HK1211133A1 - 具備防振裝置的曝光裝置 - Google Patents

具備防振裝置的曝光裝置

Info

Publication number
HK1211133A1
HK1211133A1 HK15111737.8A HK15111737A HK1211133A1 HK 1211133 A1 HK1211133 A1 HK 1211133A1 HK 15111737 A HK15111737 A HK 15111737A HK 1211133 A1 HK1211133 A1 HK 1211133A1
Authority
HK
Hong Kong
Prior art keywords
damper
device provided
exposure device
exposure
Prior art date
Application number
HK15111737.8A
Other languages
English (en)
Inventor
Sato Shinji
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of HK1211133A1 publication Critical patent/HK1211133A1/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70766—Reaction force control means, e.g. countermass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
HK15111737.8A 2012-10-12 2015-11-27 具備防振裝置的曝光裝置 HK1211133A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012227214 2012-10-12
PCT/JP2013/077309 WO2014057925A1 (ja) 2012-10-12 2013-10-08 防振装置を備えた露光装置

Publications (1)

Publication Number Publication Date
HK1211133A1 true HK1211133A1 (zh) 2016-05-13

Family

ID=50477392

Family Applications (2)

Application Number Title Priority Date Filing Date
HK15111451.2A HK1210871A1 (zh) 2012-10-12 2015-11-19 具備防振裝置的曝光裝置
HK15111737.8A HK1211133A1 (zh) 2012-10-12 2015-11-27 具備防振裝置的曝光裝置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK15111451.2A HK1210871A1 (zh) 2012-10-12 2015-11-19 具備防振裝置的曝光裝置

Country Status (8)

Country Link
US (4) US9494870B2 (zh)
EP (1) EP2908332B1 (zh)
JP (3) JP6304036B2 (zh)
KR (1) KR102206131B1 (zh)
CN (2) CN109031895A (zh)
HK (2) HK1210871A1 (zh)
TW (3) TWI716800B (zh)
WO (1) WO2014057925A1 (zh)

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US9323160B2 (en) 2012-04-10 2016-04-26 Nikon Corporation Liquid immersion member, exposure apparatus, exposure method, device fabricating method, program, and recording medium
US9823580B2 (en) 2012-07-20 2017-11-21 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
US9568828B2 (en) 2012-10-12 2017-02-14 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
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US9720331B2 (en) 2012-12-27 2017-08-01 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
US9651873B2 (en) 2012-12-27 2017-05-16 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
WO2015052781A1 (ja) 2013-10-08 2015-04-16 株式会社ニコン 液浸部材、露光装置及び露光方法、並びにデバイス製造方法
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US8233139B2 (en) * 2008-03-27 2012-07-31 Nikon Corporation Immersion system, exposure apparatus, exposing method, and device fabricating method
US8896806B2 (en) * 2008-12-29 2014-11-25 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US9223225B2 (en) 2010-01-08 2015-12-29 Nikon Corporation Liquid immersion member, exposure apparatus, exposure method, and device manufacturing method
JP2012084879A (ja) * 2010-10-14 2012-04-26 Nikon Corp 液浸露光装置、液浸露光方法、デバイス製造方法、プログラム、及び記録媒体
US9323160B2 (en) 2012-04-10 2016-04-26 Nikon Corporation Liquid immersion member, exposure apparatus, exposure method, device fabricating method, program, and recording medium
US9268231B2 (en) * 2012-04-10 2016-02-23 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
US9823580B2 (en) 2012-07-20 2017-11-21 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
US9494870B2 (en) * 2012-10-12 2016-11-15 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9568828B2 (en) 2012-10-12 2017-02-14 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9651873B2 (en) 2012-12-27 2017-05-16 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
US9720331B2 (en) 2012-12-27 2017-08-01 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium

Also Published As

Publication number Publication date
TW201812482A (zh) 2018-04-01
JP2018092195A (ja) 2018-06-14
WO2014057925A1 (ja) 2014-04-17
KR102206131B1 (ko) 2021-01-21
EP2908332B1 (en) 2021-02-17
CN104838470A (zh) 2015-08-12
JPWO2014057925A1 (ja) 2016-09-05
CN104838470B (zh) 2018-09-21
US20170060002A1 (en) 2017-03-02
EP2908332A4 (en) 2017-01-25
US20150277236A1 (en) 2015-10-01
TWI620030B (zh) 2018-04-01
TW201415175A (zh) 2014-04-16
TWI716800B (zh) 2021-01-21
US9915882B2 (en) 2018-03-13
TWI652553B (zh) 2019-03-01
US9494870B2 (en) 2016-11-15
JP2019219686A (ja) 2019-12-26
EP2908332A1 (en) 2015-08-19
JP6304036B2 (ja) 2018-04-04
HK1210871A1 (zh) 2016-06-24
JP6583453B2 (ja) 2019-10-02
US20180196359A1 (en) 2018-07-12
CN109031895A (zh) 2018-12-18
KR20150065864A (ko) 2015-06-15
TW201921168A (zh) 2019-06-01
US20140253886A1 (en) 2014-09-11
US10599050B2 (en) 2020-03-24

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