HK1140575A1 - Electrically conductive particle, anisotropic conductive connection material, and method for production of electrically conductive particle - Google Patents

Electrically conductive particle, anisotropic conductive connection material, and method for production of electrically conductive particle

Info

Publication number
HK1140575A1
HK1140575A1 HK10106550.7A HK10106550A HK1140575A1 HK 1140575 A1 HK1140575 A1 HK 1140575A1 HK 10106550 A HK10106550 A HK 10106550A HK 1140575 A1 HK1140575 A1 HK 1140575A1
Authority
HK
Hong Kong
Prior art keywords
electrically conductive
conductive particle
production
connection material
particle
Prior art date
Application number
HK10106550.7A
Other languages
English (en)
Inventor
Yasushi Akutsu
Hidetsugu Namiki
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1140575A1 publication Critical patent/HK1140575A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
HK10106550.7A 2007-04-16 2010-07-06 Electrically conductive particle, anisotropic conductive connection material, and method for production of electrically conductive particle HK1140575A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007107475A JP5074082B2 (ja) 2007-04-16 2007-04-16 導電性粒子体及びこれを用いた異方性導電接続材料、並びに導電性粒子体の製造方法
PCT/JP2008/057150 WO2008133037A1 (fr) 2007-04-16 2008-04-11 Particule électroconductrice, matériau de connexion conducteur anisotrope et procédé de production d'une particule électroconductrice

Publications (1)

Publication Number Publication Date
HK1140575A1 true HK1140575A1 (en) 2010-10-15

Family

ID=39925496

Family Applications (1)

Application Number Title Priority Date Filing Date
HK10106550.7A HK1140575A1 (en) 2007-04-16 2010-07-06 Electrically conductive particle, anisotropic conductive connection material, and method for production of electrically conductive particle

Country Status (7)

Country Link
US (2) US8309224B2 (fr)
JP (1) JP5074082B2 (fr)
KR (1) KR101402508B1 (fr)
CN (1) CN101681692B (fr)
HK (1) HK1140575A1 (fr)
TW (1) TWI486976B (fr)
WO (1) WO2008133037A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4957838B2 (ja) 2009-08-06 2012-06-20 日立化成工業株式会社 導電性微粒子及び異方性導電材料
JP5554077B2 (ja) * 2009-09-15 2014-07-23 株式会社日本触媒 絶縁性微粒子被覆導電性微粒子、異方性導電接着剤組成物、および異方性導電成形体
JP5402804B2 (ja) * 2010-04-12 2014-01-29 デクセリアルズ株式会社 発光装置の製造方法
JP5650611B2 (ja) 2011-08-23 2015-01-07 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続方法、及び接合体
KR101403865B1 (ko) * 2011-12-16 2014-06-10 제일모직주식회사 이방성 도전 필름용 조성물, 이방성 도전 필름 및 반도체 장치
JP6289831B2 (ja) * 2013-07-29 2018-03-07 デクセリアルズ株式会社 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法
CN104576966B (zh) * 2014-12-31 2017-02-01 北京维信诺科技有限公司 一种柔性显示装置及其制备方法
KR101763556B1 (ko) * 2015-03-06 2017-08-16 (주)뉴옵틱스 전도성 플레이트
US20190100663A1 (en) * 2017-10-03 2019-04-04 Shin-Etsu Chemical Co., Ltd. Anisotropic conductive film and method for manufacturing anisotropic conductive film
KR20210041661A (ko) * 2019-10-07 2021-04-16 삼성디스플레이 주식회사 표시모듈 제조장치 및 표시모듈 제조방법
KR20220090647A (ko) 2020-12-22 2022-06-30 삼성디스플레이 주식회사 이방성 도전 필름을 포함하는 표시 장치 및 표시 장치의 제조 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980081191A (ko) * 1997-04-08 1998-11-25 모리시다요이치 도전성 페이스트 및 그 제조방법과 그것을 이용한 프린트 배선기판
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
KR100589799B1 (ko) * 2003-05-06 2006-06-14 한화석유화학 주식회사 이방성 도전접속용 절연 도전성 입자, 이의 제조방법 및이를 이용한 제품
CN100437838C (zh) * 2003-07-07 2008-11-26 积水化学工业株式会社 包覆导电性粒子、各向异性导电材料以及导电连接结构体
JP4387175B2 (ja) * 2003-07-07 2009-12-16 積水化学工業株式会社 被覆導電性粒子、異方性導電材料及び導電接続構造体
JP4724369B2 (ja) * 2003-09-29 2011-07-13 ソニーケミカル＆インフォメーションデバイス株式会社 導電粒子の製造方法
KR100597391B1 (ko) * 2004-05-12 2006-07-06 제일모직주식회사 절연 전도성 미립자 및 이를 함유하는 이방 전도성 접착필름
KR100722493B1 (ko) * 2005-09-02 2007-05-28 제일모직주식회사 절연 전도성 미립자 및 이를 이용한 이방 전도성 접착필름

Also Published As

Publication number Publication date
US8309224B2 (en) 2012-11-13
TW200849286A (en) 2008-12-16
JP5074082B2 (ja) 2012-11-14
CN101681692A (zh) 2010-03-24
TWI486976B (zh) 2015-06-01
US8846142B2 (en) 2014-09-30
KR101402508B1 (ko) 2014-06-03
CN101681692B (zh) 2012-11-14
US20110095235A1 (en) 2011-04-28
WO2008133037A1 (fr) 2008-11-06
JP2008269816A (ja) 2008-11-06
KR20090129991A (ko) 2009-12-17
US20100051878A1 (en) 2010-03-04

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