HK1198305A1 - Motor with built-in power conversion device, air conditioner with same motor built-in, water heater, and ventilation blower equipment - Google Patents

Motor with built-in power conversion device, air conditioner with same motor built-in, water heater, and ventilation blower equipment

Info

Publication number
HK1198305A1
HK1198305A1 HK14111831.4A HK14111831A HK1198305A1 HK 1198305 A1 HK1198305 A1 HK 1198305A1 HK 14111831 A HK14111831 A HK 14111831A HK 1198305 A1 HK1198305 A1 HK 1198305A1
Authority
HK
Hong Kong
Prior art keywords
built
motor
air conditioner
water heater
power conversion
Prior art date
Application number
HK14111831.4A
Other languages
English (en)
Chinese (zh)
Inventor
山田倫雄
尾屋准郎
麻生洋樹
石井博幸
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of HK1198305A1 publication Critical patent/HK1198305A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/33—Drive circuits, e.g. power electronics
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/0094—Structural association with other electrical or electronic devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/21—Devices for sensing speed or position, or actuated thereby
    • H02K11/215—Magnetic effect devices, e.g. Hall-effect or magneto-resistive elements
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/08—Insulating casings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/70—Control systems characterised by their outputs; Constructional details thereof
    • F24F11/80—Control systems characterised by their outputs; Constructional details thereof for controlling the temperature of the supplied air
    • F24F11/83—Control systems characterised by their outputs; Constructional details thereof for controlling the temperature of the supplied air by controlling the supply of heat-exchange fluids to heat-exchangers
    • F24F11/85—Control systems characterised by their outputs; Constructional details thereof for controlling the temperature of the supplied air by controlling the supply of heat-exchange fluids to heat-exchangers using variable-flow pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
    • H02K15/12—Impregnating, heating or drying of windings, stators, rotors or machines
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
    • H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
    • H02P27/06—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using dc to ac converters or inverters

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inverter Devices (AREA)
HK14111831.4A 2011-12-13 2014-11-21 Motor with built-in power conversion device, air conditioner with same motor built-in, water heater, and ventilation blower equipment HK1198305A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/078808 WO2013088518A1 (ja) 2011-12-13 2011-12-13 電力変換装置内蔵モータ、このモータを内蔵した空気調和機、給湯器、および換気送風機器

Publications (1)

Publication Number Publication Date
HK1198305A1 true HK1198305A1 (en) 2015-03-27

Family

ID=48612006

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14111831.4A HK1198305A1 (en) 2011-12-13 2014-11-21 Motor with built-in power conversion device, air conditioner with same motor built-in, water heater, and ventilation blower equipment

Country Status (6)

Country Link
US (1) US9698656B2 (de)
EP (1) EP2793369B1 (de)
JP (1) JP5766302B2 (de)
CN (1) CN204442051U (de)
HK (1) HK1198305A1 (de)
WO (1) WO2013088518A1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104104188B (zh) * 2013-04-09 2016-09-14 日本电产株式会社 具有改进电路板的马达
JP6371001B2 (ja) * 2015-05-27 2018-08-08 株式会社日立製作所 電力変換装置
KR102127750B1 (ko) * 2015-08-04 2020-06-29 엘지이노텍 주식회사 회로기판, 모터 및 전동식 조향장치
KR101821878B1 (ko) * 2016-02-24 2018-01-24 엘에스산전 주식회사 인버터
WO2018025367A1 (ja) * 2016-08-04 2018-02-08 三菱電機株式会社 電動機および空気調和装置
EP3522340B1 (de) * 2016-09-28 2023-10-18 Mitsubishi Electric Corporation Elektromotor, gebläse, klimaanlage und verfahren zur herstellung eines elektromotors
JP6929820B2 (ja) * 2018-05-23 2021-09-01 ミネベアミツミ株式会社 回路基板、モータユニット、およびファン
CN109005638B (zh) * 2018-09-07 2024-04-05 英迪迈智能驱动技术无锡股份有限公司 一种用于筒状电机的pcb布局结构
CN109005639B (zh) * 2018-09-07 2024-05-07 英迪迈智能驱动技术无锡股份有限公司 一种用于筒状电机的pcb布局结构
US20220385208A1 (en) * 2019-11-29 2022-12-01 Mitsubishi Electric Corporation Power conversion device and machine learning device

Family Cites Families (18)

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DE69113528T2 (de) 1990-07-06 1996-02-29 Hitachi Ltd Bürstenloser Motor mit eingebautem integriertem Schaltkreis, welcher einen peripheren Schaltkreis mit einem Chip beinhaltet.
JP2960754B2 (ja) * 1990-07-06 1999-10-12 株式会社日立製作所 ファン駆動用電動機
JPH0591708A (ja) 1991-09-25 1993-04-09 Matsushita Electric Ind Co Ltd ブラシレスモータ
JPH09135058A (ja) 1995-11-08 1997-05-20 Zojirushi Corp プリント配線板
JP2920754B2 (ja) 1997-01-14 1999-07-19 芝浦メカトロニクス株式会社 ブラシレス直流モータの駆動装置
JP2002319746A (ja) 2001-04-20 2002-10-31 Tohoku Ricoh Co Ltd 雷サージ電圧回避装置
JP4693278B2 (ja) * 2001-05-09 2011-06-01 日本電産シバウラ株式会社 モールドモータ
JP4158487B2 (ja) 2002-10-31 2008-10-01 オムロン株式会社 安全電源装置
JP2005253165A (ja) 2004-03-03 2005-09-15 Matsushita Electric Ind Co Ltd モータ駆動回路およびブラシレスモータ
JP4509735B2 (ja) 2004-10-27 2010-07-21 三菱電機株式会社 電動機の駆動装置及びモールド電動機及び空気調和機及び冷蔵庫及び換気扇
WO2007080748A1 (ja) * 2006-01-16 2007-07-19 Mitsubishi Electric Corporation 電動機の駆動回路及び空気調和機の室外機
US7958741B2 (en) * 2006-04-12 2011-06-14 Delphi Technologies, Inc. Integrally molded motor isolation system
JP4698621B2 (ja) 2007-01-29 2011-06-08 三菱電機株式会社 電力変換回路を内蔵したモータおよびそれを搭載した機器
JP2009219268A (ja) * 2008-03-11 2009-09-24 Daikin Ind Ltd 電力変換装置
JP5173877B2 (ja) * 2009-02-09 2013-04-03 三菱電機株式会社 電力変換装置、それを内蔵した駆動回路内蔵モーター、並びに、その駆動回路内蔵モーターを搭載した換気扇、空気調和機の室内機、空気調和機、ポンプ及びそのポンプを搭載した給湯機
JP5063651B2 (ja) 2009-09-07 2012-10-31 三菱電機株式会社 電動機及び電気機器及び電動機の製造方法
JP5627697B2 (ja) 2010-09-15 2014-11-19 三菱電機株式会社 電力変換装置、それを内蔵したモーター、そのモーターを搭載した空気調和機、及びそのモーターを搭載した換気送風機器
JP5345124B2 (ja) * 2010-12-10 2013-11-20 三菱電機株式会社 電力変換回路を内蔵したモータを搭載した空気調和機

Also Published As

Publication number Publication date
EP2793369B1 (de) 2017-07-19
US9698656B2 (en) 2017-07-04
JPWO2013088518A1 (ja) 2015-04-27
JP5766302B2 (ja) 2015-08-19
CN204442051U (zh) 2015-07-01
EP2793369A1 (de) 2014-10-22
US20140311716A1 (en) 2014-10-23
WO2013088518A1 (ja) 2013-06-20
EP2793369A4 (de) 2015-11-18

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