HK1215754A1 - 改進寬帶隙功率晶體管的匹配技術 - Google Patents

改進寬帶隙功率晶體管的匹配技術

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Publication number
HK1215754A1
HK1215754A1 HK16103596.4A HK16103596A HK1215754A1 HK 1215754 A1 HK1215754 A1 HK 1215754A1 HK 16103596 A HK16103596 A HK 16103596A HK 1215754 A1 HK1215754 A1 HK 1215754A1
Authority
HK
Hong Kong
Prior art keywords
wide
power transistors
matching techniques
improved matching
bandgap power
Prior art date
Application number
HK16103596.4A
Other languages
English (en)
Inventor
Lang Richard
Gill Jonathan
Gotch Damian
Hilton Richard
Original Assignee
Diamond Microwave Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diamond Microwave Devices Ltd filed Critical Diamond Microwave Devices Ltd
Publication of HK1215754A1 publication Critical patent/HK1215754A1/zh

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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1903Structure including wave guides
    • H01L2924/19033Structure including wave guides being a coplanar line type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19042Component type being an inductor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19043Component type being a resistor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/38Effects and problems related to the device integration
    • H01L2924/386Wire effects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/026Coplanar striplines [CPS]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • H01P3/081Microstriplines
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/222A circuit being added at the input of an amplifier to adapt the input impedance of the amplifier
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/255Amplifier input adaptation especially for transmission line coupling purposes, e.g. impedance adaptation
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/451Indexing scheme relating to amplifiers the amplifier being a radio frequency amplifier

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Microwave Amplifiers (AREA)
HK16103596.4A 2013-12-31 2016-03-29 改進寬帶隙功率晶體管的匹配技術 HK1215754A1 (zh)

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JP6658429B2 (ja) * 2016-09-27 2020-03-04 三菱電機株式会社 半導体装置
US10268789B1 (en) * 2017-10-03 2019-04-23 Cree, Inc. Transistor amplifiers having node splitting for loop stability and related methods
US10615510B1 (en) * 2018-09-24 2020-04-07 Nxp Usa, Inc. Feed structure, electrical component including the feed structure, and module
CN112865708B (zh) * 2021-01-22 2024-06-28 华南理工大学 基于接地共面波导结构的射频宽带功率放大器及设计方法
CN113036379B (zh) * 2021-03-17 2022-06-14 成都挚信电子技术有限责任公司 一种压控磁性阻抗变换器
CN113838824B (zh) * 2021-08-25 2024-03-15 北京普能微电子科技有限公司 功率放大器芯片
CN115884493A (zh) 2021-09-28 2023-03-31 康普技术有限责任公司 阻抗匹配设备以及通信设备
US11842996B2 (en) 2021-11-24 2023-12-12 Nxp Usa, Inc. Transistor with odd-mode oscillation stabilization circuit

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JP2579371B2 (ja) * 1989-10-20 1997-02-05 富士通株式会社 高周波信号用の電力分配/合成器
JP3364404B2 (ja) * 1997-02-12 2003-01-08 株式会社東芝 半導体の入出力接続構造
JP3735270B2 (ja) * 2001-05-11 2006-01-18 松下電器産業株式会社 高周波半導体装置
JP5274332B2 (ja) * 2009-03-24 2013-08-28 三菱電機株式会社 マイクロ波半導体装置
JP5648295B2 (ja) * 2010-02-19 2015-01-07 富士通株式会社 インピーダンス変換器、集積回路装置、増幅器および通信機モジュール
JP5589428B2 (ja) * 2010-02-19 2014-09-17 富士通株式会社 伝送線路、インピーダンス変換器、集積回路搭載装置および通信機モジュール
JP5185324B2 (ja) * 2010-06-04 2013-04-17 株式会社東芝 高周波回路
GB201105912D0 (en) * 2011-04-07 2011-05-18 Diamond Microwave Devices Ltd Improved matching techniques for power transistors
US9203358B2 (en) * 2012-05-25 2015-12-01 Panasonic Intellectual Property Management Co., Ltd. Radio frequency amplifier circuit

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JP2017503426A (ja) 2017-01-26
GB201423411D0 (en) 2015-02-11
WO2015101789A1 (en) 2015-07-09
GB2550695A (en) 2017-11-29
GB201708774D0 (en) 2017-07-19
GB2524615A (en) 2015-09-30
GB201323159D0 (en) 2014-02-12
EP3090486A1 (en) 2016-11-09
GB2550695B (en) 2018-09-05
US20160322942A1 (en) 2016-11-03

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