HK1131099A1 - Resin composition for cleaning molds and recovering the release properties of molds and method for cleaning molds and recovering the release properties of molds - Google Patents

Resin composition for cleaning molds and recovering the release properties of molds and method for cleaning molds and recovering the release properties of molds

Info

Publication number
HK1131099A1
HK1131099A1 HK09109052.7A HK09109052A HK1131099A1 HK 1131099 A1 HK1131099 A1 HK 1131099A1 HK 09109052 A HK09109052 A HK 09109052A HK 1131099 A1 HK1131099 A1 HK 1131099A1
Authority
HK
Hong Kong
Prior art keywords
molds
recovering
release properties
cleaning
resin composition
Prior art date
Application number
HK09109052.7A
Other languages
English (en)
Inventor
Kiyohito Hiromitsu
Hiroaki Nomura
Kenichi Hamaura
Original Assignee
Nippon Carbide Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Carbide Kogyo Kk filed Critical Nippon Carbide Kogyo Kk
Publication of HK1131099A1 publication Critical patent/HK1131099A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/60—Releasing, lubricating or separating agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/58—Applying the releasing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B29C33/722—Compositions for cleaning moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2061/00—Use of condensation polymers of aldehydes or ketones or derivatives thereof, as moulding material
    • B29K2061/20—Aminoplasts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Detergent Compositions (AREA)
HK09109052.7A 2006-10-27 2009-09-30 Resin composition for cleaning molds and recovering the release properties of molds and method for cleaning molds and recovering the release properties of molds HK1131099A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006291889 2006-10-27
JP2006291888 2006-10-27
JP2006291890 2006-10-27
PCT/JP2007/070436 WO2008050682A1 (fr) 2006-10-27 2007-10-19 Composition de résine de nettoyage de moules et de restauration des propriétés de démoulage de moules, et procédé de nettoyage de moules et de restauration des propriétés de démoulage de moules

Publications (1)

Publication Number Publication Date
HK1131099A1 true HK1131099A1 (en) 2010-01-15

Family

ID=39324481

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09109052.7A HK1131099A1 (en) 2006-10-27 2009-09-30 Resin composition for cleaning molds and recovering the release properties of molds and method for cleaning molds and recovering the release properties of molds

Country Status (7)

Country Link
JP (1) JP4948541B2 (xx)
KR (1) KR101395818B1 (xx)
CN (1) CN101466515B (xx)
HK (1) HK1131099A1 (xx)
MY (1) MY155928A (xx)
TW (1) TWI410316B (xx)
WO (1) WO2008050682A1 (xx)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013111709A1 (ja) * 2012-01-23 2013-08-01 日本カーバイド工業株式会社 金型清掃用樹脂組成物
JP6803165B2 (ja) * 2015-08-07 2020-12-23 日本カーバイド工業株式会社 金型清掃用樹脂組成物
JP7530871B2 (ja) * 2021-06-14 2024-08-08 Ｔｏｗａ株式会社 樹脂成形品の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3783042B2 (ja) * 1995-08-23 2006-06-07 日本カーバイド工業株式会社 金型清掃用樹脂組成物
JP2001247755A (ja) * 2000-03-08 2001-09-11 Teijin Ltd コネクター用樹脂ペレット混合物
JP4082052B2 (ja) * 2002-03-20 2008-04-30 東レ株式会社 樹脂組成物ならびにそれからなる成形品

Also Published As

Publication number Publication date
TW200843927A (en) 2008-11-16
KR20090084669A (ko) 2009-08-05
CN101466515A (zh) 2009-06-24
CN101466515B (zh) 2012-07-04
WO2008050682A1 (fr) 2008-05-02
JPWO2008050682A1 (ja) 2010-02-25
TWI410316B (zh) 2013-10-01
MY155928A (en) 2015-12-31
JP4948541B2 (ja) 2012-06-06
KR101395818B1 (ko) 2014-05-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20161019