HK1122906A1 - Antenna structure of an integrated circuit - Google Patents

Antenna structure of an integrated circuit

Info

Publication number
HK1122906A1
HK1122906A1 HK08114120.6A HK08114120A HK1122906A1 HK 1122906 A1 HK1122906 A1 HK 1122906A1 HK 08114120 A HK08114120 A HK 08114120A HK 1122906 A1 HK1122906 A1 HK 1122906A1
Authority
HK
Hong Kong
Prior art keywords
integrated circuit
antenna element
line
antenna structure
die
Prior art date
Application number
HK08114120.6A
Other languages
English (en)
Inventor
Ahmadreza Rofougaran
Original Assignee
Broadcom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Broadcom Corp filed Critical Broadcom Corp
Publication of HK1122906A1 publication Critical patent/HK1122906A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/06—Details
    • H01Q9/065—Microstrip dipole antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06527—Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides
    • H01L2924/19033—Structure including wave guides being a coplanar line type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Radio Transmission System (AREA)
  • Transceivers (AREA)
HK08114120.6A 2006-12-29 2008-12-31 Antenna structure of an integrated circuit HK1122906A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/648,826 US7893878B2 (en) 2006-12-29 2006-12-29 Integrated circuit antenna structure

Publications (1)

Publication Number Publication Date
HK1122906A1 true HK1122906A1 (en) 2009-05-29

Family

ID=39264491

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08114120.6A HK1122906A1 (en) 2006-12-29 2008-12-31 Antenna structure of an integrated circuit

Country Status (6)

Country Link
US (1) US7893878B2 (zh)
EP (1) EP1939979A1 (zh)
KR (1) KR100981143B1 (zh)
CN (1) CN101227024B (zh)
HK (1) HK1122906A1 (zh)
TW (1) TWI396326B (zh)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7899394B2 (en) * 2006-03-16 2011-03-01 Broadcom Corporation RFID system with RF bus
US8674888B2 (en) * 2006-06-21 2014-03-18 Broadcom Corporation Integrated circuit with power supply line antenna structure and methods for use therewith
EP2122761A4 (en) * 2006-12-11 2011-07-20 Qualcomm Inc MULTI-ANTENNA ARRANGEMENT WITH AN INSULATION ELEMENT
US8730121B2 (en) * 2007-08-31 2014-05-20 Tyco Fire & Security Gmbh Large scale folded dipole antenna for near-field RFID applications
US7626556B1 (en) * 2007-09-18 2009-12-01 Lockheed Martin Corporation Planar beamformer structure
TWI347708B (en) * 2007-11-27 2011-08-21 Arcadyan Technology Corp Structure of dual symmetrical antennas
US20100127937A1 (en) * 2008-11-25 2010-05-27 Qualcomm Incorporated Antenna Integrated in a Semiconductor Chip
US8401598B2 (en) 2009-05-11 2013-03-19 Broadcom Corporation Method and system for chip to chip communication utilizing selectable directional antennas
US8537657B2 (en) * 2009-07-24 2013-09-17 Raytheon Company Cross domain modulation scheme for a wireless communication link
JP5446671B2 (ja) * 2009-09-29 2014-03-19 ソニー株式会社 無線伝送システム及び無線通信方法
FR2952457B1 (fr) * 2009-11-10 2011-12-16 St Microelectronics Sa Dispositif electronique comprenant un composant semi-conducteur integrant une antenne
US20110168786A1 (en) 2010-01-14 2011-07-14 Rfmarq, Inc. System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages
US8169060B2 (en) * 2010-03-29 2012-05-01 Infineon Technologies Ag Integrated circuit package assembly including wave guide
US9190738B2 (en) 2010-04-11 2015-11-17 Broadcom Corporation Projected artificial magnetic mirror
US9147933B2 (en) 2010-04-11 2015-09-29 Broadcom Corporation Three-dimensional spiral antenna and applications thereof
CN102683805B (zh) * 2011-03-14 2015-10-07 深圳光启高等理工研究院 一种可调节的射频天线
CN102800943A (zh) * 2011-05-31 2012-11-28 深圳光启高等理工研究院 一种双极化天线及具有该双极化天线的mimo天线
TWI472195B (zh) * 2011-08-05 2015-02-01 Holy Stone Entpr Co Ltd Radio frequency and capacitance hybrid antenna drive method
GB2494717A (en) * 2011-09-13 2013-03-20 Bae Systems Plc Portable wireless network
TWI525910B (zh) * 2012-03-23 2016-03-11 美國博通公司 三維螺旋天線及其應用
JP6013041B2 (ja) * 2012-06-27 2016-10-25 ローム株式会社 無線モジュール
KR101421923B1 (ko) * 2013-01-16 2014-07-22 인팩일렉스 주식회사 차량용 통합 안테나
JP6160687B2 (ja) * 2013-02-21 2017-07-12 旭硝子株式会社 車両用窓ガラス及びアンテナ
CN104104419A (zh) * 2013-04-03 2014-10-15 中兴通讯股份有限公司 一种多天线通信系统的实现装置
US20160329630A1 (en) * 2013-12-30 2016-11-10 Nokia Solutions And Networks Oy Modular Antenna Structure
US9891266B2 (en) 2014-02-25 2018-02-13 Taiwan Semiconductor Manufacturing Co., Ltd. Test circuit and method
CN103825102B (zh) * 2014-03-19 2016-10-05 哈尔滨工业大学 一种母线为复合曲线的超宽带对称双锥天线
US10389008B2 (en) * 2015-02-26 2019-08-20 Ramot At Tel-Aviv University Ltd. Technique for improving efficiency of on-chip antennas
WO2017099578A1 (en) 2015-12-07 2017-06-15 Greenpeak Technologies B.V. On-chip balun circuit and multi-port antenna switch circuit
TWI593987B (zh) * 2016-04-29 2017-08-01 Metal Ind Res & Dev Ct FM radar transceiver
US11177573B2 (en) * 2016-05-10 2021-11-16 Sony Group Corporation C-fed antenna formed on multi-layer printed circuit board edge
US10490341B2 (en) * 2017-08-17 2019-11-26 Advanced Semiconductor Engineering, Inc. Electrical device
KR101939047B1 (ko) * 2017-12-26 2019-01-16 삼성전기 주식회사 안테나 모듈 및 듀얼밴드 안테나 장치
WO2019169003A1 (en) * 2018-02-27 2019-09-06 Thin Film Electronics Asa Printed and/or thin film integrated circuit with integrated antenna, and methods of making and using the same
TWI705455B (zh) * 2019-07-03 2020-09-21 友懋國際科技股份有限公司 阻抗變換網路及包括其之記憶體模組
US11233017B2 (en) * 2019-10-03 2022-01-25 Texas Instruments Incorporated Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits
RU2749652C2 (ru) * 2019-11-25 2021-06-16 Общество с ограниченной ответственностью "ГОУДИДЖИТАЛ" Антенна комнатная телевизионная
CN110995224A (zh) * 2019-12-09 2020-04-10 成都知融科技股份有限公司 一种具备收发切换和极化切换功能的开关结构
US11694057B2 (en) * 2020-01-03 2023-07-04 Sensormatic Electronics, LLC RFID tag and method of making same
CN112186337B (zh) * 2020-09-14 2021-07-27 南京航空航天大学 一种基于模式正交的双频高隔离度手机mimo天线
CN113676191B (zh) * 2021-08-12 2022-12-27 Oppo广东移动通信有限公司 发射模组、射频系统及通信设备

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2296384A (en) * 1940-04-11 1942-09-22 Rca Corp Relay system monitor
US4208630A (en) * 1978-10-19 1980-06-17 Altran Electronics, Inc. Narrow band paging or control radio system
US4499606A (en) * 1982-12-27 1985-02-12 Sri International Reception enhancement in mobile FM broadcast receivers and the like
JPH06196927A (ja) 1992-12-24 1994-07-15 N T T Idou Tsuushinmou Kk ビームチルト・アンテナ
US6104349A (en) * 1995-08-09 2000-08-15 Cohen; Nathan Tuning fractal antennas and fractal resonators
US7019695B2 (en) * 1997-11-07 2006-03-28 Nathan Cohen Fractal antenna ground counterpoise, ground planes, and loading elements and microstrip patch antennas with fractal structure
JPH10193849A (ja) 1996-12-27 1998-07-28 Rohm Co Ltd 回路チップ搭載カードおよび回路チップモジュール
US6025811A (en) * 1997-04-21 2000-02-15 International Business Machines Corporation Closely coupled directional antenna
JP3131967B2 (ja) 1997-11-05 2001-02-05 日本電気株式会社 アンテナ回路
JPH11330850A (ja) * 1998-05-12 1999-11-30 Harada Ind Co Ltd 円偏波クロスダイポールアンテナ
JP2001077719A (ja) 1999-09-07 2001-03-23 Nec Saitama Ltd アンテナ・インピーダンス変化の補償可能な携帯電話機
EP1296407A4 (en) * 2000-06-12 2005-03-09 Mitsubishi Electric Corp PORTABLE RADIO UNIT
EP1430563A4 (en) 2001-01-06 2005-02-09 Telisar Corp INTEGRATED ANTENNA SYSTEM
JP3982689B2 (ja) * 2001-02-13 2007-09-26 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 無線通信機能を含む装置
AU2003248649A1 (en) 2002-06-10 2003-12-22 University Of Florida High gain integrated antenna and devices therefrom
US6897830B2 (en) * 2002-07-04 2005-05-24 Antenna Tech, Inc. Multi-band helical antenna
SE524871C2 (sv) 2002-09-04 2004-10-19 Perlos Ab Antennanordning för portabel radiokommunikationsanordning
EP1563570A1 (en) 2002-11-07 2005-08-17 Fractus, S.A. Integrated circuit package including miniature antenna
JP2004327568A (ja) * 2003-04-23 2004-11-18 Japan Science & Technology Agency 半導体装置
JP4337457B2 (ja) * 2003-07-30 2009-09-30 日本電気株式会社 アンテナ装置及びそれを用いた無線通信装置
WO2005048398A2 (en) * 2003-10-28 2005-05-26 Dsp Group Inc. Multi-band dipole antenna structure for wireless communications
US8059740B2 (en) * 2004-02-19 2011-11-15 Broadcom Corporation WLAN transmitter having high data throughput
US7119745B2 (en) * 2004-06-30 2006-10-10 International Business Machines Corporation Apparatus and method for constructing and packaging printed antenna devices
US7697958B2 (en) * 2004-08-16 2010-04-13 Farrokh Mohamadi Wireless repeater
JP2006067251A (ja) 2004-08-26 2006-03-09 Omron Corp チップアンテナおよびその製造方法
US7615856B2 (en) * 2004-09-01 2009-11-10 Sanyo Electric Co., Ltd. Integrated antenna type circuit apparatus
GB2422484B (en) * 2005-01-21 2006-12-06 Artimi Ltd Integrated circuit die connection methods and apparatus
US7372408B2 (en) * 2006-01-13 2008-05-13 International Business Machines Corporation Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas
US8201746B2 (en) 2006-01-24 2012-06-19 Agency For Science, Technology And Research On-chip antenna and a method of fabricating the same
US7518221B2 (en) * 2006-01-26 2009-04-14 International Business Machines Corporation Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires
US7595766B2 (en) * 2006-12-29 2009-09-29 Broadcom Corporation Low efficiency integrated circuit antenna

Also Published As

Publication number Publication date
EP1939979A1 (en) 2008-07-02
US7893878B2 (en) 2011-02-22
KR20080063211A (ko) 2008-07-03
TWI396326B (zh) 2013-05-11
TW200845474A (en) 2008-11-16
CN101227024B (zh) 2013-03-13
US20080158087A1 (en) 2008-07-03
KR100981143B1 (ko) 2010-09-10
CN101227024A (zh) 2008-07-23

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20191229