HK1145041A1 - Contactless measuring system - Google Patents

Contactless measuring system

Info

Publication number
HK1145041A1
HK1145041A1 HK10111531.1A HK10111531A HK1145041A1 HK 1145041 A1 HK1145041 A1 HK 1145041A1 HK 10111531 A HK10111531 A HK 10111531A HK 1145041 A1 HK1145041 A1 HK 1145041A1
Authority
HK
Hong Kong
Prior art keywords
signal
contact
wave guide
contact structure
measuring system
Prior art date
Application number
HK10111531.1A
Other languages
English (en)
Inventor
Thomas Zelder
Original Assignee
Rosenberger Hochfrequenztech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosenberger Hochfrequenztech filed Critical Rosenberger Hochfrequenztech
Publication of HK1145041A1 publication Critical patent/HK1145041A1/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/07—Non contact-making probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/28—Measuring attenuation, gain, phase shift or derived characteristics of electric four pole networks, i.e. two-port networks; Measuring transient response
    • G01R27/32—Measuring attenuation, gain, phase shift or derived characteristics of electric four pole networks, i.e. two-port networks; Measuring transient response in circuits having distributed constants, e.g. having very long conductors or involving high frequencies
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/24—Transmission-line, e.g. waveguide, measuring sections, e.g. slotted section
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/315—Contactless testing by inductive methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
HK10111531.1A 2007-08-03 2010-12-10 Contactless measuring system HK1145041A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202007010784U DE202007010784U1 (de) 2007-08-03 2007-08-03 Kontaktloses Messsystem
PCT/EP2008/006098 WO2009018928A1 (de) 2007-08-03 2008-07-24 Kontaktloses messsystem

Publications (1)

Publication Number Publication Date
HK1145041A1 true HK1145041A1 (en) 2011-03-25

Family

ID=38565387

Family Applications (2)

Application Number Title Priority Date Filing Date
HK10111531.1A HK1145041A1 (en) 2007-08-03 2010-12-10 Contactless measuring system
HK11113754.6A HK1159253A1 (en) 2007-08-03 2011-12-21 Contactless measuring system

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK11113754.6A HK1159253A1 (en) 2007-08-03 2011-12-21 Contactless measuring system

Country Status (10)

Country Link
US (2) US8803538B2 (ja)
EP (2) EP2341354B1 (ja)
JP (1) JP5580736B2 (ja)
CN (1) CN101790690B (ja)
AT (2) ATE550677T1 (ja)
CA (1) CA2695403C (ja)
DE (1) DE202007010784U1 (ja)
HK (2) HK1145041A1 (ja)
TW (1) TWM348941U (ja)
WO (1) WO2009018928A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202008009469U1 (de) * 2008-07-15 2008-09-11 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Messsonde
DE202008010533U1 (de) * 2008-08-07 2008-10-30 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Kontaktlose Schleifensonde
US9244145B2 (en) * 2011-06-30 2016-01-26 Amber Precision Instruments, Inc. System and method for measuring near field information of device under test
CN103064011B (zh) * 2012-12-27 2015-12-23 广州中大微电子有限公司 一种rfid读写器芯片中测系统及方法
CN104101854B (zh) * 2014-07-22 2017-03-01 中国电子科技集团公司第四十一研究所 一种由电磁驱动的一体化波导校准件
CN104569888B (zh) * 2014-12-24 2017-06-06 北京无线电计量测试研究所 一种利用微带线法校准近场探头修正因子的系统及方法
US11815347B2 (en) * 2016-09-28 2023-11-14 Kla-Tencor Corporation Optical near-field metrology
JP6884082B2 (ja) * 2017-10-11 2021-06-09 株式会社Ｓｃｒｅｅｎホールディングス 膜厚測定装置、基板検査装置、膜厚測定方法および基板検査方法
US10852344B2 (en) 2017-12-12 2020-12-01 Micron Technology, Inc. Inductive testing probe apparatus for testing semiconductor die and related systems and methods
CN110208674B (zh) * 2019-05-08 2021-05-25 天津大学 一种用于非线性辐射信号检测的定向耦合近场探针及系统
CN110531161B (zh) * 2019-07-29 2020-10-23 北京航空航天大学 一种印刷电路板各位置输入阻抗非接触式在线测试装置
WO2023223541A1 (ja) * 2022-05-20 2023-11-23 日本電信電話株式会社 誘電分光測定装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4622515A (en) * 1984-02-17 1986-11-11 Honeywell Inc. Apparatus and method for contactless characterization of photodiode mosaics
US5124660A (en) * 1990-12-20 1992-06-23 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5424633A (en) 1991-01-22 1995-06-13 Advanced Test Technologies Inc. Contactless test method and system for testing printed circuit boards
FR2696009A1 (fr) * 1992-09-23 1994-03-25 Philips Electronique Lab Dispositif de calibrage pour ajuster en hyperfréquence les plans de référence d'un appareillage de mesure des paramètres de dispersion d'éléments de circuits intégrés.
US5467021A (en) * 1993-05-24 1995-11-14 Atn Microwave, Inc. Calibration method and apparatus
JPH0864643A (ja) * 1994-08-19 1996-03-08 Sanyo Electric Co Ltd 高周波集積回路装置および高周波測定システム
JP3279177B2 (ja) * 1996-05-15 2002-04-30 三菱電機株式会社 周波数分析受信装置
JP3102389B2 (ja) * 1997-09-29 2000-10-23 日本電気株式会社 半導体装置
JP2000147034A (ja) * 1998-11-12 2000-05-26 Ricoh Co Ltd 密着固定型近磁界プローブ
US6870438B1 (en) * 1999-11-10 2005-03-22 Kyocera Corporation Multi-layered wiring board for slot coupling a transmission line to a waveguide
US6366104B2 (en) * 2000-02-15 2002-04-02 Hughes Electronics Corp. Microwave probe for surface mount and hybrid assemblies
US6759850B2 (en) 2001-03-28 2004-07-06 Orbotech Ltd. System and method for non-contact electrical testing employing a CAM derived reference
JP3950133B2 (ja) * 2004-10-29 2007-07-25 Ｔｄｋ株式会社 高周波回路基板
US7362106B2 (en) * 2005-06-29 2008-04-22 Agilent Technologies, Inc. Methods and apparatus for non-contact testing and diagnosing of open connections on non-probed nodes
DE202007010239U1 (de) * 2007-07-24 2007-09-20 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Schleifenrichtkoppler

Also Published As

Publication number Publication date
JP5580736B2 (ja) 2014-08-27
US8803538B2 (en) 2014-08-12
US20110260743A1 (en) 2011-10-27
EP2174151A1 (de) 2010-04-14
US9291644B2 (en) 2016-03-22
WO2009018928A1 (de) 2009-02-12
CA2695403A1 (en) 2009-02-12
CN101790690B (zh) 2013-03-06
ATE550677T1 (de) 2012-04-15
CN101790690A (zh) 2010-07-28
EP2174151B1 (de) 2011-10-26
ATE530920T1 (de) 2011-11-15
EP2341354A1 (de) 2011-07-06
TWM348941U (en) 2009-01-11
EP2341354B1 (de) 2012-03-21
CA2695403C (en) 2016-05-24
JP2010535329A (ja) 2010-11-18
US20140300381A1 (en) 2014-10-09
DE202007010784U1 (de) 2007-10-04
HK1159253A1 (en) 2012-07-27

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190719