HK1212097A1 - Wafer conveying apparatus and wafer supplying/discharging apparatus - Google Patents
Wafer conveying apparatus and wafer supplying/discharging apparatusInfo
- Publication number
- HK1212097A1 HK1212097A1 HK15112859.8A HK15112859A HK1212097A1 HK 1212097 A1 HK1212097 A1 HK 1212097A1 HK 15112859 A HK15112859 A HK 15112859A HK 1212097 A1 HK1212097 A1 HK 1212097A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- wafer
- supplying
- discharging
- conveying apparatus
- discharging apparatus
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014094741A JP5679498B1 (en) | 2014-05-01 | 2014-05-01 | Wafer transfer device and wafer supply / discharge device |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1212097A1 true HK1212097A1 (en) | 2016-06-03 |
Family
ID=52684782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15112859.8A HK1212097A1 (en) | 2014-05-01 | 2015-12-30 | Wafer conveying apparatus and wafer supplying/discharging apparatus |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5679498B1 (en) |
CN (1) | CN105047592B (en) |
HK (1) | HK1212097A1 (en) |
MY (1) | MY162005A (en) |
SG (1) | SG10201502848WA (en) |
TW (1) | TWI512879B (en) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05283502A (en) * | 1992-03-30 | 1993-10-29 | Mitsubishi Electric Corp | Die bonder |
JPH05338728A (en) * | 1992-06-05 | 1993-12-21 | Fujitsu Ltd | Wafer carrying method and device thereof |
JPH1022359A (en) * | 1996-07-01 | 1998-01-23 | Dainippon Screen Mfg Co Ltd | Wafer conveyer |
EP0975008A1 (en) * | 1998-07-20 | 2000-01-26 | Alphasem AG | Method and device for treating a flat workpiece, in particular a semiconductor wafer |
KR101394389B1 (en) * | 2007-07-24 | 2014-05-14 | 세메스 주식회사 | Wafer transporting apparatus and method for driving the apparatus |
JP5257890B2 (en) * | 2007-12-04 | 2013-08-07 | 上野精機株式会社 | Wafer ring supply / discharge device |
JP5976329B2 (en) * | 2012-02-01 | 2016-08-23 | 株式会社ディスコ | Workpiece loading / unloading device |
JP6013792B2 (en) * | 2012-06-12 | 2016-10-25 | 東京エレクトロン株式会社 | Substrate transport method and substrate transport apparatus |
TWM461872U (en) * | 2013-01-09 | 2013-09-11 | Gudeng Prec Ind Co Ltd | Structure of cartridge |
-
2014
- 2014-05-01 JP JP2014094741A patent/JP5679498B1/en active Active
-
2015
- 2015-01-14 TW TW104101175A patent/TWI512879B/en active
- 2015-04-01 CN CN201510151511.8A patent/CN105047592B/en active Active
- 2015-04-10 SG SG10201502848WA patent/SG10201502848WA/en unknown
- 2015-04-21 MY MYPI2015701269A patent/MY162005A/en unknown
- 2015-12-30 HK HK15112859.8A patent/HK1212097A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP5679498B1 (en) | 2015-03-04 |
TWI512879B (en) | 2015-12-11 |
SG10201502848WA (en) | 2015-12-30 |
MY162005A (en) | 2017-05-31 |
JP2015213112A (en) | 2015-11-26 |
TW201533833A (en) | 2015-09-01 |
CN105047592B (en) | 2017-08-15 |
CN105047592A (en) | 2015-11-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20220404 |