HK1207435A1 - 用於電子器件的熱虹吸系統 - Google Patents

用於電子器件的熱虹吸系統

Info

Publication number
HK1207435A1
HK1207435A1 HK15107875.8A HK15107875A HK1207435A1 HK 1207435 A1 HK1207435 A1 HK 1207435A1 HK 15107875 A HK15107875 A HK 15107875A HK 1207435 A1 HK1207435 A1 HK 1207435A1
Authority
HK
Hong Kong
Prior art keywords
electronic devices
thermosiphon systems
thermosiphon
systems
electronic
Prior art date
Application number
HK15107875.8A
Other languages
English (en)
Inventor
Jeremy Rice
Jeffrey S Spaulding
Huan D Nguyen
Original Assignee
Google Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Google Inc filed Critical Google Inc
Publication of HK1207435A1 publication Critical patent/HK1207435A1/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
HK15107875.8A 2012-07-12 2015-08-14 用於電子器件的熱虹吸系統 HK1207435A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/548,046 US9869519B2 (en) 2012-07-12 2012-07-12 Thermosiphon systems for electronic devices
PCT/US2013/049768 WO2014011664A1 (en) 2012-07-12 2013-07-09 Thermosiphon systems for electronic devices

Publications (1)

Publication Number Publication Date
HK1207435A1 true HK1207435A1 (zh) 2016-01-29

Family

ID=49912940

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15107875.8A HK1207435A1 (zh) 2012-07-12 2015-08-14 用於電子器件的熱虹吸系統

Country Status (8)

Country Link
US (3) US9869519B2 (zh)
EP (1) EP2872962B1 (zh)
CN (1) CN104364728B (zh)
DE (1) DE202013012533U1 (zh)
DK (1) DK2872962T3 (zh)
HK (1) HK1207435A1 (zh)
TW (2) TWI629859B (zh)
WO (1) WO2014011664A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3194875B1 (en) 2014-09-15 2021-03-24 Aavid Thermalloy, LLC Arrangement comprising a thermosiphon device with bent tube section
US9552025B2 (en) 2014-09-23 2017-01-24 Google Inc. Cooling electronic devices in a data center
US10448543B2 (en) 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
US10462935B2 (en) * 2015-06-23 2019-10-29 Google Llc Cooling electronic devices in a data center
US10349561B2 (en) * 2016-04-15 2019-07-09 Google Llc Cooling electronic devices in a data center
WO2017208461A1 (ja) * 2016-06-03 2017-12-07 株式会社日立製作所 沸騰冷却装置、及びそれを搭載した電子装置
US11839062B2 (en) 2016-08-02 2023-12-05 Munters Corporation Active/passive cooling system
US11255611B2 (en) 2016-08-02 2022-02-22 Munters Corporation Active/passive cooling system
US10306809B1 (en) * 2017-12-13 2019-05-28 Oath Inc. Server rack integrated with cold air delivery
US10568238B1 (en) * 2018-08-10 2020-02-18 Facebook, Inc. Modular network switch
WO2020197586A1 (en) 2019-03-27 2020-10-01 Google Llc Cooling electronic devices in a data center
CN112020266A (zh) * 2019-05-31 2020-12-01 中科寒武纪科技股份有限公司 多用途散热器及其制造方法、板卡和多用途散热器平台
CN113050762A (zh) * 2019-12-27 2021-06-29 华为技术有限公司 一种散热装置及服务器
CN111465285B (zh) * 2020-04-30 2022-06-21 湖北三江航天万峰科技发展有限公司 一种高密度数字电源的散热结构及电源组件
CN111927589B (zh) * 2020-07-16 2022-07-12 南方海洋科学与工程广东省实验室(湛江) 基于无泵引射增压技术的朗肯循环系统及循环方法
US20230225080A1 (en) * 2022-01-12 2023-07-13 Arista Networks, Inc. Hybrid heatsink system

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE754415A (fr) * 1969-09-22 1971-01-18 Chausson Usines Sa Procede pour le brasage de faisceaux de radiateurs en aluminiumet installation pour l'execution de ce brasage
US4027728A (en) * 1975-03-31 1977-06-07 Mitsubishi Denki Kabushiki Kaisha Vapor cooling device for semiconductor device
US4274479A (en) 1978-09-21 1981-06-23 Thermacore, Inc. Sintered grooved wicks
US5076351A (en) * 1989-07-19 1991-12-31 Showa Aluminum Corporation Heat pipe
JPH0351697A (ja) 1989-07-19 1991-03-06 Showa Alum Corp ヒートパイプ
SE503322C2 (sv) 1995-03-17 1996-05-28 Ericsson Telefon Ab L M Kylsystem för elektronik
JP3255818B2 (ja) * 1995-03-20 2002-02-12 カルソニックカンセイ株式会社 電子部品用冷却装置
TW307837B (zh) * 1995-05-30 1997-06-11 Fujikura Kk
US6073683A (en) 1995-07-05 2000-06-13 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same
US5737923A (en) * 1995-10-17 1998-04-14 Marlow Industries, Inc. Thermoelectric device with evaporating/condensing heat exchanger
US6005772A (en) * 1997-05-20 1999-12-21 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
EP1035398B1 (en) * 1999-03-05 2004-01-14 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US6298909B1 (en) * 2000-03-01 2001-10-09 Mitsubishi Shindoh Co. Ltd. Heat exchange tube having a grooved inner surface
IL151928A0 (en) * 2000-03-30 2003-04-10 Whitehead Biomedical Inst Rna sequence-specific mediators of rna interference
JP2002013885A (ja) 2000-06-28 2002-01-18 Twinbird Corp 冷凍機用サーモサイフォン
WO2002046677A1 (en) * 2000-12-04 2002-06-13 Fujitsu Limited Cooling system and heat absorbing device
JP2002198675A (ja) * 2000-12-26 2002-07-12 Fujitsu Ltd 電子機器
US7556086B2 (en) * 2001-04-06 2009-07-07 University Of Maryland, College Park Orientation-independent thermosyphon heat spreader
JP3918502B2 (ja) * 2001-10-25 2007-05-23 株式会社デンソー 沸騰冷却装置
JP2003214750A (ja) * 2002-01-23 2003-07-30 Twinbird Corp サーモサイフォン
KR100906769B1 (ko) * 2002-01-31 2009-07-10 한라공조주식회사 오뚜기형 유로를 갖는 열교환기용 튜브 및 이를 이용한열교환기
JP2003234590A (ja) * 2002-02-08 2003-08-22 Denso Corp 沸騰冷却装置
US6793012B2 (en) * 2002-05-07 2004-09-21 Valeo, Inc Heat exchanger
US6840311B2 (en) 2003-02-25 2005-01-11 Delphi Technologies, Inc. Compact thermosiphon for dissipating heat generated by electronic components
US7487643B2 (en) * 2003-07-23 2009-02-10 Sharp Kabushiki Kaisha Loop type thermo syphone, heat radiation system, heat exchange system, and stirling cooling chamber
US7013955B2 (en) 2003-07-28 2006-03-21 Thermal Corp. Flexible loop thermosyphon
US6917522B1 (en) 2003-12-29 2005-07-12 Intel Corporation Apparatus and method for cooling integrated circuit devices
KR100866918B1 (ko) * 2004-03-31 2008-11-04 벨리츠 컴퓨터 시스템즈 아이엔씨 컴퓨터 및 다른 전자 기기를 위한 써모싸이펀에 기반을 둔낮은 프로파일의 냉각 시스템
US7154749B2 (en) 2004-06-08 2006-12-26 Nvidia Corporation System for efficiently cooling a processor
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
US7246655B2 (en) * 2004-12-17 2007-07-24 Fujikura Ltd. Heat transfer device
TWI273210B (en) * 2004-12-30 2007-02-11 Delta Electronics Inc Heat-dissipation device and fabricating method thereof
US7604040B2 (en) * 2005-06-15 2009-10-20 Coolit Systems Inc. Integrated liquid cooled heat sink for electronic components
CN100491888C (zh) * 2005-06-17 2009-05-27 富准精密工业(深圳)有限公司 环路式热交换装置
TW200821801A (en) * 2006-11-08 2008-05-16 Jiun-Guang Luo Case having phase-change heat dissipating device
US7497249B2 (en) * 2007-03-30 2009-03-03 Delphi Technologies, Inc. Thermosiphon for laptop computer
US7650928B2 (en) * 2007-03-30 2010-01-26 Coolit Systems Inc. High performance compact thermosiphon with integrated boiler plate
TWM320294U (en) * 2007-04-18 2007-10-01 Cooler Master Co Ltd Heat radiator structure
US7770632B2 (en) * 2007-09-26 2010-08-10 Coolit Systems, Inc. Thermosiphon for laptop computers comprising a boiling chamber with a square wave partition
WO2010027311A1 (en) 2008-09-08 2010-03-11 Telefonaktiebolaget Lm Ericsson (Publ) A cooling system for electronic devices and a cabinet including such a system
JP4658174B2 (ja) 2008-09-24 2011-03-23 株式会社日立製作所 電子装置
US20100154788A1 (en) 2008-12-19 2010-06-24 Skyline Solar, Inc. Solar receiver
JP2012132661A (ja) 2010-12-01 2012-07-12 Fujitsu Ltd 冷却装置及び電子装置

Also Published As

Publication number Publication date
WO2014011664A1 (en) 2014-01-16
EP2872962A4 (en) 2016-08-17
US20180135917A1 (en) 2018-05-17
CN104364728B (zh) 2019-07-12
TW201836246A (zh) 2018-10-01
EP2872962A1 (en) 2015-05-20
CN104364728A (zh) 2015-02-18
US20140014303A1 (en) 2014-01-16
US20160097602A1 (en) 2016-04-07
US9970713B2 (en) 2018-05-15
TWI629859B (zh) 2018-07-11
DK2872962T3 (da) 2019-07-22
TW201414145A (zh) 2014-04-01
TWI674738B (zh) 2019-10-11
US10612861B2 (en) 2020-04-07
DE202013012533U1 (de) 2017-05-12
EP2872962B1 (en) 2019-05-01
US9869519B2 (en) 2018-01-16

Similar Documents

Publication Publication Date Title
HK1207435A1 (zh) 用於電子器件的熱虹吸系統
GB2502305B (en) Electronic reading devices
AP00340S1 (en) Electronic devices
AU349387S (en) Electronic device
AU348054S (en) Electronic device
AU347002S (en) Electronic device
AU348291S (en) Electronic device
EP2816462A4 (en) ELECTRONIC DEVICE
GB201214425D0 (en) Electronic device
SG11201404734SA (en) Electronic device
SG2012072161A (en) An electronic device
EP2800395A4 (en) ELECTRONIC DEVICE
EP2793484A4 (en) ELECTRONIC DEVICE
EP2916440A4 (en) ELECTRIC CIRCUIT
GB2504560B (en) Cases for portable electronic devices
AP00415S1 (en) Electronic device
EP2811721A4 (en) ELECTRONIC DEVICE
GB201322751D0 (en) Electronic device
AP00414S1 (en) Electronic device
HK1176797A2 (en) Protective cases for electronic devices
SG2012072146A (en) An electronic device
AP00380S1 (en) Electronic devices
EP2699065A4 (en) CIRCUIT BOARD
GB201419751D0 (en) Content-based navigation for electronic devices
AP00339S1 (en) Electronic Device