JP5976329B2 - Workpiece loading / unloading device - Google Patents

Description

  The present invention provides a holding surface for holding a workpiece, which is mounted on a processing machine such as a laser processing machine that performs predetermined processing on a workpiece such as a semiconductor wafer or an inspection machine that inspects parts. The present invention relates to a workpiece loading / unloading device for loading / unloading a workpiece onto / from a table.

  A processing machine such as a laser processing apparatus mounts a holding table for holding a workpiece, a processing means for processing the workpiece held on the holding table, and a cassette containing a plurality of workpieces. Cassette placing means, workpiece unloading means for unloading the workpiece from the cassette placed on the cassette placing means, and temporarily placing the workpiece unloaded by the workpiece unloading means A placing means and a workpiece conveying means for conveying the workpiece positioned by the temporary placing means to a holding table are provided. (For example, refer to Patent Document 1.)

JP 2010-245206 A

  Thus, in the processing apparatus described above, the work piece carried out from the cassette placed on the cassette placement means to the temporary placement means is conveyed to the holding table, and then processed after being processed on the holding table. Although the work piece is transported to the temporary placement means and then accommodated in the cassette, there is a problem that the productivity is poor because the work is interrupted during this time. Such a problem is that after the workpiece held on the holding table is subjected to processing such as predetermined processing or inspection, the processed workpiece and the workpiece before processing are exchanged on the holding table. Can happen in the machine.

  This invention is made | formed in view of the said fact, The main technical subject is that the workpiece after a process and the workpiece before a process can be replaced | exchanged smoothly to the holding table holding a workpiece. It is to provide a work-in / out device.

In order to solve the above main technical problem, according to the present invention, a workpiece for carrying a workpiece in and out of a holding table having a holding surface for holding the workpiece is provided in a processing machine for processing the workpiece. A workpiece loading / unloading device,
An operating member having a rotation shaft provided in the center in parallel with the holding surface of the holding table, and a first mounting portion and a second mounting portion that are separated from each other by 180 degrees with respect to the rotation shaft of the operating member. First workpiece holding means and second workpiece holding means provided, rotational drive means for rotationally driving the rotating shaft of the operating member, and the operating member with respect to the holding surface of the holding table And moving means for moving in a vertical direction,
The first workpiece holding means and the second workpiece holding means are respectively rotated at one end parallel to the rotation axis of the first mounting portion and the second mounting portion of the operating member. A first support shaft and a second support shaft that are supported, and a first workpiece holding that is attached to the other ends of the first support shaft and the second support shaft in a suspended state, respectively. A tool and a second workpiece holder ,
The workpiece is held by the first workpiece holder or the second workpiece holder, and after the workpiece is placed on the holding surface, the first workpiece is held. Release the holding state of the tool or the second workpiece holder and the workpiece;
A workpiece carrying-in / out device is provided.

It is desirable to provide a rotation mechanism that rotates the first support shaft and the second support shaft in the direction opposite to the rotation direction of the operation member when the operation member is rotated by the rotation shaft. The rotation mechanism includes a first gear and a second gear mounted on one end of the first support shaft and the second support shaft, respectively, and is disposed so as to be relatively rotatable on the rotation shaft, and rotates the rotation shaft. A fixed gear, and a fixed gear, a toothed belt looped around the first gear and the second gear, and the fixed gear, the first gear and the second gear are set to the same number of teeth. Yes . Further, according to the present invention, there is provided a processing machine provided with the above-described loading / unloading device, the processing machine including a workpiece conveying means for taking out the workpiece from a cassette for storing the workpiece, and a workpiece. And a holding table for holding the workpiece when the workpiece is processed. The workpiece is taken out by the workpiece conveying means, and is taken in by the loading / unloading device. A processing machine that is carried into and out of the holding table, and further a temporary table, are provided, and after the workpiece taken out by the workpiece conveying means is aligned on the temporary table, the loading and unloading is performed. A processing machine that is carried into and out of the holding table by the carry-out device is provided.

The workpiece loading / unloading apparatus according to the present invention is configured as described above, and the processed workpiece held on the holding table is the first workpiece holding means or the second workpiece holding means. The work table is unloaded from the holding surface of the holding table by being held and pulled up, and the workpiece before processing held by the second workpiece holding means or the first workpiece holding means is lowered to the holding table. Therefore, the processed workpiece and the unprocessed workpiece can be efficiently exchanged with respect to the same holding table.
In the workpiece loading / unloading apparatus according to the present invention, the first workpiece holding means and the second workpiece holding means do not require a conveyance path that moves linearly in the left-right direction and the front-rear direction. A processing device such as a processing device or an inspection machine can be made compact.

The perspective view of the laser processing machine as a processing machine equipped with the carrying in / out apparatus of the workpiece comprised according to this invention. The perspective view which shows the 1st operation | movement form of the carrying in / out apparatus of the workpiece comprised according to this invention. The perspective view which shows the 2nd action | operation form of the workpiece carrying in / out apparatus comprised according to this invention. The perspective view which decomposes | disassembles and shows the structural member of the workpiece carrying in / out apparatus shown in FIG. The side view which fractures | ruptures and shows the principal part of the support base, the movement base, and movement means which comprise the carrying in / out apparatus of the workpiece shown in FIG. Sectional drawing of the rotation mechanism which comprises the workpiece carrying in / out apparatus shown in FIG. FIG. 7 is an AA arrow view in FIG. 6.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a workpiece loading / unloading apparatus configured according to the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a laser beam machine as a processing machine equipped with a workpiece loading / unloading device constructed according to the present invention.
A laser beam machine 1 shown in FIG. 1 includes a device housing 2 having a substantially rectangular parallelepiped shape. A holding table 3 for holding a workpiece is disposed in the apparatus housing 2 so as to be movable in a machining feed direction (X-axis direction) indicated by an arrow X. The holding table 3 sucks and holds the workpiece on the holding surface which is the upper surface by operating a suction means (not shown). The holding table 3 is configured to be rotatable by a rotation mechanism (not shown). The holding table 3 is provided with a clamp 31 for fixing an annular frame described later. The holding table 3 configured as described above is processed by a processing feed means (not shown) between a workpiece attaching / detaching position shown in FIG. 1 and a processing position indicated by an arrow X between processing positions where a laser beam irradiation means (not shown) is disposed. It can be moved in the (X-axis direction).

  In the cassette mounting area 4a of the apparatus housing 2, a cassette mounting table 41 for mounting a cassette for storing a workpiece is disposed. The cassette mounting table 41 is configured to be movable in the vertical direction by lifting means (not shown). On the cassette mounting table 41, a cassette 4 for storing the semiconductor wafer 10 as a workpiece is placed. The semiconductor wafer 10 accommodated in the cassette 4 has a grid-like street formed on the surface thereof, and devices such as ICs and LSIs are formed in a plurality of rectangular areas partitioned by the grid-like street. The semiconductor wafer 10 thus formed is accommodated in the cassette 4 with the back surface adhered to the front surface of the dicing tape T mounted on the annular frame F.

  The laser beam machine 1 in the illustrated embodiment is a semiconductor wafer 10 (supported on an annular frame F via a dicing tape T) accommodated in a cassette 4 mounted on the cassette mounting table 41. ) And the semiconductor wafer 10 disposed above the holding table 3 positioned at the workpiece attachment / detachment position and temporarily unloaded by the workpiece conveyance means 5 for alignment. Temporary placement means 6 is provided. The workpiece transfer means 5 includes a gripping means 51 that is disposed so as to be able to advance and retreat in opposition to the cassette 4 placed on the cassette placement table 41, and grips the annular frame F. It comprises feed means 52 that moves in an index feed direction (Y-axis direction) indicated by an arrow Y orthogonal to the machining feed direction (X-axis direction). The temporary placement means 6 includes a pair of temporary placement tables 61 and 61 arranged parallel to each other along the Y-axis direction and configured to advance and retreat in the X-axis direction, and on the upper surfaces of the temporary placement tables 61 and 61. It is composed of a pair of position restricting members 62 and 62 arranged to face each other and to be able to advance and retreat in the X-axis direction. Arc-shaped concave portions 611 and 611 are formed in the center portions of the pair of temporary placement tables 61 and 61 facing each other.

  Further, the laser beam machine 1 in the illustrated embodiment is loaded / unloaded of a workpiece for loading / unloading the workpiece to / from the holding table 3 which is disposed on the X-axis direction extension line of the holding table 3 in the apparatus housing 2. A device 7 is provided. The workpiece loading / unloading device 7 will be described with reference to FIGS. FIG. 2 is a perspective view showing a first operation mode of the workpiece carrying-in / out device 7, and FIG. 3 shows a second operation mode of the workpiece loading / unloading device 7. A perspective view is shown. FIG. 4 is an exploded perspective view of components of the workpiece loading / unloading device 7. The workpiece loading / unloading device 7 in the illustrated embodiment is provided on a support base 71 disposed on an extension line in the X-axis direction of the holding table 3, and disposed on the support base 71 so as to be movable in the vertical direction. The movable base 72, the operating member 73 whose center is rotatably mounted on the upper part of the movable base 72, and the first mounting portion 73a and the second mounting portion 73b of the operating member 73, respectively. The first workpiece holding means 74a and the second workpiece holding means 74b are provided.

  As shown in FIG. 5, the support base 71 includes a fitting recess 711 having a rectangular cross section corresponding to the outer shape of the lower part of the movable base 72, and a pulse motor 70 is disposed on the bottom surface. Yes. A male screw rod 700 is connected to the drive shaft of the pulse motor 70, and the male screw rod 700 is screwed into a female screw hole (not shown) formed in the lower part of the moving base 72 fitted in the fitting recess 711. Are combined. Therefore, by operating the pulse motor 70 and rotating the male screw rod 700 in one direction or the other direction, the moving base 72 is moved downward or upward along the fitting recess 711. Accordingly, a female screw hole (not shown) formed in the lower portion of the pulse motor 70, the male screw rod 700, and the moving base 72 causes the moving base 72 on which the operating member 73 is attached to the holding surface which is the upper surface of the holding table 3. It functions as a moving means for moving in the vertical direction. As shown in FIG. 6, an electric motor 76 as a rotational drive source is disposed on the moving base 72, and a later-described rotary shaft provided on the operating member 73 on the drive shaft 760 of the electric motor 76. Are connected to the transmission.

  As shown in FIG. 6, the actuating member 73 has an oblong shape in the illustrated embodiment and has a U-shaped cross section, and a rotation shaft 730 is provided at the center. A spline 731 is formed at the tip of the rotating shaft 730, and the spline 731 is spline-fitted into a spline groove 761 formed at the tip of the drive shaft 760 of the electric motor 76. Thus, the rotating shaft 730 that is connected to the drive shaft 760 of the electric motor 76 is disposed in parallel with the holding surface that is the upper surface of the holding table 3. Further, shaft holes 732a and 732b are formed in the first mounting portion 73a and the second mounting portion 73b, respectively, which are 180 degrees apart from the rotation shaft 730 in the operating member 73. A first support shaft and a second support shaft of first workpiece holding means 74a and second workpiece holding means 74b, which will be described later, are rotatably supported in the shaft holes 732a and 732b.

  The first workpiece holding means 74a and the second workpiece holding means 74b are provided on the first mounting portion 73a and the second mounting portion 73b of the operating member 73 as shown in FIGS. A first support shaft 741a and a second support shaft 741b whose one ends are rotatably supported in the shaft holes 732a and 732b, and the other ends of the first support shaft 741a and the second support shaft 741b. The first workpiece holder 742a and the second workpiece holder 742b are respectively mounted in a suspended state. As shown in FIG. 6, the first support shaft 741 a and the second support shaft 741 b are arranged in parallel with the rotation shaft 730, and one end portions thereof are the first mounting portion 73 a and the second mounting portion of the operating member 73. It is rotatably supported by shaft holes 732a and 732b provided in the portion 73b. The first workpiece holder 742a and the second workpiece holder 742b, which are suspended from the other ends of the first support shaft 741a and the second support shaft 741b, respectively, A first support rod 743a and a second support rod 743b whose upper ends are respectively attached to the other ends of the support shaft 741a and the second support shaft 741b, and the first support rod 743a and the second support rod 743b Each includes a first holding member 744a and a second holding member 744b attached to the lower ends. The first holding member 744a and the second holding member 744b of the first workpiece holder 742a and the second workpiece holder 742b thus configured are connected to suction means (not shown), respectively. A plurality of suction cups 745 are mounted.

  The workpiece loading / unloading device 7 in the illustrated embodiment uses the first support shaft 741 a and the second support shaft 741 b as the rotation direction of the operation member 73 when the operation member 73 is rotated by the rotation shaft 730. A rotating mechanism 75 that rotates in the reverse direction is provided. The rotation mechanism 75 includes a first gear 751a and a second gear 751b mounted on one end of the first support shaft 741a and the second support shaft 741b, respectively, as shown in FIGS. A fixed gear 752 that is disposed on the shaft 730 so as to be relatively rotatable and allows the rotation of the rotary shaft 730, and a toothed belt 753 that is looped around the fixed gear 752, the first gear 751a, and the second gear 751b. , Belt retainers 754 and 754 for applying tension to the toothed belt 753. The fixed gear 752 has an insertion hole 755 through which the rotation shaft 730 is inserted at the center. The insertion gear 755 is fitted into the rotation shaft 730 and is fixed to the moving base 72. The fixed gear 752, the first gear 751a, and the second gear 751b have the same number of teeth. When the rotary shaft 730 is driven and the operating member 73 rotates in the direction indicated by the arrow C as shown in FIG. 7, the rotation mechanism 75 configured in this way causes the first gear 751 a and the second gear 751 b to move. The first support shaft 741a and the second support shaft 741b mounted with the first gear 751a and the second gear 751b are rotated in the direction indicated by the arrow D in the direction indicated by the arrow D. It can be rotated. Therefore, even if the rotation shaft 730 is driven and the operation member 73 rotates in the direction indicated by the arrow C, the first support shaft 741a and the second support shaft 741b are mounted in the suspended state on the other ends. The workpiece holder 742a and the second workpiece holder 742b are maintained in the suspended state.

Next, the operation of the laser beam machine equipped with the workpiece loading / unloading device 7 configured as described above will be described.
The semiconductor wafer 10 (supported by the annular frame F via the dicing tape T) accommodated in a predetermined position of the cassette 4 placed on the cassette placement table 41 is moved by the lifting means (not shown). The mounting table 41 is positioned at the take-out position by moving up and down. Next, the gripping means 51 of the workpiece transport means 5 is moved forward and backward to transport the semiconductor wafer 10 positioned at the removal position onto the pair of temporary placement tables 61, 61 of the temporary placement means 6 (workpiece removal). Process). At this time, the pair of position restricting members 62 and 62 disposed on the pair of temporary placement tables 61 and 61 are positioned at receiving positions separated from each other by a predetermined amount. Further, the workpiece carry-in / out device 7 is in the first operating state shown in FIGS. 1 and 2 in which the first workpiece holding means 74a and the second workpiece holding means 74b are in the horizontal state. It is positioned. Next, by moving the pair of position restricting members 62 and 62 in a direction approaching each other, the annular frame F is sandwiched between the pair of position restricting members 62 and 62, and the semiconductor wafer 10 as a workpiece is processed. Alignment (workpiece alignment process).

  Next, an electric motor 76 serving as a rotational drive source of the workpiece loading / unloading device 7 is driven to rotate the operating member 73 to position the first workpiece holding means 74a at the lowest position (FIG. 2nd form shown in 3). Thus, when the first workpiece holding means 74a is positioned at the lowest position, the first holding member 744a of the first workpiece holder 742a is positioned on the pair of temporary placement tables 61 and 61. It is positioned immediately above the combined semiconductor wafer 10 (in a state where it is supported on the annular frame F via the dicing tape T). Then, by driving the pulse motor 70 as the moving means and rotating the male screw rod 700 in one direction, the moving base 72 to which the operating member 73 is attached is moved downward and is attached to the operating member 73. A plurality of suction cups 745 mounted on the first holding member 744a of the first workpiece holder 742a constituting the first workpiece holding means 74a are positioned on the annular frame F. Next, by operating a suction means (not shown), the annular frame F supporting the semiconductor wafer 10 via the dicing tape T is sucked and held by the plurality of suckers 745 (workpiece holding step). In this manner, when the annular frame F is sucked and held by the plurality of suction cups 745, the pair of temporary placement tables 61 and 61 are positioned at a release position separated from each other by a predetermined amount. Then, by driving the pulse motor 70 as the moving means and rotating the male screw rod 700 in one direction, the moving base 72 on which the operating member 73 is mounted is moved downward and is sucked and held by the plurality of suction cups 745. The semiconductor wafer 10 supported on the annular frame F via the dicing tape T is placed on the holding surface which is the upper surface of the holding table 3 positioned at the workpiece attaching / detaching position shown in FIG. Carrying-in process). Next, the semiconductor wafer 10 is sucked and held on the holding table 3 via the dicing tape T by operating a suction means (not shown). The moving base on which the operating member 73 is mounted is released by releasing the suction and holding of the annular frame F by the plurality of suction cups 745 and driving the pulse motor 70 as the moving means to rotate the male screw rod 700 in the other direction. 72 is moved upward, and the first workpiece holding means 74a and the second workpiece holding means 74b are positioned in the first operation mode shown in FIG. 1 and FIG. If the semiconductor wafer 10 is sucked and held on the holding table 3 via the dicing tape T, the annular frame F is fixed by the clamp 31.

  As described above, when the semiconductor wafer 10 is sucked and held on the holding table 3 via the dicing tape T, the laser beam irradiation means arranges the holding table 3 holding the semiconductor wafer 10 by operating the processing feed means (not shown). Move to the set machining position. The semiconductor wafer 10 held on the holding table 3 moved to the processing position is subjected to predetermined laser processing by operating a laser beam irradiation means (not shown) (processing step). In this way, the holding table 3 holding the semiconductor wafer 10 subjected to the processing step is positioned at the workpiece attaching / detaching position shown in FIG. 1 to release the suction holding of the semiconductor wafer 10 and to form an annular shape by the clamp 31. The frame F is unfixed.

  While the above-described processing steps are being performed, the workpiece removal process for unloading the semiconductor wafer 10 as the workpiece to be processed next from the cassette 4 to the temporary placement means 6 and the temporary placement means 6 are performed. As described above, the first workpiece holding means 74a of the workpiece loading / unloading device 7 performs the workpiece positioning step for positioning the unprocessed semiconductor wafer 10 that has been unloaded. A workpiece holding step for holding the wafer 10 is performed.

  As described above, when the holding table 3 holding the semiconductor wafer 10 subjected to the processing step is positioned at the workpiece attaching / detaching position shown in FIG. 1, it serves as a rotational drive source for the workpiece loading / unloading device 7. The electric motor 76 is driven to rotate the operating member 73 to position the second workpiece holding means 74b at the lowest position. Thus, when the second workpiece holding means 74b is positioned at the lowest position, the semiconductor wafer 10 (annular) in which the second holding member 744b of the second workpiece holder 742b is held by the holding table 3 is formed. The frame F is supported immediately above the frame F through the dicing tape T). Then, by driving the pulse motor 70 as the moving means and rotating the male screw rod 700 in one direction, the moving base 72 to which the operating member 73 is attached is moved downward and is attached to the operating member 73. A plurality of suction cups 745 mounted on the second holding member 744b of the second workpiece holder 742b constituting the second workpiece holding means 74b are positioned on the annular frame F. Next, by operating a suction means (not shown), the plurality of suckers 745 suck and hold the annular frame F that supports the processed semiconductor wafer 10 via the dicing tape T (workpiece holding step). . Then, by driving the pulse motor 70 as the moving means and rotating the male screw rod 700 in the other direction, the moving base 72 on which the operating member 73 is mounted is moved upward to be mounted on the operating member 73. The processed semiconductor wafer 10 supported via the dicing tape T on the annular frame F held by the second workpiece holding means 74b is pulled up from the holding surface of the holding table 3 (workpiece) Unloading process).

  Next, an electric motor 76 serving as a rotational drive source of the workpiece loading / unloading device 7 is driven to rotate the operating member 73 to position the first workpiece holding means 74a at the lowest position. When the first workpiece holding means 74a is positioned at the lowest position in this way, the first holding member 744a of the first workpiece holder 742a is positioned immediately above the holding table 3. Then, by driving the pulse motor 70 as the moving means and rotating the male screw rod 700 in one direction, the moving base 72 on which the operating member 73 is mounted is moved downward and is sucked and held by the plurality of suction cups 745. The unprocessed semiconductor wafer 10 supported by the annular frame F via the dicing tape T is placed on a holding surface which is the upper surface of the holding table 3 (workpiece carrying-in step). Next, the semiconductor wafer 10 before processing is sucked and held on the holding table 3 by operating a suction means (not shown). The moving base on which the operating member 73 is mounted is released by releasing the suction and holding of the annular frame F by the plurality of suction cups 745 and driving the pulse motor 70 as the moving means to rotate the male screw rod 700 in the other direction. 72 is moved upward, and the first workpiece holding means 74a and the second workpiece holding means 74b are positioned in the first operation mode shown in FIG. 1 and FIG.

  In this manner, when the semiconductor wafer 10 to be processed next is loaded into the holding table 3 from which the semiconductor wafer 10 that is a processed workpiece is unloaded, the holding table 3 is moved to the processing position, and the above-described processing is performed. Perform the machining process. On the other hand, the first workpiece holding means positioned in the first operation mode shown in FIGS. 1 and 2 in which the first workpiece holding means 74a and the second workpiece holding means 74b are in the horizontal state. The means 74a drives the electric motor 76 as a rotational drive source to rotate the operating member 73 to position the second workpiece holding means 74b at the lowest position. At this time, the pair of position restricting members 62 and 62 of the temporary placement means 6 are positioned at the receiving positions separated from each other by a predetermined amount. Then, by driving the pulse motor 70 as the moving means and rotating the male screw rod 700 in one direction, the moving base 72 to which the operating member 73 is attached is moved downward and is attached to the operating member 73. Dicing the processed semiconductor wafer 10 sucked and held by the plurality of suction cups 745 mounted on the second holding member 744b of the second workpiece holder 742b constituting the second workpiece holding means 74b. The annular frame F supported via the tape T is placed on the pair of temporary placement tables 61 and 61 of the temporary placement means 6. The moving base on which the operating member 73 is mounted is released by releasing the suction and holding of the annular frame F by the plurality of suction cups 745 and driving the pulse motor 70 as the moving means to rotate the male screw rod 700 in the other direction. 72 is moved upward, and the first workpiece holding means 74a and the second workpiece holding means 74b are positioned in the first operation mode shown in FIG. 1 and FIG. Next, by moving the pair of position restricting members 62 and 62 in a direction approaching each other, the annular frame F is sandwiched between the pair of position restricting members 62 and 62, and the semiconductor wafer 10 as a workpiece is processed. Alignment (workpiece alignment process). In this way, when the workpiece positioning process of the semiconductor wafer 10 placed on the pair of temporary placement tables 61, 61 of the temporary placement means 6 is performed, the gripping means 51 of the workpiece transport means 5. Is operated to grip the annular frame F, and is conveyed toward the cassette 4 placed on the cassette placing table 41, and is supported on the annular frame F via the dicing tape T at a predetermined position of the cassette 4. The processed semiconductor wafer 10 is stored (processed object storing step).

As described above, the workpiece loading / unloading apparatus 7 in the illustrated embodiment holds the processed semiconductor wafer 10 held by the holding table 3 by the second workpiece holding means 74b and pulls it up. As a result, the unprocessed semiconductor wafer 10 held by the first workpiece holding means 74a is lowered, placed on the holding surface of the holding table 3, and carried in. The workpiece after processing and the workpiece before processing can be efficiently exchanged with respect to the same holding table 3.
Further, in the illustrated embodiment of the workpiece loading / unloading device 7, the first workpiece holding means 74a and the second workpiece holding means 74b have a conveying path in which they move linearly in the left-right direction and the front-rear direction. Since it is not necessary, processing devices such as processing devices and inspection machines can be made compact.

  Although the present invention has been described based on the illustrated embodiment, the present invention is not limited to the embodiment, and various modifications are possible within the scope of the gist of the present invention. For example, in the illustrated embodiment, an example in which the present invention is applied to a laser processing machine as a processing machine has been shown, but the same effect can be obtained even if the present invention is applied to a processing machine such as an inspection machine.

1: Laser processing machine 2: Device housing 3: Holding table 4: Cassette 5: Workpiece conveying means 6: Temporary placing means 7: Workpiece loading / unloading device 70: Pulse motor 71: Support base 72: Movement Base 73: Actuating member 730: Rotating shaft 74a: First workpiece holding means 74b: Second workpiece holding means 741a: First support shaft 741b: Second support shaft 742a: First workpiece Workpiece holder 742b: Second workpiece holder 75: Rotating mechanism 751a: First gear 751b: Second gear 752: Fixed gear 753: Toothed belt 76: Electric motor 10: Semiconductor wafer F: Ring frame T: Dicing tape

Claims (5)

A workpiece loading / unloading device for loading / unloading a workpiece to / from a holding table equipped with a processing machine for processing the workpiece and having a holding surface for holding the workpiece,
An operating member having a rotation shaft provided in the center in parallel with the holding surface of the holding table, and a first mounting portion and a second mounting portion that are separated from each other by 180 degrees with respect to the rotation shaft of the operating member. First workpiece holding means and second workpiece holding means provided, rotational drive means for rotationally driving the rotating shaft of the operating member, and the operating member with respect to the holding surface of the holding table And moving means for moving in a vertical direction,
The first workpiece holding means and the second workpiece holding means are respectively rotated at one end parallel to the rotation axis of the first mounting portion and the second mounting portion of the operating member. A first support shaft and a second support shaft that are supported, and a first workpiece holding that is attached to the other ends of the first support shaft and the second support shaft in a suspended state, respectively. A tool and a second workpiece holder ,
The workpiece is held by the first workpiece holder or the second workpiece holder, and after the workpiece is placed on the holding surface, the first workpiece is held. Release the holding state of the tool or the second workpiece holder and the workpiece;
A workpiece carrying-in / out device characterized by that.   The rotation mechanism that rotates the first support shaft and the second support shaft in a direction opposite to the rotation direction of the operation member when the operation member is rotated by the rotation shaft. Loading and unloading equipment for workpieces.   The rotating mechanism includes a first gear and a second gear mounted on one end of the first support shaft and the second support shaft, respectively, and is disposed on the rotation shaft so as to be relatively rotatable. A fixed gear that allows rotation of the rotary shaft; and a toothed belt that is looped around the fixed gear, the first gear, and the second gear, the fixed gear, the first gear, and the first gear 3. The workpiece carrying-in / out device according to claim 2, wherein the two gears are set to the same number of teeth. A processing machine comprising the loading / unloading device according to any one of claims 1 to 3, wherein the processing machine includes a workpiece transfer means for taking out the workpiece from a cassette for storing the workpiece. A holding table for holding the workpiece when the workpiece is processed, and
  The processing machine, wherein the workpiece is taken out from the cassette by the workpiece conveying means, and is carried into and out of the holding table by the loading / unloading device.   The processing machine is provided with a temporary table, and after the workpiece taken out by the workpiece conveying means is aligned on the temporary table, the holding table is moved by the loading / unloading device. The processing machine of Claim 4 carried in / out.

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