HK1171871A1 - Anisotropic conductive adhesive film, connection structure and method for manufacturing same - Google Patents
Anisotropic conductive adhesive film, connection structure and method for manufacturing sameInfo
- Publication number
- HK1171871A1 HK1171871A1 HK12112615.6A HK12112615A HK1171871A1 HK 1171871 A1 HK1171871 A1 HK 1171871A1 HK 12112615 A HK12112615 A HK 12112615A HK 1171871 A1 HK1171871 A1 HK 1171871A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- connection structure
- adhesive film
- conductive adhesive
- anisotropic conductive
- manufacturing same
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010288005A JP6061443B2 (ja) | 2010-12-24 | 2010-12-24 | 異方性導電接着フィルム、接続構造体及びその製造方法 |
PCT/JP2011/071580 WO2012086278A1 (ja) | 2010-12-24 | 2011-09-22 | 異方性導電接着フィルム、接続構造体及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1171871A1 true HK1171871A1 (en) | 2013-04-05 |
Family
ID=44014451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12112615.6A HK1171871A1 (en) | 2010-12-24 | 2012-12-06 | Anisotropic conductive adhesive film, connection structure and method for manufacturing same |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6061443B2 (ko) |
KR (1) | KR101410185B1 (ko) |
CN (1) | CN102668251B (ko) |
HK (1) | HK1171871A1 (ko) |
WO (1) | WO2012086278A1 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015003935A (ja) * | 2011-10-20 | 2015-01-08 | 日立化成株式会社 | 接着剤組成物並びに接続構造体及びその製造方法 |
EP3484105A1 (en) | 2011-12-05 | 2019-05-15 | Assia Spe, Llc | Systems and methods for traffic aggregation on multiple wan backhauls and multiple distinct lan networks |
CN104342058B (zh) * | 2014-10-25 | 2016-08-24 | 深圳飞世尔新材料股份有限公司 | 一种光固化异方性导电膜的制备方法 |
CN107210923B (zh) | 2014-12-04 | 2020-12-15 | 适应性频谱和信号校正股份有限公司 | 用于预测成功的dsl线路优化的方法和装置 |
US10943879B2 (en) | 2015-01-13 | 2021-03-09 | Dexerials Corporation | Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure |
US10546831B2 (en) * | 2015-05-27 | 2020-01-28 | Dexerials Corporation | Anisotropic electrically conductive film and connection structure |
JP6659247B2 (ja) * | 2015-06-16 | 2020-03-04 | デクセリアルズ株式会社 | 接続体、接続体の製造方法、検査方法 |
CN105070351A (zh) * | 2015-06-30 | 2015-11-18 | 苏州纳微科技有限公司 | 一种柔韧导电微球及其应用 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4032439B2 (ja) * | 1996-05-23 | 2008-01-16 | 日立化成工業株式会社 | 接続部材および該接続部材を用いた電極の接続構造並びに接続方法 |
JPH11134935A (ja) * | 1997-10-29 | 1999-05-21 | Sekisui Finechem Co Ltd | 導電性微粒子、異方性導電接着剤及び導電接続構造体 |
JP3486346B2 (ja) * | 1998-07-16 | 2004-01-13 | ソニーケミカル株式会社 | ベアチップ実装構造 |
JP3379456B2 (ja) * | 1998-12-25 | 2003-02-24 | ソニーケミカル株式会社 | 異方導電性接着フィルム |
JP3738655B2 (ja) * | 2000-03-31 | 2006-01-25 | ソニーケミカル株式会社 | 異方性導電接着材料及び接続方法 |
JP3851767B2 (ja) * | 2000-10-16 | 2006-11-29 | ソニーケミカル&インフォメーションデバイス株式会社 | 接着フィルム、及び接着フィルムの製造方法 |
JP2008091843A (ja) * | 2006-10-04 | 2008-04-17 | Takatori Corp | 基板の圧着状態検査装置 |
CN101849266A (zh) * | 2007-11-12 | 2010-09-29 | 日立化成工业株式会社 | 电路连接材料以及电路部件的连接结构 |
-
2010
- 2010-12-24 JP JP2010288005A patent/JP6061443B2/ja active Active
-
2011
- 2011-09-22 CN CN201180004885.7A patent/CN102668251B/zh active Active
- 2011-09-22 WO PCT/JP2011/071580 patent/WO2012086278A1/ja active Application Filing
- 2011-09-22 KR KR1020127011026A patent/KR101410185B1/ko active IP Right Grant
-
2012
- 2012-12-06 HK HK12112615.6A patent/HK1171871A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
CN102668251B (zh) | 2015-04-29 |
KR101410185B1 (ko) | 2014-06-19 |
JP6061443B2 (ja) | 2017-01-18 |
WO2012086278A1 (ja) | 2012-06-28 |
CN102668251A (zh) | 2012-09-12 |
KR20120099424A (ko) | 2012-09-10 |
JP2011068913A (ja) | 2011-04-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1205366A1 (en) | Anisotropic conductive film and manufacturing method therefor | |
HK1205364A1 (en) | Anisotropic-conductive-film manufacturing method and anisotropic conductive film | |
EP2656955A4 (en) | Bonding method, bonding structure, electronic device, manufacturing method for electronic device, and electronic component | |
HK1206873A1 (en) | Method for manufacturing anisotropically conductive film, anisotropically conductive film, and connective structure | |
EP2623574A4 (en) | CONDUCTIVE ADHESIVE COMPOSITION, ELECTRONIC DEVICE, POSITIVE ELECTRODE LAMINATE, AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE | |
EP2765173A4 (en) | ANISOTROPER CONDUCTIVE ADHESIVE AND PRODUCTION PROCESS THEREFOR AND LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THEREOF | |
PL2768919T3 (pl) | Masa klejąca, w szczególności do hermetyzacji układu elektronicznego | |
EP2634778A4 (en) | TRANSPARENT CONDUCTIVE FILM, ELECTRONIC DEVICE AND METHOD FOR PRODUCING THE ELECTRONIC DEVICE | |
HK1205594A1 (en) | Anisotropic conductive film, connection method, and assembly | |
EP2548730A4 (en) | GLASS-RESIN LAMINATE, GLASS ROLL FOR THE WINDING OF THE LATTER AND METHOD OF MANUFACTURING THE GLASS ROLL | |
HK1171871A1 (en) | Anisotropic conductive adhesive film, connection structure and method for manufacturing same | |
EP2548995A4 (en) | MANUFACTURING METHOD FOR TRANSPARENT CONDUCTIVE CARBON LAYER AND TRANSPARENT CONDUCTIVE CARBON LAYER | |
EP2543507A4 (en) | Laminate, method for producing same, and functional element using same | |
HK1174433A1 (zh) | 導電性粒子及其製造方法以及各向導性導電膜、接合體及連接方法 | |
HK1139790A1 (en) | Anisotropic conductive film, joined structure and method for producing the joined structure | |
HK1220044A1 (zh) | 導電性粘接膜的製造方法、導電性粘接膜、連接體的製造方法 | |
HK1202132A1 (en) | Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive | |
EP2607520A4 (en) | SILVER-COATED SPHERETIC RESIN, MANUFACTURING METHOD, ANISOTROICALLY CONDUCTIVE ADHESIVE CONTAINING SILVER COATED SPHERETIC RESIN, ANISOTROCABLY CONDUCTIVE FILM CONTAINING SILVER-COATED SPHERETIC RESIN, AND CONDUCTIVE SPACER CONTAINING SILVER COATED SPHERETIC RESIN | |
EP2616977A4 (en) | Discrete element method | |
EP2530130A4 (en) | CONDUCTIVE TAPE | |
HK1206772A1 (en) | Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method | |
EP2642841A4 (en) | Electronic device | |
EP2626442A4 (en) | Dielectric film formation device and dielectric film formation method | |
TWI560400B (en) | Laminate film and method for manufacturing the same, and laminate structure | |
HK1181554A1 (en) | Anisotropic conductive film, method for producing connected body, and connected body |