HK1183943A1 - 防塵薄膜組件的製造方法 - Google Patents
防塵薄膜組件的製造方法Info
- Publication number
- HK1183943A1 HK1183943A1 HK13111144.7A HK13111144A HK1183943A1 HK 1183943 A1 HK1183943 A1 HK 1183943A1 HK 13111144 A HK13111144 A HK 13111144A HK 1183943 A1 HK1183943 A1 HK 1183943A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- dust
- manufacturing
- prevention film
- film component
- component
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012031621A JP5663507B2 (ja) | 2012-02-16 | 2012-02-16 | ペリクルの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1183943A1 true HK1183943A1 (zh) | 2014-01-10 |
Family
ID=48961519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK13111144.7A HK1183943A1 (zh) | 2012-02-16 | 2013-09-30 | 防塵薄膜組件的製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5663507B2 (zh) |
KR (1) | KR102018067B1 (zh) |
CN (1) | CN103257522B (zh) |
HK (1) | HK1183943A1 (zh) |
TW (1) | TWI484288B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102366806B1 (ko) * | 2015-05-13 | 2022-02-23 | 삼성전자주식회사 | 열 축적을 방지하는 펠리클 및 이를 포함하는 극자외선 리소그래피 장치 |
KR102408849B1 (ko) | 2018-10-29 | 2022-06-13 | 구뎅 프리시젼 인더스트리얼 코포레이션 리미티드 | 레티클 유지 시스템 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2877841B2 (ja) * | 1989-06-12 | 1999-04-05 | 大日本印刷株式会社 | エマルジョンマスク等の欠陥修正装置 |
JPH09192875A (ja) * | 1996-01-10 | 1997-07-29 | Nikon Corp | レーザ加工装置 |
JPH1099978A (ja) * | 1996-09-27 | 1998-04-21 | Hitachi Ltd | レーザー加工装置 |
JP3346205B2 (ja) * | 1996-12-13 | 2002-11-18 | 信越化学工業株式会社 | ペリクルの製造方法 |
JPH1184632A (ja) | 1997-09-12 | 1999-03-26 | Nikon Corp | ペリクルの管理装置、投影露光装置および投影露光方法 |
US6894766B1 (en) * | 2001-03-27 | 2005-05-17 | Dupont Photomasks, Inc. | Method for constructing a photomask assembly using an encoded mark |
JP5096040B2 (ja) * | 2007-05-16 | 2012-12-12 | 日東電工株式会社 | レーザー加工方法及びレーザー加工品 |
-
2012
- 2012-02-16 JP JP2012031621A patent/JP5663507B2/ja active Active
- 2012-11-12 KR KR1020120127575A patent/KR102018067B1/ko active IP Right Grant
-
2013
- 2013-02-07 TW TW102104945A patent/TWI484288B/zh active
- 2013-02-07 CN CN201310049914.2A patent/CN103257522B/zh active Active
- 2013-09-30 HK HK13111144.7A patent/HK1183943A1/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN103257522A (zh) | 2013-08-21 |
KR102018067B1 (ko) | 2019-09-04 |
CN103257522B (zh) | 2016-05-04 |
TWI484288B (zh) | 2015-05-11 |
TW201346433A (zh) | 2013-11-16 |
KR20130094682A (ko) | 2013-08-26 |
JP5663507B2 (ja) | 2015-02-04 |
JP2013167795A (ja) | 2013-08-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20220205 |