HK1170028A1 - 圖案形成裝置、圖案形成方法以及裝置製造方法 - Google Patents

圖案形成裝置、圖案形成方法以及裝置製造方法

Info

Publication number
HK1170028A1
HK1170028A1 HK12110741.7A HK12110741A HK1170028A1 HK 1170028 A1 HK1170028 A1 HK 1170028A1 HK 12110741 A HK12110741 A HK 12110741A HK 1170028 A1 HK1170028 A1 HK 1170028A1
Authority
HK
Hong Kong
Prior art keywords
pattern forming
device manufacturing
manufacturing
forming method
forming device
Prior art date
Application number
HK12110741.7A
Other languages
English (en)
Inventor
木內徹
水谷英夫
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1170028A1 publication Critical patent/HK1170028A1/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Engineering & Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
HK12110741.7A 2009-07-17 2012-10-26 圖案形成裝置、圖案形成方法以及裝置製造方法 HK1170028A1 (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US22633009P 2009-07-17 2009-07-17
US22645809P 2009-07-17 2009-07-17
US12/822,773 US8235695B2 (en) 2009-07-17 2010-06-24 Pattern forming device, pattern forming method, and device manufacturing method
PCT/JP2010/062483 WO2011007901A1 (en) 2009-07-17 2010-07-16 Pattern forming device, pattern forming method, and device manufacturing method

Publications (1)

Publication Number Publication Date
HK1170028A1 true HK1170028A1 (zh) 2013-02-15

Family

ID=42782256

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12110741.7A HK1170028A1 (zh) 2009-07-17 2012-10-26 圖案形成裝置、圖案形成方法以及裝置製造方法

Country Status (6)

Country Link
US (2) US8235695B2 (zh)
KR (1) KR101689049B1 (zh)
CN (1) CN102472977B (zh)
HK (1) HK1170028A1 (zh)
TW (3) TWI592771B (zh)
WO (1) WO2011007901A1 (zh)

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US8379186B2 (en) * 2009-07-17 2013-02-19 Nikon Corporation Pattern formation apparatus, pattern formation method, and device manufacturing method
JP6206398B2 (ja) * 2012-03-15 2017-10-04 株式会社ニコン マスクユニット、基板処理装置及びマスクユニット製造方法並びに基板処理方法
WO2015069279A1 (en) * 2013-11-08 2015-05-14 Empire Technology Development Llc Apparatus and methods for detecting substrate alignment during a printing process
JP6269152B2 (ja) * 2014-02-24 2018-01-31 セイコーエプソン株式会社 印刷装置および印刷方法
WO2015133391A1 (ja) * 2014-03-07 2015-09-11 富士フイルム株式会社 トランジスタの製造方法
US10272611B2 (en) * 2015-01-23 2019-04-30 Dreamwell, Ltd. Mattress manufacturing process and apparatus
US20160266878A1 (en) * 2015-03-10 2016-09-15 Ca, Inc. Automatic wireframing using images
US10696540B2 (en) 2015-04-15 2020-06-30 Dreamwell, Ltd. Coil string staging area apparatus and method
US9556563B1 (en) * 2016-01-07 2017-01-31 Hui-Ping Yang Paper pulp molding device
RU2640732C2 (ru) * 2016-03-31 2018-01-11 Александр Вячеславович Радостин Способ получения информации для биометрической идентификации личности
JP6207671B1 (ja) * 2016-06-01 2017-10-04 キヤノン株式会社 パターン形成装置、基板配置方法及び物品の製造方法
CN109690402A (zh) * 2016-07-21 2019-04-26 凸版印刷株式会社 光掩模、光掩模制造方法、以及使用光掩模的滤色器的制造方法
KR102409423B1 (ko) * 2017-09-22 2022-06-16 주식회사 엘지에너지솔루션 레이저 송출 특성 값 결정방법
JP2019066750A (ja) * 2017-10-04 2019-04-25 株式会社ジャパンディスプレイ 表示装置
US20220163894A1 (en) * 2019-01-25 2022-05-26 Zhongshan Aiscent Technologies Co, Ltd. System and method for double-sided digital lithography or exposure
CN117253718B (zh) * 2023-10-27 2024-07-30 深圳市星特科技有限公司 全自动vcm绕线贴膜一体机绕线工艺

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KR100399813B1 (ko) * 1994-12-14 2004-06-09 가부시키가이샤 니콘 노광장치
US5652645A (en) 1995-07-24 1997-07-29 Anvik Corporation High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates
JPH0970731A (ja) * 1995-09-07 1997-03-18 Ushio Inc 搬送ステージ
JP2954535B2 (ja) * 1996-07-31 1999-09-27 大日本印刷株式会社 射出成形同時絵付方法及び装置
JP3417313B2 (ja) * 1998-09-28 2003-06-16 ウシオ電機株式会社 帯状ワークの露光装置
JP2000124296A (ja) * 1998-10-16 2000-04-28 Nikon Corp 試料保持装置および露光装置
JP2001215718A (ja) 1999-11-26 2001-08-10 Nikon Corp 露光装置及び露光方法
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JP2004341280A (ja) * 2003-05-16 2004-12-02 Dainippon Printing Co Ltd カラーフィルタの製造装置、カラーフィルタの製造方法、及びカラーフィルタ
JP4218418B2 (ja) 2003-05-23 2009-02-04 ウシオ電機株式会社 帯状ワークの両面投影露光装置
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Also Published As

Publication number Publication date
US20110012294A1 (en) 2011-01-20
TWI592771B (zh) 2017-07-21
TW201732457A (zh) 2017-09-16
US9152062B2 (en) 2015-10-06
TW201616246A (zh) 2016-05-01
CN102472977B (zh) 2015-11-25
TWI641919B (zh) 2018-11-21
TWI534550B (zh) 2016-05-21
US20120270144A1 (en) 2012-10-25
KR101689049B1 (ko) 2016-12-22
CN102472977A (zh) 2012-05-23
TW201109860A (en) 2011-03-16
WO2011007901A1 (en) 2011-01-20
US8235695B2 (en) 2012-08-07
KR20120045023A (ko) 2012-05-08

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20200721