HK1215754A1 - 改進寬帶隙功率晶體管的匹配技術 - Google Patents
改進寬帶隙功率晶體管的匹配技術Info
- Publication number
- HK1215754A1 HK1215754A1 HK16103596.4A HK16103596A HK1215754A1 HK 1215754 A1 HK1215754 A1 HK 1215754A1 HK 16103596 A HK16103596 A HK 16103596A HK 1215754 A1 HK1215754 A1 HK 1215754A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- wide
- power transistors
- matching techniques
- improved matching
- bandgap power
- Prior art date
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
- H01L2924/19033—Structure including wave guides being a coplanar line type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/38—Effects and problems related to the device integration
- H01L2924/386—Wire effects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/026—Coplanar striplines [CPS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/222—A circuit being added at the input of an amplifier to adapt the input impedance of the amplifier
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/255—Amplifier input adaptation especially for transmission line coupling purposes, e.g. impedance adaptation
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/451—Indexing scheme relating to amplifiers the amplifier being a radio frequency amplifier
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Microwave Amplifiers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB1323159.2A GB201323159D0 (en) | 2013-12-31 | 2013-12-31 | Improved matching techniques for wide-bandgap power transistors |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1215754A1 true HK1215754A1 (zh) | 2016-09-09 |
Family
ID=50114880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16103596.4A HK1215754A1 (zh) | 2013-12-31 | 2016-03-29 | 改進寬帶隙功率晶體管的匹配技術 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20160322942A1 (zh) |
EP (1) | EP3090486A1 (zh) |
JP (1) | JP2017503426A (zh) |
GB (3) | GB201323159D0 (zh) |
HK (1) | HK1215754A1 (zh) |
WO (1) | WO2015101789A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6658429B2 (ja) * | 2016-09-27 | 2020-03-04 | 三菱電機株式会社 | 半導体装置 |
US10268789B1 (en) * | 2017-10-03 | 2019-04-23 | Cree, Inc. | Transistor amplifiers having node splitting for loop stability and related methods |
US10615510B1 (en) * | 2018-09-24 | 2020-04-07 | Nxp Usa, Inc. | Feed structure, electrical component including the feed structure, and module |
CN112865708B (zh) * | 2021-01-22 | 2024-06-28 | 华南理工大学 | 基于接地共面波导结构的射频宽带功率放大器及设计方法 |
CN113036379B (zh) * | 2021-03-17 | 2022-06-14 | 成都挚信电子技术有限责任公司 | 一种压控磁性阻抗变换器 |
CN113838824B (zh) * | 2021-08-25 | 2024-03-15 | 北京普能微电子科技有限公司 | 功率放大器芯片 |
CN115884493A (zh) | 2021-09-28 | 2023-03-31 | 康普技术有限责任公司 | 阻抗匹配设备以及通信设备 |
US11842996B2 (en) | 2021-11-24 | 2023-12-12 | Nxp Usa, Inc. | Transistor with odd-mode oscillation stabilization circuit |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2579371B2 (ja) * | 1989-10-20 | 1997-02-05 | 富士通株式会社 | 高周波信号用の電力分配/合成器 |
JP3364404B2 (ja) * | 1997-02-12 | 2003-01-08 | 株式会社東芝 | 半導体の入出力接続構造 |
JP3735270B2 (ja) * | 2001-05-11 | 2006-01-18 | 松下電器産業株式会社 | 高周波半導体装置 |
JP5274332B2 (ja) * | 2009-03-24 | 2013-08-28 | 三菱電機株式会社 | マイクロ波半導体装置 |
JP5648295B2 (ja) * | 2010-02-19 | 2015-01-07 | 富士通株式会社 | インピーダンス変換器、集積回路装置、増幅器および通信機モジュール |
JP5589428B2 (ja) * | 2010-02-19 | 2014-09-17 | 富士通株式会社 | 伝送線路、インピーダンス変換器、集積回路搭載装置および通信機モジュール |
JP5185324B2 (ja) * | 2010-06-04 | 2013-04-17 | 株式会社東芝 | 高周波回路 |
GB201105912D0 (en) * | 2011-04-07 | 2011-05-18 | Diamond Microwave Devices Ltd | Improved matching techniques for power transistors |
US9203358B2 (en) * | 2012-05-25 | 2015-12-01 | Panasonic Intellectual Property Management Co., Ltd. | Radio frequency amplifier circuit |
-
2013
- 2013-12-31 GB GBGB1323159.2A patent/GB201323159D0/en not_active Ceased
-
2014
- 2014-12-31 GB GB1708774.3A patent/GB2550695B/en active Active
- 2014-12-31 GB GB1423411.6A patent/GB2524615A/en not_active Withdrawn
- 2014-12-31 US US15/108,937 patent/US20160322942A1/en not_active Abandoned
- 2014-12-31 EP EP14821267.3A patent/EP3090486A1/en not_active Withdrawn
- 2014-12-31 WO PCT/GB2014/053859 patent/WO2015101789A1/en active Application Filing
- 2014-12-31 JP JP2016544595A patent/JP2017503426A/ja active Pending
-
2016
- 2016-03-29 HK HK16103596.4A patent/HK1215754A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2017503426A (ja) | 2017-01-26 |
GB201423411D0 (en) | 2015-02-11 |
WO2015101789A1 (en) | 2015-07-09 |
GB2550695A (en) | 2017-11-29 |
GB201708774D0 (en) | 2017-07-19 |
GB2524615A (en) | 2015-09-30 |
GB201323159D0 (en) | 2014-02-12 |
EP3090486A1 (en) | 2016-11-09 |
GB2550695B (en) | 2018-09-05 |
US20160322942A1 (en) | 2016-11-03 |
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