HK1243176A1 - 採集多方向反射光源的系統和方法 - Google Patents

採集多方向反射光源的系統和方法

Info

Publication number
HK1243176A1
HK1243176A1 HK18102624.0A HK18102624A HK1243176A1 HK 1243176 A1 HK1243176 A1 HK 1243176A1 HK 18102624 A HK18102624 A HK 18102624A HK 1243176 A1 HK1243176 A1 HK 1243176A1
Authority
HK
Hong Kong
Prior art keywords
multiple directions
illumination reflected
capturing illumination
capturing
reflected
Prior art date
Application number
HK18102624.0A
Other languages
English (en)
Inventor
Ajharali Amanullah
Original Assignee
Semiconductor Tech & Instruments Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Tech & Instruments Pte Ltd filed Critical Semiconductor Tech & Instruments Pte Ltd
Publication of HK1243176A1 publication Critical patent/HK1243176A1/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8845—Multiple wavelengths of illumination or detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Microscoopes, Condenser (AREA)
HK18102624.0A 2010-07-13 2018-02-23 採集多方向反射光源的系統和方法 HK1243176A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG2010050854A SG177786A1 (en) 2010-07-13 2010-07-13 System and method for capturing illumination reflected in multiple directions

Publications (1)

Publication Number Publication Date
HK1243176A1 true HK1243176A1 (zh) 2018-07-06

Family

ID=45466723

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18102624.0A HK1243176A1 (zh) 2010-07-13 2018-02-23 採集多方向反射光源的系統和方法

Country Status (11)

Country Link
US (1) US9746426B2 (zh)
EP (2) EP2407772A1 (zh)
JP (1) JP5866704B2 (zh)
KR (1) KR101863128B1 (zh)
CN (1) CN102412170B (zh)
HK (1) HK1243176A1 (zh)
IL (1) IL214513A (zh)
MY (1) MY167163A (zh)
PT (1) PT3223001T (zh)
SG (1) SG177786A1 (zh)
TW (1) TWI558996B (zh)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2959864B1 (fr) * 2010-05-06 2013-01-18 Altatech Semiconductor Dispositif et procede d'inspection de plaquettes semi-conductrices en mouvement.
CN102419511A (zh) * 2011-06-07 2012-04-18 上海华力微电子有限公司 一种清除光刻掩模板表面微尘颗粒的方法
US10341555B2 (en) * 2011-12-02 2019-07-02 Chromologic Llc Characterization of a physical object based on its surface roughness
US9939386B2 (en) 2012-04-12 2018-04-10 KLA—Tencor Corporation Systems and methods for sample inspection and review
TWI460394B (zh) * 2012-07-20 2014-11-11 Test Research Inc 三維影像量測裝置
CN103778421B (zh) * 2012-10-18 2018-01-12 中芯国际集成电路制造(上海)有限公司 读取晶圆标识的方法及晶圆标识读取装置
JP6101176B2 (ja) * 2013-08-30 2017-03-22 富士フイルム株式会社 光学特性測定装置及び光学特性測定方法
US9772297B2 (en) 2014-02-12 2017-09-26 Kla-Tencor Corporation Apparatus and methods for combined brightfield, darkfield, and photothermal inspection
JP6425945B2 (ja) * 2014-08-21 2018-11-21 東洋アルミニウム株式会社 インターコネクタ用光拡散部材及びこれを備える太陽電池用インターコネクタ、並びに太陽電池モジュール
KR101602580B1 (ko) * 2014-10-31 2016-03-10 세메스 주식회사 웨이퍼 검사 방법
WO2017073628A1 (ja) * 2015-10-28 2017-05-04 日本碍子株式会社 ハニカム構造体の端面検査方法、及び端面検査装置
US10495581B2 (en) 2016-01-08 2019-12-03 SCREEN Holdings Co., Ltd. Defect detection device and defect detection method
CA3021480C (en) 2016-05-30 2022-08-16 Bobst Mex Sa An image capturing system and a method for determining the position of an embossed structure on a sheet element
TWI628428B (zh) * 2016-12-16 2018-07-01 由田新技股份有限公司 多視角影像擷取裝置、及其多視角影像檢測設備
KR102429614B1 (ko) * 2017-06-08 2022-08-04 삼성전자주식회사 테스트 시스템, 테스트 방법 및 이들을 이용한 반도체 장치의 제조 방법
US10402963B2 (en) * 2017-08-24 2019-09-03 Kla-Tencor Corporation Defect detection on transparent or translucent wafers
JP6955932B2 (ja) * 2017-08-25 2021-10-27 株式会社ディスコ レーザービームプロファイラユニット及びレーザー加工装置
US10545096B1 (en) * 2018-10-11 2020-01-28 Nanotronics Imaging, Inc. Marco inspection systems, apparatus and methods
TWI699465B (zh) * 2019-05-16 2020-07-21 亞亞科技股份有限公司 晶圓內外層取像裝置
US11593919B2 (en) 2019-08-07 2023-02-28 Nanotronics Imaging, Inc. System, method and apparatus for macroscopic inspection of reflective specimens
US10915992B1 (en) 2019-08-07 2021-02-09 Nanotronics Imaging, Inc. System, method and apparatus for macroscopic inspection of reflective specimens
CN111340715B (zh) * 2019-09-19 2024-02-06 杭州海康慧影科技有限公司 一种图像的网格纹弱化方法、装置及电子设备
CN113363175B (zh) * 2020-03-05 2024-06-11 联华电子股份有限公司 设有基板扫描器的基板处理设备
US11508590B2 (en) * 2021-04-15 2022-11-22 Jnk Tech Substrate inspection system and method of use thereof
US11987884B2 (en) * 2021-04-15 2024-05-21 Jnk Tech Glass and wafer inspection system and a method of use thereof

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0675035B2 (ja) * 1986-06-10 1994-09-21 松下電器産業株式会社 反射率測定装置
WO1996039619A1 (en) 1995-06-06 1996-12-12 Kla Instruments Corporation Optical inspection of a specimen using multi-channel responses from the specimen
US6201601B1 (en) * 1997-09-19 2001-03-13 Kla-Tencor Corporation Sample inspection system
US6324298B1 (en) 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
JP2000292126A (ja) * 1999-04-01 2000-10-20 Hitachi Ltd 外観検査装置およびそれを使用した半導体装置の製造方法
US6686602B2 (en) * 2002-01-15 2004-02-03 Applied Materials, Inc. Patterned wafer inspection using spatial filtering
US7525659B2 (en) * 2003-01-15 2009-04-28 Negevtech Ltd. System for detection of water defects
JP3913715B2 (ja) * 2003-06-18 2007-05-09 株式会社東芝 不良検出方法
CN100380621C (zh) * 2005-04-08 2008-04-09 力晶半导体股份有限公司 晶片缺陷检测方法与系统以及存储媒体
US7511816B2 (en) 2005-06-16 2009-03-31 Kla-Tencor Technologies Corp. Methods and systems for determining drift in a position of a light beam with respect to a chuck
US7471381B2 (en) * 2006-05-23 2008-12-30 Agency For Science, Technology And Research Method and apparatus for bump inspection
DE102006059190B4 (de) * 2006-12-15 2009-09-10 Vistec Semiconductor Systems Gmbh Vorrichtung zur Wafer-Inspektion
US7701577B2 (en) 2007-02-21 2010-04-20 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
JP2009092485A (ja) * 2007-10-06 2009-04-30 Djtech Co Ltd 印刷半田検査装置
US7761178B2 (en) * 2008-06-18 2010-07-20 Tokyo Electron Limited Automated process control using an optical metrology system optimized with design goals
SG164292A1 (en) * 2009-01-13 2010-09-29 Semiconductor Technologies & Instruments Pte System and method for inspecting a wafer

Also Published As

Publication number Publication date
EP3223001A1 (en) 2017-09-27
JP5866704B2 (ja) 2016-02-17
TW201226889A (en) 2012-07-01
IL214513A (en) 2016-02-29
SG177786A1 (en) 2012-02-28
EP2407772A1 (en) 2012-01-18
CN102412170A (zh) 2012-04-11
KR20120006952A (ko) 2012-01-19
KR101863128B1 (ko) 2018-06-01
US9746426B2 (en) 2017-08-29
EP3223001B1 (en) 2022-07-13
IL214513A0 (en) 2011-11-30
CN102412170B (zh) 2015-08-19
US20120013899A1 (en) 2012-01-19
PT3223001T (pt) 2022-08-16
TWI558996B (zh) 2016-11-21
JP2012021983A (ja) 2012-02-02
MY167163A (en) 2018-08-13

Similar Documents

Publication Publication Date Title
HK1243176A1 (zh) 採集多方向反射光源的系統和方法
EP2539837A4 (en) CLASSIFICATION SYSTEM AND METHOD
ZA201300646B (en) Three dimensional scanning beam system and method
GB201021662D0 (en) Real-time processing method and system
EP2577423A4 (en) SYSTEM AND METHOD FOR TELEPROMPTING
EP2529302A4 (en) PROCESSOR CACHE SYSTEM AND METHOD THEREFOR
GB2492036B (en) Method and system
GB201021212D0 (en) Camera based multi touch interaction and illumination system and method
GB201006213D0 (en) Fuel system and method
EP2579751A4 (en) SYSTEM AND METHOD FOR CONNECTING CUTLERY
EP2603170A4 (en) SYSTEMS AND METHODS FOR THE COLLECTION OF FOLLICULAR UNITS
EP2535125A4 (en) PANEL PROCESSING METHOD AND PANEL PROCESSING SYSTEM
GB201004837D0 (en) Fuel system and method
EP2519874A4 (en) BRANCHING PROCESSING AND SYSTEM
EP2601590A4 (en) SYSTEM AND METHOD FOR ADDRESS COLLECTION IN SOCIAL NETWORKS
ZA201207964B (en) Illumination apparatus methods and systems
GB201005585D0 (en) Gaming method and system
EP2521975A4 (en) RECONFIGURABLE PROCESSING SYSTEM AND METHOD
EP2654024A4 (en) SYSTEM AND METHOD FOR PROCESSING BANK NOTES
EP2550592A4 (en) SYSTEM AND METHOD FOR EXCHANGING CURRENCIES
IL214187A0 (en) Fourth toe processing systems and methods
EP2611741A4 (en) CLEANING PROCESS AND SYSTEM
EP2597351A4 (en) LIGHTING INSTALLATION AND METHOD OF USE
EP2530660A4 (en) MONEY PROCESSING SYSTEM AND METHOD
GB201006490D0 (en) Beverage processing system and method