HK1181065A1 - Conductive adhesive agent composition and conductive adhesive film - Google Patents

Conductive adhesive agent composition and conductive adhesive film

Info

Publication number
HK1181065A1
HK1181065A1 HK13108218.4A HK13108218A HK1181065A1 HK 1181065 A1 HK1181065 A1 HK 1181065A1 HK 13108218 A HK13108218 A HK 13108218A HK 1181065 A1 HK1181065 A1 HK 1181065A1
Authority
HK
Hong Kong
Prior art keywords
conductive adhesive
agent composition
adhesive film
adhesive agent
film
Prior art date
Application number
HK13108218.4A
Other languages
English (en)
Chinese (zh)
Inventor
木下淳
寺田恆彥
Original Assignee
大自達電線股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大自達電線股份有限公司 filed Critical 大自達電線股份有限公司
Publication of HK1181065A1 publication Critical patent/HK1181065A1/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/12Polyester-amides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10Homopolymers or copolymers of methacrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/06Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12Polyester-amides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
HK13108218.4A 2010-07-23 2013-07-12 Conductive adhesive agent composition and conductive adhesive film HK1181065A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010165781 2010-07-23
JP2011095060 2011-04-21
PCT/JP2011/004058 WO2012011265A1 (ja) 2010-07-23 2011-07-15 接着剤組成物及び接着フィルム

Publications (1)

Publication Number Publication Date
HK1181065A1 true HK1181065A1 (en) 2013-11-01

Family

ID=45496698

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13108218.4A HK1181065A1 (en) 2010-07-23 2013-07-12 Conductive adhesive agent composition and conductive adhesive film

Country Status (6)

Country Link
JP (1) JP5002074B2 (ja)
KR (1) KR101741292B1 (ja)
CN (1) CN102906211B (ja)
HK (1) HK1181065A1 (ja)
TW (1) TWI496863B (ja)
WO (1) WO2012011265A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014511029A (ja) * 2012-03-27 2014-05-01 エイブルスティック・(シャンハイ)・リミテッド コンデンサ用導電性コーティングおよびそれを用いたコンデンサ
TW201708482A (en) * 2012-06-29 2017-03-01 Tatsuta Electric Wire & Cable Co Ltd Conductive adhesive composition, conductive adhesive film, bonding method, and circuit board
JP6152319B2 (ja) 2013-08-09 2017-06-21 日東電工株式会社 粘着剤組成物、粘着テープ又はシート
WO2015068611A1 (ja) * 2013-11-07 2015-05-14 東洋インキScホールディングス株式会社 導電性接着剤、導電性接着シート、配線デバイス、および配線デバイスの製造方法
US10875283B2 (en) 2014-07-31 2020-12-29 Toagosei Co., Ltd. Adhesive layer-equipped laminate, and flexible copper-clad laminate sheet and flexible flat cable using same
CN104497546A (zh) * 2014-11-10 2015-04-08 苏州维泰生物技术有限公司 一种医用抗静电导磁聚氨酯薄膜及其制备方法
KR101797723B1 (ko) 2014-12-08 2017-11-14 셍기 테크놀로지 코. 엘티디. 접착용 수지 조성물, 접착용 필름 및 연성 금속 적층체
WO2024009969A1 (ja) * 2022-07-06 2024-01-11 東亞合成株式会社 接着剤組成物、ボンディングフィルム、接着剤組成物層付き積層体、積層体、及び、電磁波シールドフィルム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2571733B1 (fr) * 1984-10-16 1987-02-06 Atochem Compositions adhesives a base d'elastomeres thermoplastiques et de polyetheramides et leurs utilisations
JPS6386781A (ja) * 1986-09-30 1988-04-18 Sekisui Chem Co Ltd 異方導電性接着シ−ト
FR2662611B1 (fr) * 1990-06-01 1992-08-07 Salomon Sa Ski et elements de ski.
JPH093323A (ja) * 1995-06-19 1997-01-07 Taisei Plus Kk 熱融着性に優れた熱可塑性弾性体組成物
JP2001354938A (ja) * 2000-06-12 2001-12-25 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた接着剤シート、半導体接続用基板ならびに半導体装置
US7015284B2 (en) * 2004-01-06 2006-03-21 The Goodyear Tire & Rubber Company Thermoplastic elastomer composition
EP1925637B1 (en) * 2005-08-26 2014-02-26 Kuraray Co., Ltd. Thermoplastic elastomer composition and composite molded article manufactured from the same
JP4435253B2 (ja) * 2008-03-26 2010-03-17 住友ゴム工業株式会社 インナーライナーおよび空気入りタイヤ
JP4580021B2 (ja) * 2009-01-26 2010-11-10 タツタ電線株式会社 接着剤組成物

Also Published As

Publication number Publication date
JP5002074B2 (ja) 2012-08-15
CN102906211B (zh) 2014-11-05
TW201207066A (en) 2012-02-16
KR20130096636A (ko) 2013-08-30
TWI496863B (zh) 2015-08-21
KR101741292B1 (ko) 2017-05-29
JPWO2012011265A1 (ja) 2013-09-09
CN102906211A (zh) 2013-01-30
WO2012011265A1 (ja) 2012-01-26

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