HK1212097A1 - Wafer conveying apparatus and wafer supplying/discharging apparatus - Google Patents

Wafer conveying apparatus and wafer supplying/discharging apparatus

Info

Publication number
HK1212097A1
HK1212097A1 HK15112859.8A HK15112859A HK1212097A1 HK 1212097 A1 HK1212097 A1 HK 1212097A1 HK 15112859 A HK15112859 A HK 15112859A HK 1212097 A1 HK1212097 A1 HK 1212097A1
Authority
HK
Hong Kong
Prior art keywords
wafer
supplying
discharging
conveying apparatus
discharging apparatus
Prior art date
Application number
HK15112859.8A
Other languages
Chinese (zh)
Inventor
Yoshiaki Hara
Tomohiro Hazeki
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Publication of HK1212097A1 publication Critical patent/HK1212097A1/en

Links

HK15112859.8A 2014-05-01 2015-12-30 Wafer conveying apparatus and wafer supplying/discharging apparatus HK1212097A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014094741A JP5679498B1 (en) 2014-05-01 2014-05-01 Wafer transfer device and wafer supply / discharge device

Publications (1)

Publication Number Publication Date
HK1212097A1 true HK1212097A1 (en) 2016-06-03

Family

ID=52684782

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15112859.8A HK1212097A1 (en) 2014-05-01 2015-12-30 Wafer conveying apparatus and wafer supplying/discharging apparatus

Country Status (6)

Country Link
JP (1) JP5679498B1 (en)
CN (1) CN105047592B (en)
HK (1) HK1212097A1 (en)
MY (1) MY162005A (en)
SG (1) SG10201502848WA (en)
TW (1) TWI512879B (en)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283502A (en) * 1992-03-30 1993-10-29 Mitsubishi Electric Corp Die bonder
JPH05338728A (en) * 1992-06-05 1993-12-21 Fujitsu Ltd Wafer carrying method and device thereof
JPH1022359A (en) * 1996-07-01 1998-01-23 Dainippon Screen Mfg Co Ltd Wafer conveyer
EP0975008A1 (en) * 1998-07-20 2000-01-26 Alphasem AG Method and device for treating a flat workpiece, in particular a semiconductor wafer
KR101394389B1 (en) * 2007-07-24 2014-05-14 세메스 주식회사 Wafer transporting apparatus and method for driving the apparatus
JP5257890B2 (en) * 2007-12-04 2013-08-07 上野精機株式会社 Wafer ring supply / discharge device
JP5976329B2 (en) * 2012-02-01 2016-08-23 株式会社ディスコ Workpiece loading / unloading device
JP6013792B2 (en) * 2012-06-12 2016-10-25 東京エレクトロン株式会社 Substrate transport method and substrate transport apparatus
TWM461872U (en) * 2013-01-09 2013-09-11 Gudeng Prec Ind Co Ltd Structure of cartridge

Also Published As

Publication number Publication date
JP5679498B1 (en) 2015-03-04
TWI512879B (en) 2015-12-11
SG10201502848WA (en) 2015-12-30
MY162005A (en) 2017-05-31
JP2015213112A (en) 2015-11-26
TW201533833A (en) 2015-09-01
CN105047592B (en) 2017-08-15
CN105047592A (en) 2015-11-11

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20220404