HK1196391A1 - 用在電子器件上的單組分雙固化粘合劑 - Google Patents

用在電子器件上的單組分雙固化粘合劑

Info

Publication number
HK1196391A1
HK1196391A1 HK14109661.3A HK14109661A HK1196391A1 HK 1196391 A1 HK1196391 A1 HK 1196391A1 HK 14109661 A HK14109661 A HK 14109661A HK 1196391 A1 HK1196391 A1 HK 1196391A1
Authority
HK
Hong Kong
Prior art keywords
electronics
dual
component
cure adhesive
cure
Prior art date
Application number
HK14109661.3A
Other languages
English (en)
Inventor
Albert M Giorgini
Original Assignee
Fuller H B Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuller H B Co filed Critical Fuller H B Co
Publication of HK1196391A1 publication Critical patent/HK1196391A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
HK14109661.3A 2011-07-22 2014-09-25 用在電子器件上的單組分雙固化粘合劑 HK1196391A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161510806P 2011-07-22 2011-07-22
PCT/US2012/047393 WO2013016133A2 (en) 2011-07-22 2012-07-19 A one-component, dual-cure adhesive for use on electronics

Publications (1)

Publication Number Publication Date
HK1196391A1 true HK1196391A1 (zh) 2014-12-12

Family

ID=46551965

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14109661.3A HK1196391A1 (zh) 2011-07-22 2014-09-25 用在電子器件上的單組分雙固化粘合劑

Country Status (5)

Country Link
US (1) US20140242322A1 (zh)
KR (1) KR20140044868A (zh)
CN (1) CN103703087B (zh)
HK (1) HK1196391A1 (zh)
WO (1) WO2013016133A2 (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150159062A1 (en) * 2011-07-22 2015-06-11 Albert M. Giorgini Two part dual-cure adhesive for use in electronics
US9659832B2 (en) * 2011-07-22 2017-05-23 H.B. Fuller Company Reactive hot-melt adhesive for use on electronics
GB201215049D0 (en) * 2012-08-23 2012-10-10 Nipsea Technologies Pte Ltd A method of forming dual curable polymer compositions
KR102352334B1 (ko) * 2013-10-18 2022-01-17 세키스이가가쿠 고교가부시키가이샤 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제
CN114702631A (zh) * 2014-01-21 2022-07-05 积水化学工业株式会社 光湿气固化型树脂组合物、电子部件用粘接剂和显示元件用粘接剂
CN105579477B (zh) * 2014-03-26 2018-07-27 积水化学工业株式会社 光湿固化型树脂组合物、电子部件用粘接剂及显示元件用粘接剂
WO2015174371A1 (ja) * 2014-05-13 2015-11-19 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
KR102321552B1 (ko) * 2014-05-30 2021-11-03 세키스이가가쿠 고교가부시키가이샤 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제
KR102410694B1 (ko) * 2014-06-11 2022-06-17 세키스이가가쿠 고교가부시키가이샤 광 습기 경화형 수지 조성물, 전자 부품용 접착제 및 표시 소자용 접착제
TWI700349B (zh) 2014-08-15 2020-08-01 美商Ｈｂ富勒公司 可再使用之濕氣固化性熱熔黏著組成物，使用其之方法，及包括其之物品
JP6023359B2 (ja) * 2014-11-13 2016-11-09 積水化学工業株式会社 硬化体、電子部品、及び、表示素子
WO2016138445A1 (en) * 2015-02-27 2016-09-01 H.B. Fuller Company Oily chemical resistant moisture curable hot melt adhesive compositions and articles including the same
WO2016167305A1 (ja) * 2015-04-17 2016-10-20 積水化学工業株式会社 硬化体、電子部品、表示素子、及び、光湿気硬化型樹脂組成物
US10975275B2 (en) 2015-11-03 2021-04-13 Lord Corporation Elastomer adhesive with rapid tack development
ES2707985T3 (es) * 2015-11-11 2019-04-08 Henkel Ag & Co Kgaa Procedimiento de curado para poliuretanos
EP3168254B1 (de) * 2015-11-11 2018-06-27 Henkel AG & Co. KGaA Verfahren zur herstellung oder härtung von polymeren mittels thiol-en polyadditionsreaktionen
WO2017094831A1 (ja) * 2015-12-02 2017-06-08 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
KR20200047444A (ko) * 2017-09-15 2020-05-07 세키스이가가쿠 고교가부시키가이샤 광습기 경화형 수지 조성물, 전자 부품용 접착제 및 표시 소자용 접착제
CN108395847B (zh) * 2018-03-06 2020-12-22 江西绿安新材料有限公司 一种高强度光、热固化聚氨酯粘合剂及其制备方法和使用方法
WO2019241473A1 (en) * 2018-06-14 2019-12-19 H.B. Fuller Company Flame resistant hotmelt adhesive
CN109851751B (zh) * 2018-12-13 2021-01-15 江门市制漆厂有限公司 一种零voc可辐射固化/潮固化树脂及其制备方法
CN113242869A (zh) 2018-12-18 2021-08-10 积水化学工业株式会社 光湿固化性氨基甲酸酯系化合物、光湿固化性氨基甲酸酯预聚物及光湿固化性树脂组合物
CN112795347A (zh) * 2021-01-14 2021-05-14 广州回天新材料有限公司 一种可紫外光和湿气固化胶粘剂及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4352858A (en) 1981-09-04 1982-10-05 National Starch And Chemical Corp. Polyurethane adhesive compositions modified with a dicarbamate ester useful in laminating substrates
EP0250631A1 (en) 1986-07-02 1988-01-07 DeSOTO, INC. Ultraviolet curable buffer coatings for optical fiber
US4775719A (en) 1986-01-29 1988-10-04 H. B. Fuller Company Thermally stable hot melt moisture-cure polyurethane adhesive composition
US4808255A (en) 1987-05-07 1989-02-28 H. B. Fuller Company Thermally stable reactive hot melt urethane adhesive composition having a thermoplastic polymer, a compatible, curing urethane polyester polyol prepolymer and a tackifying agent
US4820368A (en) 1987-05-07 1989-04-11 H. B. Fuller Company Thermally stable reactive hot melt urethane adhesive composition having a thermoplastic polymer, a compatible, curing urethane polyalkylene polyol prepolymer and a tackifying agent
US4960844A (en) 1988-08-03 1990-10-02 Products Research & Chemical Corporation Silane terminated liquid polymers
US5781412A (en) * 1996-11-22 1998-07-14 Parker-Hannifin Corporation Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size
US6355317B1 (en) 1997-06-19 2002-03-12 H. B. Fuller Licensing & Financing, Inc. Thermoplastic moisture cure polyurethanes
US6221978B1 (en) 1998-04-09 2001-04-24 Henkel Corporation Moisture curable hot melt adhesive and method for bonding substrates using same
US6208031B1 (en) * 1999-03-12 2001-03-27 Fraivillig Technologies Circuit fabrication using a particle filled adhesive
US6387449B1 (en) 1999-12-01 2002-05-14 H. B. Fuller Licensing & Financing, Inc. Reactive hot melt adhesive
US6498210B1 (en) 2000-07-13 2002-12-24 Adco Products, Inc. Silylated polyurethanes for adhesives and sealants with improved mechanical properties
US7189781B2 (en) * 2003-03-13 2007-03-13 H.B. Fuller Licensing & Finance Inc. Moisture curable, radiation curable sealant composition
US8168737B2 (en) * 2006-12-21 2012-05-01 Dow Corning Corporation Dual curing polymers and methods for their preparation and use

Also Published As

Publication number Publication date
WO2013016133A2 (en) 2013-01-31
WO2013016133A3 (en) 2014-01-30
US20140242322A1 (en) 2014-08-28
KR20140044868A (ko) 2014-04-15
CN103703087A (zh) 2014-04-02
CN103703087B (zh) 2015-09-09

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190718