HK1155469A1 - Imide oligomer and polyimide resin obtained by thermal curing thereof - Google Patents
Imide oligomer and polyimide resin obtained by thermal curing thereofInfo
- Publication number
- HK1155469A1 HK1155469A1 HK11109644.8A HK11109644A HK1155469A1 HK 1155469 A1 HK1155469 A1 HK 1155469A1 HK 11109644 A HK11109644 A HK 11109644A HK 1155469 A1 HK1155469 A1 HK 1155469A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- polyimide resin
- resin obtained
- thermal curing
- imide oligomer
- imide
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
- C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008027705 | 2008-02-07 | ||
JP2008027704 | 2008-02-07 | ||
PCT/JP2008/063512 WO2009098791A1 (ja) | 2008-02-07 | 2008-07-28 | イミドオリゴマー及びこれを加熱硬化させてなるポリイミド樹脂 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1155469A1 true HK1155469A1 (en) | 2012-05-18 |
Family
ID=40951878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11109644.8A HK1155469A1 (en) | 2008-02-07 | 2011-09-13 | Imide oligomer and polyimide resin obtained by thermal curing thereof |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110003955A1 (xx) |
EP (1) | EP2246383A4 (xx) |
CN (1) | CN102015834B (xx) |
HK (1) | HK1155469A1 (xx) |
TW (1) | TWI475046B (xx) |
WO (1) | WO2009098791A1 (xx) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9120898B2 (en) | 2011-07-08 | 2015-09-01 | Baker Hughes Incorporated | Method of curing thermoplastic polymer for shape memory material |
US20130012635A1 (en) * | 2011-07-08 | 2013-01-10 | Baker Hughes Incorporated | Cured thermoplastic polymer for shape memory material and articles formed therefrom |
US8939222B2 (en) | 2011-09-12 | 2015-01-27 | Baker Hughes Incorporated | Shaped memory polyphenylene sulfide (PPS) for downhole packer applications |
US8829119B2 (en) | 2011-09-27 | 2014-09-09 | Baker Hughes Incorporated | Polyarylene compositions for downhole applications, methods of manufacture, and uses thereof |
CN103166940B (zh) * | 2011-12-16 | 2017-03-22 | 中国移动通信集团公司 | 服务质量动态协商及优化方法和装置 |
CN102532896B (zh) * | 2011-12-29 | 2014-05-14 | 复旦大学 | 一种改性石墨烯/聚酰亚胺树脂复合材料及其制备方法 |
US9144925B2 (en) | 2012-01-04 | 2015-09-29 | Baker Hughes Incorporated | Shape memory polyphenylene sulfide manufacturing, process, and composition |
US20130260131A1 (en) * | 2012-03-28 | 2013-10-03 | Satoshi Seike | Thermoplastic molding preform |
US20130309925A1 (en) * | 2012-05-15 | 2013-11-21 | Satoshi Seike | Carbon fiber fabric |
US20130309491A1 (en) * | 2012-05-15 | 2013-11-21 | Satoshi Seike | Milled carbon fiber |
US20130309492A1 (en) * | 2012-05-15 | 2013-11-21 | Satoshi Seike | Chopped carbon fiber |
US9707642B2 (en) | 2012-12-07 | 2017-07-18 | Baker Hughes Incorporated | Toughened solder for downhole applications, methods of manufacture thereof and articles comprising the same |
US20140162575A1 (en) * | 2012-12-07 | 2014-06-12 | Anayas360.Com, Llc | Highly integrated millimeter-wave soc layout techniques for improved performance and modeling accuracy |
KR101953369B1 (ko) * | 2015-12-04 | 2019-02-28 | 주식회사 엘지화학 | 중합성 조성물 |
TWI665260B (zh) * | 2017-09-19 | 2019-07-11 | 臻鼎科技股份有限公司 | 低介電聚醯亞胺組合物、聚醯亞胺、聚醯亞胺膜及覆銅板 |
EP3892672A4 (en) * | 2018-12-07 | 2022-08-31 | Toyo Seikan Group Holdings, Ltd. | FIBER-REINFORCED POLYIMIDE RESIN PRECURSOR AND PROCESS FOR THE PRODUCTION THEREOF |
WO2021230254A1 (ja) * | 2020-05-11 | 2021-11-18 | ダイキン工業株式会社 | アミド化合物、含窒素複素環含有化合物および架橋物 |
CN114181528A (zh) * | 2020-09-14 | 2022-03-15 | 中国石油化工股份有限公司 | 热塑性聚酰亚胺组合物及其应用、热塑性聚酰亚胺制备及其应用 |
WO2022210095A1 (ja) * | 2021-04-02 | 2022-10-06 | Jsr株式会社 | 重合体、組成物、硬化物、積層体及び電子部品 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3551846B2 (ja) * | 1998-11-25 | 2004-08-11 | 宇部興産株式会社 | 末端変性イミドオリゴマ−およびその硬化物 |
US6359107B1 (en) | 2000-05-18 | 2002-03-19 | The United States Of America As Represented By The Administrator, National Aeronautics And Space Administration | Composition of and method for making high performance resins for infusion and transfer molding processes |
US7994274B2 (en) * | 2003-09-02 | 2011-08-09 | I.S.T. (Ma) Corporation | Two-stage cure polyimide oligomers |
US7129318B2 (en) * | 2003-09-02 | 2006-10-31 | I.S.T. (Ma) Corporation | RTM and RI processable polyimide resins |
US7015304B1 (en) * | 2004-07-23 | 2006-03-21 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Solvent free low-melt viscosity imide oligomers and thermosetting polyimide composites |
US20070292701A1 (en) * | 2004-09-24 | 2007-12-20 | Takashi Kikuchi | Novel Polyimide Film Improved in Adhesion |
JP2006307082A (ja) * | 2005-04-28 | 2006-11-09 | Kaneka Corp | ポリアミド酸組成物の製造方法およびその利用 |
-
2008
- 2008-07-28 WO PCT/JP2008/063512 patent/WO2009098791A1/ja active Application Filing
- 2008-07-28 EP EP08791747A patent/EP2246383A4/en not_active Withdrawn
- 2008-07-28 US US12/865,738 patent/US20110003955A1/en not_active Abandoned
- 2008-07-28 CN CN200880126350.5A patent/CN102015834B/zh not_active Expired - Fee Related
- 2008-07-29 TW TW097128579A patent/TWI475046B/zh not_active IP Right Cessation
-
2011
- 2011-09-13 HK HK11109644.8A patent/HK1155469A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP2246383A4 (en) | 2013-01-09 |
WO2009098791A1 (ja) | 2009-08-13 |
TWI475046B (zh) | 2015-03-01 |
CN102015834B (zh) | 2013-10-16 |
TW200934808A (en) | 2009-08-16 |
CN102015834A (zh) | 2011-04-13 |
US20110003955A1 (en) | 2011-01-06 |
EP2246383A1 (en) | 2010-11-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20190731 |