HK1197213A1 - Method and apparatus for manufacturing bonded member - Google Patents

Method and apparatus for manufacturing bonded member

Info

Publication number
HK1197213A1
HK1197213A1 HK14110789A HK14110789A HK1197213A1 HK 1197213 A1 HK1197213 A1 HK 1197213A1 HK 14110789 A HK14110789 A HK 14110789A HK 14110789 A HK14110789 A HK 14110789A HK 1197213 A1 HK1197213 A1 HK 1197213A1
Authority
HK
Hong Kong
Prior art keywords
bonded member
manufacturing bonded
manufacturing
bonded
Prior art date
Application number
HK14110789A
Other languages
English (en)
Chinese (zh)
Inventor
鈴木隆之
中村昌寬
斋藤智之
脅坂雄介
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of HK1197213A1 publication Critical patent/HK1197213A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Liquid Crystal (AREA)
  • Laminated Bodies (AREA)
HK14110789A 2012-11-13 2014-10-28 Method and apparatus for manufacturing bonded member HK1197213A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012249053A JP5345239B1 (ja) 2012-11-13 2012-11-13 接合部材製造方法及び装置

Publications (1)

Publication Number Publication Date
HK1197213A1 true HK1197213A1 (en) 2015-01-09

Family

ID=49764854

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14110789A HK1197213A1 (en) 2012-11-13 2014-10-28 Method and apparatus for manufacturing bonded member

Country Status (4)

Country Link
US (1) US9340000B2 (ja)
JP (1) JP5345239B1 (ja)
CN (1) CN103802439B (ja)
HK (1) HK1197213A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10018211B2 (en) 2014-02-11 2018-07-10 GM Global Technology Operations LLC Bond standoffs for sliding positioning of components in an assembly
KR102038740B1 (ko) * 2016-07-19 2019-10-31 (주)화이트스톤 곡면 커버 글라스 보호필름, 이의 부착장치 및 이를 이용한 곡면 커버 글라스 보호필름의 부착방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3962015A (en) * 1974-12-20 1976-06-08 Fruehauf Corporation Method of assembling roof sheets to roof bows
JPH07130017A (ja) * 1993-11-08 1995-05-19 Canon Inc 光磁気記録媒体の製造方法および光磁気記録媒体
JPH08209076A (ja) * 1995-01-31 1996-08-13 Omron Corp 平板貼り合わせ方法及び平板貼り合わせ装置
JP3678349B2 (ja) * 2001-02-26 2005-08-03 オリジン電気株式会社 板状物の貼り合わせ装置および板状物の貼り合わせ方法
JP4069867B2 (ja) * 2004-01-05 2008-04-02 セイコーエプソン株式会社 部材の接合方法
JP2005193563A (ja) * 2004-01-08 2005-07-21 Asahi Glass Co Ltd 枠材付き窓用板状体の製造方法
EP1860167A1 (de) * 2006-05-24 2007-11-28 Sika Technology AG Klebverbundkörper mit erhöhter Haftung
US8241448B2 (en) * 2006-11-09 2012-08-14 The Boeing Company Film adhesive bonding apparatus and process
US7924362B2 (en) * 2007-04-20 2011-04-12 Via Optronics, Llc Bezelless display system having a display assembly with an overlay including a transparent section optically bonded to a display region with an optical layer that includes a pre-cured adhesive preform
JP5475255B2 (ja) 2008-07-17 2014-04-16 オリジン電気株式会社 接合部材の製造方法及び接合部材製造装置
KR101752020B1 (ko) * 2009-10-07 2017-06-28 데쿠세리아루즈 가부시키가이샤 접착 장치, 판상 접착체의 제조 방법
JP2011141409A (ja) * 2010-01-07 2011-07-21 Canon Inc ディスプレイの製造方法
JP5460418B2 (ja) * 2010-03-29 2014-04-02 オリジン電気株式会社 接合部材の製造方法及び接合部材製造装置

Also Published As

Publication number Publication date
US9340000B2 (en) 2016-05-17
CN103802439B (zh) 2016-01-20
CN103802439A (zh) 2014-05-21
JP2014098059A (ja) 2014-05-29
JP5345239B1 (ja) 2013-11-20
US20140150951A1 (en) 2014-06-05

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