Y head 66 y crosses the grid lines (when the output of Y head 66 y is about to change), the Y position of Y head 66 y is controlled via a head unit drive system 86 (refer to FIG. 6 ).
  • this is not limited, and for example, in the case the output of Y head 66 y changes by the measurement beam from Y head 66 y crossing over the grid lines, by controlling the drive of Y head 66 y according to the change, the change of the output from Y head 66 y may be substantially canceled. In this case the sensor to measure the Y position of Y head 66 y is not required.
  • substrate P is exchanged at a predetermined substrate exchange position.
  • the substrate exchange position in general is set at a position away from the position directly below projection optical system 16 so that projection optical system 16 does not interfere with the substrate exchange, when substrate holder 34 is moved to the substrate exchange position, a possibility occurs in which X head 66 x and Y head 66 y attached to head unit 60 move off of (a state no longer facing) scale 52 on substrate holder 34 , cutting off the output of substrate encoder system 50 .
  • a case may be considered of increasing the size of substrate holder 34 and arranging a longer scale 52 on substrate holder 34 , or providing a scale (or a mark) used at the time of plate exchange at a place away from substrate holder 34 .
  • a sub head used for substrate exchange may be arranged separately to measure a scale (or a mark) provided outside of substrate holder 34 .
  • liquid crystal exposure apparatus 10 because mask encoder system 48 for acquiring the position information of mask M within the XY plane and substrate encoder system 50 for acquiring the position information of substrate P within the XY plane (refer to FIG. 1 for each system) each has a short optical path length of the measurement beams irradiated on the corresponding scales, the influence of air fluctuation can be reduced when compared to conventional interferometer systems. Therefore, the positioning accuracy of mask M and substrate P improves. Also, since the influence of air fluctuation is small, partial air-conditioning unit which is indispensable when using a conventional interferometer system can be omitted, which allows cost reduction.
  • each of the systems including mask holder 40 and the systems including substrate holder 34 becomes smaller and lighter, and the weight balance also is improved, which improves position controllability of mask M and substrate P.
  • places that require adjustment are less than the case using the interferometer system, which allows cost reduction of mask stage device 14 and substrate stage device 14 , and furthermore improves maintainability. Adjustment at the time of assembly also becomes easy (or unnecessary).
  • substrate encoder system 50 since the system employs the structure of obtaining the Y position information of substrate P by moving the four head units 60 synchronously with (making the four head units follow) substrate P in the Y-axis direction, there is no need to place a scale extending in the Y-axis direction or to increase the width in the Y-axis direction of the scale extending in the X-axis direction at the substrate stage device 20 side (or no need to arrange a plurality of heads in the Y-axis direction at the apparatus main section 18 side). This can simplify the structure of the substrate position measurement system, which allows cost reduction.
  • mask encoder system 48 since the system employs the structure of acquiring the position information of mask holder 40 in the XY plane while appropriately switching the output of the pair of adjacent encoder heads (X head 49 x , Y head 49 y ) according to the X position of mask holder 40 , the position information of mask holder 40 can be acquired without interruption, even if a plurality of scales 46 are arranged at a predetermined spacing (spaced apart from one another) in the X-axis direction.
  • substrate encoder system 950 As in a substrate encoder system 950 according to a comparative example shown in FIG. 17A , since substrate encoder system 50 according to the embodiment shown in FIG. 17B is equipped with a plurality of (two) encoder units (an encoder unit consisting of encoder base 54 A and head units 60 A and 60 B, and an encoder unit consisting of encoder base 54 B and head units 60 C and 60 D) compared to the case when one encoder base (accordingly, two encoder heads 60 ) 54 is provided, the number of scales or the total length of the scales on substrate holder 34 can be reduced.
  • an encoder unit consisting of encoder base 54 A and head units 60 A and 60 B an encoder unit consisting of encoder base 54 B and head units 60 C and 60 D
  • the two encoder units can be used while switching between the two encoder units according to the movement of substrate holder 34 in the X-axis direction, even if the length of scales 52 is short as a whole.
  • the encoder unit consisting of encoder base 54 A and head units 60 A and 60 B
  • scale 52 has to be arranged at a measurement position of head unit 60 A (directly below head unit 60 A) to measure the position (X and Y positions) of substrate holder 34 in the state shown in FIG.
  • the length of scales 52 can be shortened as a whole as is illustrated. Note that to shorten the length of scales 52 as a whole as is illustrated (reduce the number of scales 52 ), allows substrate stage device 20 (refer to FIG. 1 ) to be smaller and lighter.
  • FIGS. 18A and 18B a liquid crystal exposure apparatus according to a second embodiment will be described, using FIGS. 18A and 18B . Since the structure of the second embodiment is the same as the above first embodiment except for the point that the structure of substrate encoder system 150 is different, only the different points will be described below, and components having the same structure and function as the above first embodiment will have the same reference signs as the above first embodiment, and the descriptions thereabout will be omitted.
  • substrate encoder system 150 (refer to FIG. 3A ) of the first embodiment described above, on each of the +Y side and the ⁇ Y side of projection optical system 16 , a pair of head units 60 and encoder base 54 were arranged separately in the X-axis direction. Meanwhile, as is shown in FIG. 18A , substrate encoder system 150 according to the second embodiment is different on the point that in each of the +Y side (the upper half in FIG. 18 , hereinafter also referred to as an “upper side”) and the ⁇ Y side (the lower half in FIG.
  • a pair of head units 60 heads units 60 A and 60 B forming a set, or head units 60 C and 60 D forming a set
  • a pair of a row of scales 52 are arranged separately in the Y-axis direction.
  • a plurality of rows of scales including five each of scales 46 arranged by a predetermined spacing (apart) in the X-axis direction are formed in a total of four rows; two rows each ( 52 A and 52 B forming two rows, or 52 C and 52 D forming two rows) separately in the Y-axis direction.
  • a plurality of head units 60 ( 60 A to 60 D) is arranged separately in the Y-axis direction.
  • the pair of head units ( 60 A and 60 B, and 60 C and 60 D) is structured to move in the Y-axis direction synchronously with the movement in the Y-axis direction (Y stepping) of a substrate holder 134 .
  • substrate encoder system 150 As an example, as is shown in FIG. 18B , when substrate holder 134 is moved in the ⁇ Y direction from a state shown in FIG. 18A with respect to projection optical system 16 , head unit 60 D on the ⁇ Y side of the pair of head units 60 C and 60 D on the ⁇ Y side (lower side) moves into a state where head unit 60 D is moved off of scale 56 on an encoder base 154 .
  • head unit 60 A on the +Y side of the pair of head units 60 A and 60 B moves into a state where head unit 60 A is moved off of scale 56 on encoder base 154 . Therefore, when stepping movement of substrate holder 134 in the +Y direction is performed, switching control of the outputs of head unit 60 has to be performed so that measurement not depending on head unit 60 A (measurement in which only head unit 60 B is to be used on the upper side) can be performed, before head unit 60 A moves off of scale 56 on encoder base 154 .
  • the encoder system since the encoder system is equipped with a plurality of (two) head units ( 60 A and 60 B, and 60 C and 60 D) arranged in the Y-axis direction and rows of scales 52 A to 52 B on substrate holder 134 used together with the head units to perform measurement, the number of scales 56 on encoder base 154 can be decreased or the total length can be made shorter, regardless of the position of substrate holder 134 (substrate P) in the Y-axis direction.
  • the movable range (movable range in the Y direction) of head units 60 moved in the Y direction following substrate holder 34 can be made shorter (smaller) than in the case when only one set is prepared on each of the sides.
  • the movable range of head units 60 which is a movable body moved in the Y direction can be shortened, which can keep the movement of the movable body (head units 60 ) minimal and can suppress the movement from affecting an aspect of accuracy.
  • each of the first and second embodiments described above is an example and can be appropriately changed.
  • the number of Y slide tables 62 may be three or more, and to each of the three Y slide tables 62 , a total of eight heads 64 x , 64 y , 66 x , and 66 y may be attached (that is, three or more head units 60 may be arranged at a predetermined spacing in the X-axis direction) similarly to the first embodiment described above.
  • the number of heads 66 x and 66 y attached to Y slide table 62 facing downward at a predetermined spacing in the X-axis direction may be three or more.
  • the pair of Y slide tables 62 since the pair of Y slide tables 62 is moved in the Y-axis direction synchronously, for example, the pair of Y slide tables 62 may be integrated into one Y slide table 62 , and heads 66 x and 66 y facing downward may be arranged in a manner similar to that of the first embodiment described above at Y slide table 62 .
  • the drive system (encoder base 54 ) and measurement system (heads 64 x and 64 y facing upward) of one of the Y slide tables 62 can be omitted.
  • Y slide tables 62 arranged on each of the +Y side and the ⁇ Y side of projection optical system 16 may be connected.
  • scales 46 and 52 are attached to mask holder 48 and substrate holder 34 , respectively, the embodiments are not limited to this, and scales 46 may be formed directly on mask M and scales 52 may be formed directly on substrate P.
  • scales 52 are formed near the edge of shot areas (within the shot area, or in between shot areas), and in substrate P shown in FIG. 19B , adding to the areas near the edge of the shot areas, scales 52 are formed in areas where the pattern is not formed within the shot area.
  • a scale pattern can be formed in advance on mask M along with the device pattern, and the scale pattern can be formed on substrate P simultaneously with the transfer (exposure) operation of the device pattern onto substrate P. Accordingly, in the case of performing exposure operation from the second layer onward, position control of substrate P can be performed directly, using scales 52 formed on substrate P. Similarly, as is shown in FIGS. 19C and 19D , scales 46 may be formed directly on mask M. Also, as for the substrate encoder system, by arranging a plurality of head units 60 corresponding to the plurality of scales 52 formed within the shot area, position measurement of substrate P can be performed with pinpoint accuracy for each shot area subject to exposure, which improves position controllability.
  • a nonlinear component error can be obtained for each shot area using measurement results of the plurality of scales within the shot area, and by performing position control of substrate P at the time of exposure based on the error, overlay exposure accuracy can be improved.
  • the point in which the plurality of head units 60 is moved by predetermined strokes in the Y-axis direction synchronously with the Y stepping operation of substrate P along with moving into a stationary state at the time of scanning exposure operation is the same as each of the embodiments described above.
  • the distance between the pair of encoder heads (namely, each of the pair of X heads 64 x , the pair of X heads 66 x , the pair of Y heads 64 y , and the pair of Y heads 66 y ) that head unit 60 has may be measured by sensors 164 and 166 , and the output of substrate encoder system 50 may be corrected using the measurement values.
  • sensors 164 and 166 While the type of sensors is not limited in particular for sensors 164 and 166 , for example, a laser interferometer or the like can be used.
  • the distance between the pair of encoder heads (namely, the pair of X heads 49 x and the pair of Y heads 49 y ) may be measured, and the output of mask encoder system 48 may be corrected using the measurement values.
  • heads 49 x and 49 y of mask encoder system 48 may be measured, and relative positional relation may be measured for each of the heads (a pair of downward heads 66 x and 66 y , and a pair of upward heads 64 x and 64 y ) that head unit 60 has (a total of eight heads in the embodiment), and the measurement values may be corrected.
  • a calibration operation may be performed in which the distance is measured as appropriate (for example, each time substrate exchange is performed) in the pair of encoder heads (namely, each of the pair of X heads 64 x , the pair of X heads 66 x , the pair of Y heads 64 y , and the pair of Y heads 66 y ) that head unit 60 has.
  • a calibration point may be provided for performing origin setting of each of the outputs of mask encoder system 48 and substrate encoder system 50 .
  • a positioning mark for performing origin setting may be placed on prolonged lines (outer side) of the plurality of scales 46 and 56 , may be placed in between a pair of scales 46 and 52 which are adjacent, or may be formed within scales 46 and 52 .
  • tilt (tilt in the ⁇ x and ⁇ y directions) amount with respect to the horizontal plane of Y slide table 62 to which each of the encoder heads 64 x , 64 y , 66 x , and 66 y is attached may be obtained, and the output of substrate encoder system 50 may be corrected according to the tilt amount (namely, inclined amount of the optical axis of each of the heads 64 x , 64 y , 66 x , and 66 y ).
  • the measurement system as is shown in FIG.
  • a measurement system can be used in which a plurality of Z sensors 64 z is attached to Y slide table 62 and obtains tilt amount of Y slide table 62 with encoder base 54 (or upper mount section 18 a ) serving as a reference.
  • a two-axis laser interferometer 264 may be provided to obtain the tilt amount (tilt amount in the ⁇ x and ⁇ y directions) and rotation amount (rotation amount in the ⁇ z direction) of Y slide table 62 .
  • the tilt amount of each of the heads 64 x , 64 y , 66 x , and 66 y may be measured individually.
  • X positions of X head 66 X 1 on the ⁇ X side and Y head 66 Y 1 on the ⁇ X side may be made to coincide with the X position of an optical system 16 a of a plurality of optical systems structuring projection optical system 16 arranged on the ⁇ X side with respect to an axis OC parallel to the Y-axis passing through the optical center of projection optical system 16 , along with the X positions of X head 66 X 2 on the +X side and Y head 66 Y 2 on the +X side may be made to coincide with the X position of an optical system 16 b of the plurality of optical systems arranged on the +X side with respect to axis OC, that is, spacing between the pair of heads 66 X 1 and 66 X 2 and spacing between the pair of Y heads 66 Y 1 and 66 Y 2 may be made to coincide with the spacing between optical systems 16 a and 16 b .
  • the spacing does not necessarily have to coincide with the spacing between optical systems 16 a and 16 b , and X head 66 X 1 and Y head 66 Y 1 on the ⁇ X side and X head 66 X 2 and Y head 66 Y 2 on the +X side may be arranged at an equal distance (symmetrically with respect to axis OC) with respect to axis OC. Also, in the first embodiment described above, by arranging the pair of head units 60 adjacent in the X-axis direction at an equal distance with respect to axis OC (symmetrically with respect to axis OC), Abbe error can be reduced. In this case as well, of the pair of head units 60 adjacent in the X-axis direction, heads 66 x and 66 y arranged on the inner side are preferably made to coincide with the X position of optical systems 16 a and 16 b.
  • X heads 66 X 1 to 66 X 3 may be attached at a predetermined spacing (a distance longer than the spacing between adjacent scales 52 1 and 52 2 ) in the X-axis direction.
  • X head 66 X 2 and Y head 66 Y 2 in the center are preferably arranged on axis OC.
  • two heads constantly face the scale, which stabilizes position measurement accuracy in the ⁇ z direction.
  • the X position of scales 52 1 and 52 2 on the +Y side and the X position of scales 52 3 and 52 4 on the ⁇ Y side may be shifted from each other so that X head 66 X 3 and Y head 66 Y 3 on the +Y side do not move off of the measurement range simultaneously with X head 66 X 1 and Y head 66 Y 1 (or X head 66 X 2 and Y head 66 Y 2 ) on the ⁇ Y side.
  • one X head 66 x and one Y head 66 y on the +Y side can be omitted.
  • the X position of scales 52 1 and 52 2 on the +Y side and the X position of scales 52 3 and 52 4 on the ⁇ Y side may be mutually shifted, so that X head 66 X 3 and Y head 66 Y 3 on the +Y side do not move off of the measurement range simultaneously with X head 66 X 1 and Y head 66 Y 1 on the ⁇ Y side, and also so that X head 66 X 4 and Y head 66 Y 4 on the +Y side do not move off of the measurement range simultaneously with X head 66 X 2 and Y head 66 Y 2 on the ⁇ Y side.
  • X head 66 X 3 and Y head 66 Y 3 on the +Y side may be arranged on axis OC.
  • the X position of scales 52 1 and 52 2 on the +Y side and the X position of scales 52 3 and 52 4 on the ⁇ Y side should be mutually shifted, so that X head 66 X 2 and Y head 66 Y 2 on the ⁇ Y side do not move off of the measurement range simultaneously.
  • Z drive mechanism may be provided at heads 66 x and 66 y facing downward that face scales 52 (refer to FIG. 1 ) attached to substrate holder 40 .
  • Heads 66 x and 66 y include a movable head 206 which is movable in the Z-axis direction.
  • movable head 206 is preferably moved vertically (e.g., moved following an auto focus operation of substrate P), synchronously with Z-axis/tilt-axis of substrate holder 40 .
  • heads 66 x and 66 y should have an auto focus function and movable head 206 is preferably moved vertically based on outputs of the auto focus function.
  • movable head 206 is preferably moved vertically based on outputs of the auto focus function.
  • an X interferometer 202 fixed to Y slide table 62 and a movable mirror 204 (movable head 206 is fixed to mirror 204 ) which can be moved in the Z-axis direction should be provided, so that deviation can be fed back.
  • a measurement system (relative position measurement system) may be provided that measures relative position between the encoder (mask encoder system 48 ) on the mask stage device 14 side and the encoder on the substrate stage 20 side (substrate encoder system 50 ).
  • FIGS. 25A and 25B show schematic views of the relative position measurement system described above.
  • the system employs a structure of controlling the relative position between the encoder system on the mask stage device 14 side and the encoder system on the substrate stage device 20 side by observing a lens scale (or a reference mark) with a position sensor of the mask encoder system.
  • a lens scale or a reference mark
  • the encoder system on the substrate stage side is moved to measure the scale position (or the reference mark)
  • (S 3 ) according to (S 1 ) and (S 2 ) described above, relative position of mask stage device 14 and substrate stage device 20 is controlled.
  • A the reference mark is observed, along with, B: observing the lens scale (refer to (i) in FIG. 25B ).
  • B observing the lens scale
  • a mark is also arranged and observed on the mask stage side (refer to (ii) in FIG. 25B ).
  • a plate on which a reference mark is formed may be provided in projection optical system 16 , and the mark formed on the plate may be observed.
  • FIGS. 27A and 27B can be employed as the relative position measurement system.
  • lens distance is measured by the position sensor of each of the encoders.
  • the distance between lenses is observed by each of the encoders (lens-mask stage side, and lens-plate stage side). Note that each of the encoders is movable.
  • the structure may be combined with the structures shown in FIGS. 25A to 26 .
  • FIGS. 28A to 28C are views showing details on the aspect shown in FIG. 27A described above
  • FIGS. 29A to 29C are views showing details on the aspect shown in FIG. 27B described above.
  • FIGS. 30 and 31 show other specific examples of a relative position measurement system based on concept described above (refer to FIGS. 25A and 25B ).
  • the aspects shown in FIGS. 30 and 31 are a combination of the two aspects described above.
  • i) after the mark of the lens scale (substrate stage side) is observed ii) difference between the mask stage encoder and the lens scale (substrate stage side) is observed.
  • A the reference mark is observed, along with, B: observing the lens scale (refer to (i) in FIGS. 30 and 31 ).
  • a mark is also arranged and observed on the mask stage side (refer to (ii) in FIGS. 30 and 31 ).
  • liquid crystal exposure apparatus 10 in upper mount section 18 a (optical surface plate) supporting projection optical system 16 , as is shown in FIG. 32 , a plurality of alignment microscopes ALG system (hereinafter simply referred to as “ALG system”) is provided to measure a plurality of alignment marks Mk (hereinafter simply referred to as “mark Mk”) on substrate P.
  • ALG system alignment microscopes ALG system
  • mark Mk alignment marks Mk
  • four shot areas are set (the case of a so-called four-piece setting) on substrate P, mark MK (illuminated much larger than the actual size) is formed near the four corners in each of the four shot areas.
  • a plurality of ALG systems is arranged in the Y-axis direction so that a plurality of marks Mk formed in the Y-axis direction on the substrate can be detected (measured) simultaneously.
  • four ALG systems are lined in the Y direction and are provided fixed to upper mount section 18 a via a base member 354 at a spacing according to the formed spacing of mark Mk, so that a total of four marks Mk formed within two shot areas lined in the Y-axis direction can be measured.
  • Base member 354 is structured in almost the same manner as base member 54 described above, however, as is shown in FIG. 32 , differs on the point that scale 356 (installed length in the Y-axis direction) is structured shorter than scale 56 installed on base member 54 described above.
  • Base member 354 consists of a member extending in the Y-axis direction, and to the lower surface (illustrated in a solid line in FIG. 32 to facilitate understanding), four scales 356 are fixed. Of the four scales 356 , the length in the Y-axis direction of the two scales on the inner side is shorter than that of the scales on the outer side. Note that in FIG.
  • base member 354 is arranged on the ⁇ X side of the pair of encoder bases 54
  • the arrangement position is not limited in particular, and for example, the base member may be arranged on the +X side of the pair of encoder bases 54 , may be arranged on both the +X side and the ⁇ X side of the pair of encoder bases 52 , or may be arranged in between the pair of encoder bases 54 .
  • scales 52 used for measurement in the X-axis direction are provided until the position where ALG systems are installed in X-axis direction, and at the position, head units 60 that irradiate scales 52 with measurement beams are provided. This is to prevent Abbe errors from occurring in position measurement performed by the encoder system (scales 52 and head units 60 ) on alignment measurement, in a relation with the mark detection position of ALG system. Therefore, in FIG. 32 , the arrangement of scales 52 is not like the arrangement (in which the number or the length of scales 52 in the ⁇ X direction side and the +X direction side with projection optical system 16 in the center is almost symmetrical) shown in the first embodiment ( FIG. 3A and FIG. 17B ). In FIG. 32 , as is illustrated, the number of scales 52 provided is larger (or scales 52 is longer as a whole) on one side ( ⁇ X side) of the scanning direction side than on the other side (+X side).
  • Head unit 60 has the same structure as head unit 60 of substrate encoder system 50 described above (refer to FIG. 3A and the like for each part).
  • position information (X position and Y position) of substrate P is obtained in the manner similar to the embodiment described above.
  • detection operation of the plurality of marks Mk on stage substrate P is performed by moving substrate P in the X-axis direction, and appropriately positioning marks Mk directly below alignment microscopes ALG systems.
  • a positional relation between a predetermined position of each ALG system e.g., center of field
  • the center position of each mark Mk is detected for each of the ALG systems.
  • Position information of each mark MK is obtained, based on the detection results of each of the ALG systems and the position information (X position and Y position) of substrate P obtained in the description above.
  • the systems may be structured so that relative positional relation between the plurality of ALG systems is changeable.
  • a part of, or all of the systems is to be arranged movable in the Y direction on the optical surface plate by a drive system such as a motor or a belt, and a sensor (a distance measuring sensor, an interferometer or the like using the TOF (Time-of-Flight) method) that detects relative position change in the Y direction between ALG systems is to be provided at a movable ALG system or a fixed ALG system.
  • a drive system such as a motor or a belt
  • a sensor a distance measuring sensor, an interferometer or the like using the TOF (Time-of-Flight) method
  • mark Mk This allows detection of mark Mk to be performed easily, even in a case of an arbitrary shot arrangement (mark arrangement), such as when performing a so-called six-piece setting (spacing between adjacent marks Mk in the Y-axis direction is smaller than the spacing shown in FIG. 32 ). Also, even in a case shot areas of different areas are included in the plurality of shot areas on one substrate P (a so-called composite setting), namely in the case marks Mk are not arranged regularly on substrate P, this can be coped with easily by controlling relative positional relation in the Y direction of the plurality of ALG systems. Note that position control of the movable ALG system in the Y-axis direction in this case is performed, based on shot map information (design coordinate position information of mark Mk) included in a recipe transmitted to the exposure apparatus by a user.
  • shot map information design coordinate position information of mark Mk
  • Liquid crystal exposure apparatus 10 may have a substrate alignment mark measurement system 450 (hereinafter simply referred to as “ALG measurement system 450 ”) as is shown in FIG. 33 , in addition to substrate encoder system 50 described above.
  • ALG measurement system 450 is a device that detects the plurality of marks Mk formed on substrate P. Note that while FIG. 33 is also described with four shot areas set on substrate P and with marks Mk formed in each of the four corners of the four shot areas similarly to FIG. 32 , the number and arrangement position of marks Mk can be appropriately changed.
  • ALG measurement system 450 has a base member 454 and a pair of movable tables 460 .
  • Base member 454 is substantially the same member as encoder base 54 of substrate encoder system 50 described above (refer to FIG. 1 for each section) except for the point that the number of scales 56 is increased, and is fixed to the lower surface of upper mount section 18 a of apparatus main section 18 (refer to FIG. 1 for each section).
  • Base member 454 consists of a member extending in the Y-axis direction, and to the lower surface (illustrated in a solid line in FIG. 33 to facilitate understanding), more scales 356 (e.g., seven) are fixed than that of base 54 . Note that while FIG.
  • base member 354 is arranged on the ⁇ X side of the pair of encoder bases 54 similarly to FIG. 32 , the arrangement is not limited to this, and the base member may be arranged on the +X side of the pair of encoder bases 54 , may be arranged on both the +X side and the ⁇ X side of the pair of encoder bases 52 , or may be arranged in between the pair of encoder bases 54 .
  • the pair of head units 60 arranged facing base member 454 shown in FIG. 33 is moved in the Y-axis direction synchronously with substrate holder 34 similarly to the embodiment described above, and the structure is also similar to the embodiment described above.
  • FIG. 33 is equipped with a pair of movable tables 460 which is movable relatively at least on the Y direction with respect to the pair of head units 60 .
  • Movable table 460 has a structure the same as head unit 60 of substrate encoder system 50 (refer to FIG. 3A and the like for each section) described above, except for the point that movable table 460 has an alignment microscope (ALG system) including an imaging sensor instead of the four heads facing downward (the pair of X heads 66 x and the pair of Y heads 66 y ; refer to FIG. 6 ). That is, movable table 460 is moved appropriately (integrally or independently) in the Y-axis direction in predetermined strokes below base member 454 by an actuator (not shown).
  • ALG system alignment microscope
  • movable table 460 has four heads facing upward (the pair of X heads 64 x and the pair of Y heads 64 y ; refer to FIG. 6 ). Position information of movable table 460 is obtained with high precision by an encoder system including the four heads facing upward described above and the corresponding scales 56 . Note that while the number of movable tables 460 corresponding to one base member 454 is two in FIG. 33 , the number is not limited in particular, and may be one, or three or more than three. Also, the movable range of movable table 460 may be larger than head unit 60 , and the number of scales 54 should also be changed as appropriate.
  • Detection operation of the plurality of marks Mk on substrate P is performed by moving substrate P in the X-axis direction (control of X and Y positions of substrate holder 34 on this movement is performed based on the output of head unit 60 arranged facing base member 454 ) and appropriately positioning mark Mk directly below (within the visual field of) the ALG system, after positioning the ALG system according to the Y position (as is described above design coordinate position information of mark Mk) of mark Mk.
  • ALG measurement system 450 since movable table 460 , namely the Y position of ALG system can be changed arbitrarily, simultaneous detection of marks Mk can be performed easily, even if the spacing between adjacent marks Mk in the Y-axis direction changes. Accordingly, in the case, for example, spacing between adjacent marks Mk in the Y-axis direction is smaller than the case shown in FIG. 33 , detection of marks Mk can be performed easily. Also, the case of the so-called composite setting can be coped easily, by appropriately controlling the Y position of movable table 360 .
  • the structure of the ALG system above was described based on the first embodiment described above, the structure is not limited to this, and the structure may also be applied to the second embodiment described above. Also, the structure may also be applied to the system shown in FIG. 17A described as a comparative example of the first embodiment described above.
  • X linear encoder 92 x and Y linear encoder 92 y to obtain position information of mask holder 40 may have a structure in which an encoder head is attached to mask holder 40 and a scale is attached to encoder base 43 .
  • X linear encoder 94 x and Y linear encoder 94 y to obtain position information of substrate holder 34 may have an encoder head attached to substrate holder 34 and a scale attached to Y slide table 62 .
  • X linear encoders 96 x and Y linear encoders 96 y for obtaining position information of Y slide table 62 may have the structure in which the scales are attached to Y slide table 62 and the encoder heads attached to encoder base 54 (apparatus main section 18 ).
  • the encoder head attached to encoder base 54 it is favorable for the encoder head attached to encoder base 54 to be a plurality of encoder heads placed along the Y-axis direction that can perform switching operation mutually.
  • the encoder heads are fixed to substrate holder 34 and encoder base 54 , the scales fixed to Y slide table 62 may be shared.
  • substrate encoder system 50 While the case has been described where a plurality of scales 52 extending in the X-axis direction are fixed to the substrate stage device 20 side and a plurality of scales 56 extending in the Y-axis direction are fixed to the apparatus main section 18 side (encoder base 54 ) side, the arrangement is not limited, and a plurality of scales extending in the Y-axis direction may be fixed to the substrate stage device 20 side and a plurality of scales extending in the X-axis direction may be fixed to the apparatus main section 18 side.
  • head units 60 are driven in the X-axis direction synchronously with substrate holder 34 at the time of exposure operation of substrate P.
  • the number of scales is not limited to this, and the number of scales can be appropriately changed, for example, according to the size of mask M, substrate P, or the moving strokes.
  • the plurality of scales do not necessarily have to be placed spaced apart, and for example, a longer single scale may be used (in the case of the above embodiments, for example, a scale having a length around three times as that of scale 46 , a scale having a length around two times as that of scale 52 , and a scale having a length around four times (or five times) as that of scale 56 ).
  • the length of each of the scales may be different. For example, by setting the length extending in the X-axis direction longer than the length in the X-axis direction of the shot area, the linkage process performed at the time of scanning exposure operation can be avoided. The same can be said for the scales extending in the Y-axis direction. Furthermore, to cope with change in the number of shot areas (e.g., in the case of a four-piece setting and the case of a six-piece setting) the length may be different between a scale arranged on one side of projection optical system 16 and the other side of projection optical system 16 .
  • X scales and Y scales are formed independently on the surface of each of the scales 46 , 52 , and 56
  • the scales are not limited to this, and XY two-dimensional scales may also be used.
  • the encoder heads can also use the XY two-dimensional heads.
  • the encoder system of a diffraction interference method the system is not limited to this, and other encoders that employs a so-called pick-up method, or a magnetic encoder can be used, and a so-called scan encoder like the one disclosed in, for example, U.S. Pat. No. 6,639,686 can also be used.
  • position information of Y slide table 62 may be acquired by a measurement system other than the encoder system (e.g., an optical interferometer system).
  • FIG. 34 modified example 1
  • one row of scales 52 is arranged in each of the areas vertical (the +Y side and the ⁇ Y side) to projection optical system 16 on substrate holder 34 .
  • heads 60 that can each move in the Y-axis direction are arranged in a plurality of numbers (two each in FIG. 34 ) in each of the areas vertical (the +Y side and the ⁇ Y side) to projection optical system 16 .
  • FIGS. 34A to 34C show a transition from a state shown in FIG.
  • one of the heads 60 A ( 60 C) of the pair of heads 60 A and 60 B ( 60 C and 60 D) is structured movable only by a range D 1 in the Y-axis direction.
  • the other head 60 B ( 60 D) is structured movable only by a range D 2 in the Y-axis direction.
  • This structure allows the movable range (D 1 +D 2 ) in the Y-axis direction of scale 52 (substrate holder 34 ) to be covered by the pair of heads 60 A and 60 B.
  • head 60 A moves synchronously with scale 52 .
  • the size of encoder base 54 can be reduced (the number of scales 56 reduced) in the Y-axis direction, and the movement range of each of the heads can be shortened.
  • the movable range (D 1 and D 2 ) in the Y-axis direction of the pair of heads 60 A and 60 B is structured continuously, the movable range may be structured in a partly overlapping manner.
  • modified example 2 the same effect can be obtained as the effect of the second embodiment described above even in a structure shown in FIG. 35 (modified example 2) is employed, instead of the structure in the second embodiment ( FIG. 18 ) described above.
  • modified example 1 FIG. 34
  • modified example 2 the difference between modified example 1 ( FIG. 34 ) described above and this modified example 2 is that in modified example 1, while the movable range in the Y-axis direction of movable heads 60 A and 60 B is continuous or overlapping, in modified example 2, a range D 3 exists to which neither of the movable heads 60 A and 60 B can move (are not positioned), and an interferometer 530 is provided which measures the position in the Y-axis direction of scale 52 (substrate holder 34 ). In the description below, the difference will be mainly described.
  • one of the heads 60 A ( 60 C) is structured movable only by a range D 1 in the Y-axis direction.
  • the other head 60 B ( 60 D) is structured movable only by a range D 2 in the Y-axis direction.
  • a range D 3 exists in which both heads 60 A and 60 B cannot follow the movement of scale 52 .
  • This structure allows the movable range (D 1 +D 2 +D 3 ) in the Y-axis direction of scale 52 (substrate holder 34 ) to be covered by the pair of heads 60 A and 60 B and interferometer 530 .
  • the range in which one movable head 60 moves in the Y-axis direction synchronously with the movement of scale 52 shown in the first embodiment ( FIG. 3A ) described above is to be covered shared by two movable heads 60 A and 60 B and interferometer 530 in the structure described in modified example 1.
  • FIG. 35A when scale 52 moves in the range of D 2 in the Y-axis direction, head 60 B moves synchronously with scale 52 .
  • the plurality of heads 60 A to 60 D are of a movable type in modified example 2, by using the interferometer, the plurality of heads may also be of a fixed type.
  • the plurality of heads 60 A to 60 D may be arranged fixed to the optical surface plate at positions in the Y-axis direction decided in advance according to the shot size (shot map).
  • shot map shot size
  • head 60 A may be arranged fixed to the upper edge of range D 1 in FIG. 35
  • head 60 B may be arranged fixed to the lower edge of range D 2 in FIG. 35 (the state in FIG. 35A )
  • the length measurement range of interferometer 530 may almost be the total area of D 1 +D 2 +D 3 .
  • the heads will not have to be of the movable type in this arrangement.
  • X scale grating pattern for X-axis direction measurement shown in the drawings
  • Y scale grating pattern for Y-axis direction measurement shown in the drawings
  • the X scale and the Y scale are provided on members for scales (e.g., a plurality of scale members arranged on the encoder base) which are independent from each other.
  • the plurality of grating patterns may be formed on the same long member for scales separately in groups of grating patterns.
  • the grating patterns may be continuously formed on the same long member for scales.
  • a scale group (a row of scales) in which a plurality of scales is arranged in an extended manner via a gap of a predetermined spacing in the X-axis direction is arranged in a plurality of rows at different positions apart from one another in the Y-axis direction (e.g., a position on one side (+Y side) and a position on the other side ( ⁇ Y side) with respect to projection optical system 16 ), in the plurality of rows, the position of the gap of a predetermined spacing described above may be arranged so that the position of the gap does not overlap in the X-axis direction. If the plurality of rows of scales is arranged in this manner, then the heads arranged corresponding to each of the row of scales do not move off of the measurement range simultaneously (in other words, both heads do not face the gap simultaneously).
  • a structure may be employed in which the plurality of scale groups (the plurality of rows of scales) can be selected and used properly, based on the arrangement of shots on the substrate.
  • the length in the X-axis direction of one scale may be a length in which measurement can be performed continuously only by a length of one shot area (the length in which a device pattern is irradiated and formed on the substrate when scanning exposure is performed while the substrate on the substrate holder is moved in the X-axis direction).
  • connection control of the heads with respect to the plurality of scales will not have to be performed during the scanning exposure of the one shot area, which allows position measurement (position control) of substrate P (substrate holder) during the scanning exposure to be simplified
  • scales with lengths different from one another may be arranged in an extended manner.
  • the length in the X-axis direction of the scales may be made physically longer in the scales arranged in the center than the scales arranged near both edges (scales arranged at each of the edges in the row of scales) in the X-axis direction.
  • the scale group in which a plurality of scales are arranged in an extended manner via a gap of a predetermined spacing in the X-axis direction on substrate holder 34 , distance between the plurality of scales (in other words, length of the gap), length of one scale, and two heads (heads that are arranged facing each other inside one head unit 60 , e.g., two heads 66 x shown in FIG. 6 ) that relatively move with respect to the row of scales are arranged so that a relation of “one scale length>distance between heads arranged facing each other>distance between scales” is satisfied. This relation is satisfied not only by the scales provided on substrate holder 34 and heads 60 corresponding to the scales, but is also satisfied by scales 56 provided on encoder base 54 and heads 60 corresponding to scales 56 .
  • the heads can be shifted and arranged relatively in the X-axis direction.
  • X scale 53 x and Y scale 53 y are formed in the same length in the X-axis direction within scale 52 formed on substrate holder 34 , the length may be made different from each other. Also, both X scale 53 x and Y scale 53 y may be arranged relatively shifted in the X-axis direction.
  • the initial values of the heads that have moved off may be calculated on the movement, using the outputs of the remaining pair of heads ( 66 x and 66 y ) within head 60 separate from the heads that have moved off, and yet another head (a head arranged apart in the X-axis direction as well as at a position whose distance with the head moving away is shorter than the scale length).
  • the another head described above may be a head used for position measurement in the X-axis direction or a head used for position measurement in the Y-axis direction.
  • head 60 is described to move synchronously with substrate holder 34
  • the substrate encoder system may have a scale for substrate exchange provided at substrate stage device 20 or at another stage device to obtain position information of substrate stage device 20 while the substrate stage device is moved to a substrate exchange position of the substrate loader, and a head facing downward (such as X head 66 x ) may be used to obtain the position information of substrate stage device 20 .
  • the position information of substrate stage device 20 may be obtained by providing a head used for substrate exchange at substrate stage device 20 or at another stage device, and measuring scale 56 or a scale used for substrate exchange.
  • the mask encoder system may have a scale for mask exchange provided at mask stage device 14 or at another stage device to obtain position information of mask stage device 14 while the mask stage device is moved to a mask exchange position of the mask loader, and head unit 44 may be used to obtain the position information of mask stage device 14 .
  • a position measurement system other than the encoder system e.g., a mark on a stage and an observation system to observe the mark
  • exchange position control management
  • encoder base 54 having the plurality of scales 56 was structured being directly attached to the lower surface of upper mount section 18 a (optical surface plate), the embodiments are not limited to this, and a predetermined base member may be arranged suspended in a state placed apart from the lower surface of upper mount section 18 a , and encoder base 54 may be attached to the base member.
  • substrate stage device 20 only has to drive at least substrate P along a horizontal plane in long strokes, and in some cases, does not have to perform fine positioning in directions of six degrees of freedom.
  • the substrate encoder system according to each of the embodiments described above can be suitably applied, even to such two-dimensional stage devices.
  • substrate holder 34 was described as having a structure movable in the X-axis direction and the Y-axis direction to move substrate P on substrate holder 34 in the X-axis direction and the Y-axis direction, the structure is not limited to this.
  • substrate holder 34 can be structured so that substrate P is supported in a non-contact manner (e.g., air levitation support).
  • Substrate P is structured to be held by a holding member integrally movable with substrate holder 34 while being supported by levitation by substrate holder 34 , so that substrate P can be moved synchronously moved with the movement of substrate holder 34 .
  • a second substrate drive system is structured separately that relatively moves the holding member with respect to substrate holder 34 while supporting substrate P on substrate holder 34 in a non-contact manner.
  • a structure is employed in which the holding member moves synchronously with substrate holder 34 in one of the axial directions of the X-axis direction and the Y-axis direction, and moves relatively with respect to substrate holder 34 as for the other axial direction.
  • the holding member is moved using substrate holder 34 when moving substrate P in one of the axial directions (e.g., the X-axis direction), and the holding member is moved using the second substrate drive system when moving substrate P in the other axial direction (e.g., the Y-axis direction).
  • a separate measurement system other than the encoder system such as a measurement system like an optical interferometer system may be used as one of the encoder systems to obtain the position information.
  • the substitute for the measurement system is not limited to an optical interferometer system, and measurement systems of other methods (laser distance meter, a sonar range finder and the like) may also be used, as long as the system can measure the X, the Y, and the ⁇ z of the measuring object (head unit 60 and substrate holder 34 ) while the object is being moved.
  • measurement systems of other methods laser distance meter, a sonar range finder and the like
  • the illumination light may be an ultraviolet light such as an ArF excimer laser beam (wavelength 193 nm) or a KrF excimer laser beam (wavelength 248 nm), or a vacuum ultraviolet light such as an F 2 laser beam (wavelength 157 nm).
  • a harmonic wave may be used, which is a single-wavelength laser beam in the infrared or visual region oscillated from a DFB semiconductor laser or a fiber laser as vacuum ultraviolet light that is amplified by a fiber amplifier doped by, e.g. erbium (or both erbium and ytterbium), and then is subject to wavelength conversion into ultraviolet light using a nonlinear crystal.
  • a solid laser (wavelengths: 355 nm, 266 nm) may also be used.
  • projection optical system 16 is a projection optical system of a multiple lens method equipped with a plurality of optical systems
  • the number of projection optical systems is not limited to this, and one or more will be fine.
  • the projection optical system is not limited to the projection optical system of a multiple lens method, and may also be an Offner type projection optical system which uses a large mirror.
  • projection optical system 16 a magnifying system or a reduction system may also be used.
  • the exposure apparatus is not limited to the exposure apparatus for liquid crystals which transfers the liquid crystal display device pattern onto a square-shaped glass plate, and may also be widely applied to an exposure apparatus for manufacturing organic EL (Electro-Luminescence) panels, an exposure apparatus for manufacturing semiconductors, or to an exposure apparatus for manufacturing thin film magnetic heads, micromachines, and DNA chips.
  • the above embodiments can be applied not only to an exposure apparatus for manufacturing microdevices such as semiconductors, but also to an exposure apparatus that transfers a circuit pattern onto a glass substrate or a silicon wafer to manufacture a mask or a reticle used in an optical exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, and an electron-beam exposure apparatus.
  • the object subject to exposure is not limited to a glass plate, and may also be other objects such as a wafer, a ceramic substrate, a film member, or a mask blank.
  • the thickness of the substrate is not limited in particular, and includes a film-like substrate (a sheet-like member having flexibility). Note that the exposure apparatus of the embodiment is especially effective in the case when the exposure object is a substrate whose length of one side or diagonal length is 500 mm or more.
  • Electronic devices such as liquid crystal display devices (or semiconductor devices) are manufactured through the steps such as; a step for performing function/performance design of a device, a step for making a mask (or a reticle) on the basis of this design step, a step for making a glass substrate (or a wafer), a lithography step for transferring a pattern of a mask (reticle) onto the glass substrate by the exposure apparatus and the exposure method described in each of the embodiments described above, a development step for developing the glass substrate which has been exposed, an etching step for removing by etching an exposed member of an area other than the area where the resist remains, a resist removing step for removing the resist that is no longer necessary since etching has been completed, a device assembly step, and an inspection step.
  • the lithography step because the device pattern is formed on the glass substrate by carrying out the exposure method previously described using the exposure apparatus of the embodiments described above, a highly integrated device can be manufactured with good productivity.
  • the exposure apparatus of the present invention is suitable for exposing an object.
  • the flat panel display manufacturing method of the present invention is suitable for producing flat panel displays.
  • the device manufacturing method of the present invention is suitable for manufacturing microdevices.

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US20200192232A1 (en) 2020-06-18
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