HK1164790A1 - 劃割輪、劃割裝置、及劃割方法 - Google Patents

劃割輪、劃割裝置、及劃割方法

Info

Publication number
HK1164790A1
HK1164790A1 HK12105663.1A HK12105663A HK1164790A1 HK 1164790 A1 HK1164790 A1 HK 1164790A1 HK 12105663 A HK12105663 A HK 12105663A HK 1164790 A1 HK1164790 A1 HK 1164790A1
Authority
HK
Hong Kong
Prior art keywords
scribing
wheel
scribing wheel
scribing device
scribing method
Prior art date
Application number
HK12105663.1A
Other languages
English (en)
Inventor
留井直子
富森紘
Original Assignee
三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星鑽石工業股份有限公司 filed Critical 三星鑽石工業股份有限公司
Publication of HK1164790A1 publication Critical patent/HK1164790A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085—On sheet material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
HK12105663.1A 2010-07-29 2012-06-11 劃割輪、劃割裝置、及劃割方法 HK1164790A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010170088A JP5067457B2 (ja) 2010-07-29 2010-07-29 スクライビングホイール、スクライブ装置、およびスクライブ方法

Publications (1)

Publication Number Publication Date
HK1164790A1 true HK1164790A1 (zh) 2012-09-28

Family

ID=45542883

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12105663.1A HK1164790A1 (zh) 2010-07-29 2012-06-11 劃割輪、劃割裝置、及劃割方法

Country Status (5)

Country Link
JP (1) JP5067457B2 (zh)
KR (1) KR101254960B1 (zh)
CN (1) CN102343630B (zh)
HK (1) HK1164790A1 (zh)
TW (1) TWI438164B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013184388A (ja) * 2012-03-08 2013-09-19 Mitsuboshi Diamond Industrial Co Ltd スクライビングホイール及びその製造方法
TWI511939B (zh) * 2012-03-28 2015-12-11 Mitsuboshi Diamond Ind Co Ltd A scribing line, a scribing device, a scribing method, a manufacturing method for a display panel, and a display panel
WO2013161849A1 (ja) 2012-04-24 2013-10-31 株式会社東京精密 ダイシングブレード
JP5966600B2 (ja) * 2012-05-17 2016-08-10 三星ダイヤモンド工業株式会社 スクライブ処理システム
JP5994381B2 (ja) * 2012-05-17 2016-09-21 三星ダイヤモンド工業株式会社 スクライブ処理システム
KR102022754B1 (ko) 2012-06-15 2019-09-18 가부시키가이샤 토쿄 세이미쯔 다이싱 장치 및 다이싱 방법
JP6268805B2 (ja) * 2013-08-13 2018-01-31 日本電気硝子株式会社 ガラス板の製造方法
WO2015063960A1 (ja) * 2013-10-30 2015-05-07 坂東機工株式会社 ガラス板のスクライブ装置
JP6528356B2 (ja) * 2014-03-28 2019-06-12 三星ダイヤモンド工業株式会社 樹脂シートの分断方法
JP6507600B2 (ja) * 2014-12-02 2019-05-08 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法及び加工装置
JP6589380B2 (ja) * 2015-05-29 2019-10-16 三星ダイヤモンド工業株式会社 脆性材料基板における垂直クラックの形成方法および脆性材料基板の分断方法
JP6589381B2 (ja) * 2015-05-29 2019-10-16 三星ダイヤモンド工業株式会社 脆性材料基板における垂直クラックの形成方法および脆性材料基板の分断方法
JP6519381B2 (ja) * 2015-07-27 2019-05-29 三星ダイヤモンド工業株式会社 脆性材料基板における垂直クラックの形成方法および脆性材料基板の分断方法
JP6648448B2 (ja) * 2015-08-17 2020-02-14 三星ダイヤモンド工業株式会社 脆性材料基板における垂直クラックの形成方法および脆性材料基板の分断方法
JP7032789B2 (ja) * 2017-12-26 2022-03-09 三星ダイヤモンド工業株式会社 スクライブ方法およびスクライブ装置
TWI774883B (zh) * 2017-12-26 2022-08-21 日商三星鑽石工業股份有限公司 黏合基板的劃線方法以及劃線裝置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5832224B2 (ja) * 1978-09-27 1983-07-12 住友電気工業株式会社 工具用微細結晶焼結体およびその製造方法
JPH0435297Y2 (zh) * 1989-12-18 1992-08-21
JP2007031200A (ja) * 2005-07-27 2007-02-08 Allied Material Corp カッターホイール
JP2007126326A (ja) * 2005-11-04 2007-05-24 Sumitomo Electric Hardmetal Corp ダイヤモンド焼結体
JP5023547B2 (ja) * 2006-04-28 2012-09-12 坂東機工株式会社 ガラス板切断方法及びガラス板切断機
CN200977704Y (zh) * 2006-10-16 2007-11-21 赵启明 金刚石石材切割锯条
WO2008087612A1 (en) * 2007-01-19 2008-07-24 Dutch Diamond Technologies B.V. Cutting disk for forming a scribed line
WO2009148073A1 (ja) * 2008-06-05 2009-12-10 三星ダイヤモンド工業株式会社 スクライビングホイール及び脆性材料基板のスクライブ方法
KR20100065632A (ko) * 2008-12-08 2010-06-17 세메스 주식회사 스크라이브 휠

Also Published As

Publication number Publication date
CN102343630A (zh) 2012-02-08
TWI438164B (zh) 2014-05-21
JP5067457B2 (ja) 2012-11-07
CN102343630B (zh) 2014-11-26
KR20120025372A (ko) 2012-03-15
JP2012030992A (ja) 2012-02-16
TW201210964A (en) 2012-03-16
KR101254960B1 (ko) 2013-04-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190625