HK1155469A1 - Imide oligomer and polyimide resin obtained by thermal curing thereof - Google Patents

Imide oligomer and polyimide resin obtained by thermal curing thereof

Info

Publication number
HK1155469A1
HK1155469A1 HK11109644.8A HK11109644A HK1155469A1 HK 1155469 A1 HK1155469 A1 HK 1155469A1 HK 11109644 A HK11109644 A HK 11109644A HK 1155469 A1 HK1155469 A1 HK 1155469A1
Authority
HK
Hong Kong
Prior art keywords
polyimide resin
resin obtained
thermal curing
imide oligomer
imide
Prior art date
Application number
HK11109644.8A
Other languages
English (en)
Inventor
Hideo Nishino
Yasuyo Watanabe
Yoichiro Inoue
Original Assignee
Daiwa Can Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiwa Can Co Ltd filed Critical Daiwa Can Co Ltd
Publication of HK1155469A1 publication Critical patent/HK1155469A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
HK11109644.8A 2008-02-07 2011-09-13 Imide oligomer and polyimide resin obtained by thermal curing thereof HK1155469A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008027704 2008-02-07
JP2008027705 2008-02-07
PCT/JP2008/063512 WO2009098791A1 (fr) 2008-02-07 2008-07-28 Oligomère d'imide et résine de polyimide obtenue par durcissement thermique de celui-ci

Publications (1)

Publication Number Publication Date
HK1155469A1 true HK1155469A1 (en) 2012-05-18

Family

ID=40951878

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11109644.8A HK1155469A1 (en) 2008-02-07 2011-09-13 Imide oligomer and polyimide resin obtained by thermal curing thereof

Country Status (6)

Country Link
US (1) US20110003955A1 (fr)
EP (1) EP2246383A4 (fr)
CN (1) CN102015834B (fr)
HK (1) HK1155469A1 (fr)
TW (1) TWI475046B (fr)
WO (1) WO2009098791A1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9120898B2 (en) * 2011-07-08 2015-09-01 Baker Hughes Incorporated Method of curing thermoplastic polymer for shape memory material
US20130012635A1 (en) * 2011-07-08 2013-01-10 Baker Hughes Incorporated Cured thermoplastic polymer for shape memory material and articles formed therefrom
US8939222B2 (en) 2011-09-12 2015-01-27 Baker Hughes Incorporated Shaped memory polyphenylene sulfide (PPS) for downhole packer applications
US8829119B2 (en) 2011-09-27 2014-09-09 Baker Hughes Incorporated Polyarylene compositions for downhole applications, methods of manufacture, and uses thereof
CN103166940B (zh) * 2011-12-16 2017-03-22 中国移动通信集团公司 服务质量动态协商及优化方法和装置
CN102532896B (zh) * 2011-12-29 2014-05-14 复旦大学 一种改性石墨烯/聚酰亚胺树脂复合材料及其制备方法
US9144925B2 (en) 2012-01-04 2015-09-29 Baker Hughes Incorporated Shape memory polyphenylene sulfide manufacturing, process, and composition
US20130260131A1 (en) * 2012-03-28 2013-10-03 Satoshi Seike Thermoplastic molding preform
US20130309492A1 (en) * 2012-05-15 2013-11-21 Satoshi Seike Chopped carbon fiber
US20130309491A1 (en) * 2012-05-15 2013-11-21 Satoshi Seike Milled carbon fiber
US20130309925A1 (en) * 2012-05-15 2013-11-21 Satoshi Seike Carbon fiber fabric
US9707642B2 (en) 2012-12-07 2017-07-18 Baker Hughes Incorporated Toughened solder for downhole applications, methods of manufacture thereof and articles comprising the same
WO2014089521A1 (fr) * 2012-12-07 2014-06-12 Anayas360.Com, Llc Techniques de disposition de soc à ondes millimétriques fortement intégrées pour performances et précision de modélisation améliorées
KR101953369B1 (ko) * 2015-12-04 2019-02-28 주식회사 엘지화학 중합성 조성물
TWI665260B (zh) * 2017-09-19 2019-07-11 臻鼎科技股份有限公司 低介電聚醯亞胺組合物、聚醯亞胺、聚醯亞胺膜及覆銅板
EP3892672A4 (fr) * 2018-12-07 2022-08-31 Toyo Seikan Group Holdings, Ltd. Précurseur d'article moulé en résine de polyimide renforcée par des fibres et procédé pour la production de celui-ci
EP4151672A4 (fr) * 2020-05-11 2024-05-29 Daikin Industries, Ltd. Composé amide, composé comprenant un hétérocycle à teneur en azote, et produit réticulé
CN114181528A (zh) * 2020-09-14 2022-03-15 中国石油化工股份有限公司 热塑性聚酰亚胺组合物及其应用、热塑性聚酰亚胺制备及其应用
KR20230165904A (ko) * 2021-04-02 2023-12-05 제이에스알 가부시끼가이샤 절연막 형성용 감방사선성 조성물, 패턴을 갖는 수지막 및 반도체 회로 기판

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3551846B2 (ja) * 1998-11-25 2004-08-11 宇部興産株式会社 末端変性イミドオリゴマ−およびその硬化物
US6359107B1 (en) * 2000-05-18 2002-03-19 The United States Of America As Represented By The Administrator, National Aeronautics And Space Administration Composition of and method for making high performance resins for infusion and transfer molding processes
US7994274B2 (en) * 2003-09-02 2011-08-09 I.S.T. (Ma) Corporation Two-stage cure polyimide oligomers
US7129318B2 (en) * 2003-09-02 2006-10-31 I.S.T. (Ma) Corporation RTM and RI processable polyimide resins
US7015304B1 (en) * 2004-07-23 2006-03-21 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Solvent free low-melt viscosity imide oligomers and thermosetting polyimide composites
KR20070053799A (ko) * 2004-09-24 2007-05-25 가부시키가이샤 가네카 접착성이 개량된 신규한 폴리이미드 필름
JP2006307082A (ja) * 2005-04-28 2006-11-09 Kaneka Corp ポリアミド酸組成物の製造方法およびその利用

Also Published As

Publication number Publication date
CN102015834B (zh) 2013-10-16
EP2246383A4 (fr) 2013-01-09
CN102015834A (zh) 2011-04-13
EP2246383A1 (fr) 2010-11-03
WO2009098791A1 (fr) 2009-08-13
TW200934808A (en) 2009-08-16
TWI475046B (zh) 2015-03-01
US20110003955A1 (en) 2011-01-06

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190731