CN101227024A - 集成电路的天线结构 - Google Patents
集成电路的天线结构 Download PDFInfo
- Publication number
- CN101227024A CN101227024A CNA2007103080436A CN200710308043A CN101227024A CN 101227024 A CN101227024 A CN 101227024A CN A2007103080436 A CNA2007103080436 A CN A2007103080436A CN 200710308043 A CN200710308043 A CN 200710308043A CN 101227024 A CN101227024 A CN 101227024A
- Authority
- CN
- China
- Prior art keywords
- antenna
- antenna structure
- signal
- circuit
- antenna element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/06—Details
- H01Q9/065—Microstrip dipole antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06527—Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
- H01L2924/19033—Structure including wave guides being a coplanar line type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Radio Transmission System (AREA)
- Transceivers (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/648,826 | 2006-12-29 | ||
US11/648,826 US7893878B2 (en) | 2006-12-29 | 2006-12-29 | Integrated circuit antenna structure |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101227024A true CN101227024A (zh) | 2008-07-23 |
CN101227024B CN101227024B (zh) | 2013-03-13 |
Family
ID=39264491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007103080436A Active CN101227024B (zh) | 2006-12-29 | 2007-12-29 | 集成电路的天线结构 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7893878B2 (zh) |
EP (1) | EP1939979A1 (zh) |
KR (1) | KR100981143B1 (zh) |
CN (1) | CN101227024B (zh) |
HK (1) | HK1122906A1 (zh) |
TW (1) | TWI396326B (zh) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102683805A (zh) * | 2011-03-14 | 2012-09-19 | 深圳光启高等理工研究院 | 一种可调节的射频天线 |
CN102800943A (zh) * | 2011-05-31 | 2012-11-28 | 深圳光启高等理工研究院 | 一种双极化天线及具有该双极化天线的mimo天线 |
CN103326110A (zh) * | 2012-03-23 | 2013-09-25 | 美国博通公司 | 三维螺旋天线及其应用 |
CN102224590B (zh) * | 2008-11-25 | 2014-06-04 | 高通股份有限公司 | 集成于半导体芯片中的天线 |
WO2014161479A1 (zh) * | 2013-04-03 | 2014-10-09 | 中兴通讯股份有限公司 | 多天线通信系统的实现装置、方法及计算机存储介质 |
US9147933B2 (en) | 2010-04-11 | 2015-09-29 | Broadcom Corporation | Three-dimensional spiral antenna and applications thereof |
US9270030B2 (en) | 2010-04-11 | 2016-02-23 | Broadcom Corporation | RF and NFC PAMM enhanced electromagnetic signaling |
CN107251319A (zh) * | 2015-02-26 | 2017-10-13 | 特拉维夫大学拉莫特有限公司 | 用于改进片上天线的效率的技术 |
CN110995224A (zh) * | 2019-12-09 | 2020-04-10 | 成都知融科技股份有限公司 | 一种具备收发切换和极化切换功能的开关结构 |
TWI705455B (zh) * | 2019-07-03 | 2020-09-21 | 友懋國際科技股份有限公司 | 阻抗變換網路及包括其之記憶體模組 |
US20210209436A1 (en) * | 2020-01-03 | 2021-07-08 | Sensormatic Electronics, LLC | Rfid tag and method of making same |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7899394B2 (en) * | 2006-03-16 | 2011-03-01 | Broadcom Corporation | RFID system with RF bus |
US8674888B2 (en) * | 2006-06-21 | 2014-03-18 | Broadcom Corporation | Integrated circuit with power supply line antenna structure and methods for use therewith |
EP2122761A4 (en) * | 2006-12-11 | 2011-07-20 | Qualcomm Inc | MULTI-ANTENNA ARRANGEMENT WITH AN INSULATION ELEMENT |
US8730121B2 (en) * | 2007-08-31 | 2014-05-20 | Tyco Fire & Security Gmbh | Large scale folded dipole antenna for near-field RFID applications |
US7626556B1 (en) * | 2007-09-18 | 2009-12-01 | Lockheed Martin Corporation | Planar beamformer structure |
TWI347708B (en) * | 2007-11-27 | 2011-08-21 | Arcadyan Technology Corp | Structure of dual symmetrical antennas |
US8401598B2 (en) | 2009-05-11 | 2013-03-19 | Broadcom Corporation | Method and system for chip to chip communication utilizing selectable directional antennas |
US8537657B2 (en) * | 2009-07-24 | 2013-09-17 | Raytheon Company | Cross domain modulation scheme for a wireless communication link |
JP5446671B2 (ja) * | 2009-09-29 | 2014-03-19 | ソニー株式会社 | 無線伝送システム及び無線通信方法 |
FR2952457B1 (fr) * | 2009-11-10 | 2011-12-16 | St Microelectronics Sa | Dispositif electronique comprenant un composant semi-conducteur integrant une antenne |
US20110168786A1 (en) | 2010-01-14 | 2011-07-14 | Rfmarq, Inc. | System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages |
US8169060B2 (en) * | 2010-03-29 | 2012-05-01 | Infineon Technologies Ag | Integrated circuit package assembly including wave guide |
TWI472195B (zh) * | 2011-08-05 | 2015-02-01 | Holy Stone Entpr Co Ltd | Radio frequency and capacitance hybrid antenna drive method |
GB2494717A (en) * | 2011-09-13 | 2013-03-20 | Bae Systems Plc | Portable wireless network |
JP6013041B2 (ja) * | 2012-06-27 | 2016-10-25 | ローム株式会社 | 無線モジュール |
KR101421923B1 (ko) * | 2013-01-16 | 2014-07-22 | 인팩일렉스 주식회사 | 차량용 통합 안테나 |
JP6160687B2 (ja) * | 2013-02-21 | 2017-07-12 | 旭硝子株式会社 | 車両用窓ガラス及びアンテナ |
US20160329630A1 (en) * | 2013-12-30 | 2016-11-10 | Nokia Solutions And Networks Oy | Modular Antenna Structure |
US9891266B2 (en) | 2014-02-25 | 2018-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Test circuit and method |
CN103825102B (zh) * | 2014-03-19 | 2016-10-05 | 哈尔滨工业大学 | 一种母线为复合曲线的超宽带对称双锥天线 |
WO2017099578A1 (en) | 2015-12-07 | 2017-06-15 | Greenpeak Technologies B.V. | On-chip balun circuit and multi-port antenna switch circuit |
TWI593987B (zh) * | 2016-04-29 | 2017-08-01 | Metal Ind Res & Dev Ct | FM radar transceiver |
US11177573B2 (en) * | 2016-05-10 | 2021-11-16 | Sony Group Corporation | C-fed antenna formed on multi-layer printed circuit board edge |
US10490341B2 (en) * | 2017-08-17 | 2019-11-26 | Advanced Semiconductor Engineering, Inc. | Electrical device |
KR101939047B1 (ko) * | 2017-12-26 | 2019-01-16 | 삼성전기 주식회사 | 안테나 모듈 및 듀얼밴드 안테나 장치 |
WO2019169003A1 (en) * | 2018-02-27 | 2019-09-06 | Thin Film Electronics Asa | Printed and/or thin film integrated circuit with integrated antenna, and methods of making and using the same |
US11233017B2 (en) * | 2019-10-03 | 2022-01-25 | Texas Instruments Incorporated | Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits |
RU2749652C2 (ru) * | 2019-11-25 | 2021-06-16 | Общество с ограниченной ответственностью "ГОУДИДЖИТАЛ" | Антенна комнатная телевизионная |
CN112186337B (zh) * | 2020-09-14 | 2021-07-27 | 南京航空航天大学 | 一种基于模式正交的双频高隔离度手机mimo天线 |
CN113676191B (zh) * | 2021-08-12 | 2022-12-27 | Oppo广东移动通信有限公司 | 发射模组、射频系统及通信设备 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2296384A (en) * | 1940-04-11 | 1942-09-22 | Rca Corp | Relay system monitor |
US4208630A (en) * | 1978-10-19 | 1980-06-17 | Altran Electronics, Inc. | Narrow band paging or control radio system |
US4499606A (en) * | 1982-12-27 | 1985-02-12 | Sri International | Reception enhancement in mobile FM broadcast receivers and the like |
JPH06196927A (ja) | 1992-12-24 | 1994-07-15 | N T T Idou Tsuushinmou Kk | ビームチルト・アンテナ |
US6104349A (en) * | 1995-08-09 | 2000-08-15 | Cohen; Nathan | Tuning fractal antennas and fractal resonators |
US7019695B2 (en) * | 1997-11-07 | 2006-03-28 | Nathan Cohen | Fractal antenna ground counterpoise, ground planes, and loading elements and microstrip patch antennas with fractal structure |
JPH10193849A (ja) | 1996-12-27 | 1998-07-28 | Rohm Co Ltd | 回路チップ搭載カードおよび回路チップモジュール |
US6025811A (en) * | 1997-04-21 | 2000-02-15 | International Business Machines Corporation | Closely coupled directional antenna |
JP3131967B2 (ja) | 1997-11-05 | 2001-02-05 | 日本電気株式会社 | アンテナ回路 |
JPH11330850A (ja) * | 1998-05-12 | 1999-11-30 | Harada Ind Co Ltd | 円偏波クロスダイポールアンテナ |
JP2001077719A (ja) | 1999-09-07 | 2001-03-23 | Nec Saitama Ltd | アンテナ・インピーダンス変化の補償可能な携帯電話機 |
EP1296407A4 (en) * | 2000-06-12 | 2005-03-09 | Mitsubishi Electric Corp | PORTABLE RADIO UNIT |
EP1430563A4 (en) | 2001-01-06 | 2005-02-09 | Telisar Corp | INTEGRATED ANTENNA SYSTEM |
JP3982689B2 (ja) * | 2001-02-13 | 2007-09-26 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 無線通信機能を含む装置 |
AU2003248649A1 (en) | 2002-06-10 | 2003-12-22 | University Of Florida | High gain integrated antenna and devices therefrom |
US6897830B2 (en) * | 2002-07-04 | 2005-05-24 | Antenna Tech, Inc. | Multi-band helical antenna |
SE524871C2 (sv) | 2002-09-04 | 2004-10-19 | Perlos Ab | Antennanordning för portabel radiokommunikationsanordning |
EP1563570A1 (en) | 2002-11-07 | 2005-08-17 | Fractus, S.A. | Integrated circuit package including miniature antenna |
JP2004327568A (ja) * | 2003-04-23 | 2004-11-18 | Japan Science & Technology Agency | 半導体装置 |
JP4337457B2 (ja) * | 2003-07-30 | 2009-09-30 | 日本電気株式会社 | アンテナ装置及びそれを用いた無線通信装置 |
WO2005048398A2 (en) * | 2003-10-28 | 2005-05-26 | Dsp Group Inc. | Multi-band dipole antenna structure for wireless communications |
US8059740B2 (en) * | 2004-02-19 | 2011-11-15 | Broadcom Corporation | WLAN transmitter having high data throughput |
US7119745B2 (en) * | 2004-06-30 | 2006-10-10 | International Business Machines Corporation | Apparatus and method for constructing and packaging printed antenna devices |
US7697958B2 (en) * | 2004-08-16 | 2010-04-13 | Farrokh Mohamadi | Wireless repeater |
JP2006067251A (ja) | 2004-08-26 | 2006-03-09 | Omron Corp | チップアンテナおよびその製造方法 |
US7615856B2 (en) * | 2004-09-01 | 2009-11-10 | Sanyo Electric Co., Ltd. | Integrated antenna type circuit apparatus |
GB2422484B (en) * | 2005-01-21 | 2006-12-06 | Artimi Ltd | Integrated circuit die connection methods and apparatus |
US7372408B2 (en) * | 2006-01-13 | 2008-05-13 | International Business Machines Corporation | Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas |
US8201746B2 (en) | 2006-01-24 | 2012-06-19 | Agency For Science, Technology And Research | On-chip antenna and a method of fabricating the same |
US7518221B2 (en) * | 2006-01-26 | 2009-04-14 | International Business Machines Corporation | Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires |
US7595766B2 (en) * | 2006-12-29 | 2009-09-29 | Broadcom Corporation | Low efficiency integrated circuit antenna |
-
2006
- 2006-12-29 US US11/648,826 patent/US7893878B2/en active Active
-
2007
- 2007-09-26 EP EP07018955A patent/EP1939979A1/en not_active Ceased
- 2007-12-28 KR KR1020070140978A patent/KR100981143B1/ko active IP Right Grant
- 2007-12-28 TW TW096151028A patent/TWI396326B/zh active
- 2007-12-29 CN CN2007103080436A patent/CN101227024B/zh active Active
-
2008
- 2008-12-31 HK HK08114120.6A patent/HK1122906A1/xx not_active IP Right Cessation
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102224590B (zh) * | 2008-11-25 | 2014-06-04 | 高通股份有限公司 | 集成于半导体芯片中的天线 |
US9270030B2 (en) | 2010-04-11 | 2016-02-23 | Broadcom Corporation | RF and NFC PAMM enhanced electromagnetic signaling |
US9147933B2 (en) | 2010-04-11 | 2015-09-29 | Broadcom Corporation | Three-dimensional spiral antenna and applications thereof |
CN102683805B (zh) * | 2011-03-14 | 2015-10-07 | 深圳光启高等理工研究院 | 一种可调节的射频天线 |
CN102683805A (zh) * | 2011-03-14 | 2012-09-19 | 深圳光启高等理工研究院 | 一种可调节的射频天线 |
CN102800943A (zh) * | 2011-05-31 | 2012-11-28 | 深圳光启高等理工研究院 | 一种双极化天线及具有该双极化天线的mimo天线 |
CN103326110A (zh) * | 2012-03-23 | 2013-09-25 | 美国博通公司 | 三维螺旋天线及其应用 |
CN103326110B (zh) * | 2012-03-23 | 2017-03-01 | 美国博通公司 | 三维螺旋天线及其应用 |
WO2014161479A1 (zh) * | 2013-04-03 | 2014-10-09 | 中兴通讯股份有限公司 | 多天线通信系统的实现装置、方法及计算机存储介质 |
CN107251319A (zh) * | 2015-02-26 | 2017-10-13 | 特拉维夫大学拉莫特有限公司 | 用于改进片上天线的效率的技术 |
TWI705455B (zh) * | 2019-07-03 | 2020-09-21 | 友懋國際科技股份有限公司 | 阻抗變換網路及包括其之記憶體模組 |
CN110995224A (zh) * | 2019-12-09 | 2020-04-10 | 成都知融科技股份有限公司 | 一种具备收发切换和极化切换功能的开关结构 |
US20210209436A1 (en) * | 2020-01-03 | 2021-07-08 | Sensormatic Electronics, LLC | Rfid tag and method of making same |
US11694057B2 (en) * | 2020-01-03 | 2023-07-04 | Sensormatic Electronics, LLC | RFID tag and method of making same |
Also Published As
Publication number | Publication date |
---|---|
EP1939979A1 (en) | 2008-07-02 |
US7893878B2 (en) | 2011-02-22 |
KR20080063211A (ko) | 2008-07-03 |
TWI396326B (zh) | 2013-05-11 |
TW200845474A (en) | 2008-11-16 |
HK1122906A1 (en) | 2009-05-29 |
CN101227024B (zh) | 2013-03-13 |
US20080158087A1 (en) | 2008-07-03 |
KR100981143B1 (ko) | 2010-09-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101227023B (zh) | 集成电路及其天线结构 | |
CN101227024B (zh) | 集成电路的天线结构 | |
CN101232311B (zh) | 可调集成电路天线结构 | |
US8064533B2 (en) | Reconfigurable MIMO transceiver and method for use therewith | |
US8170498B2 (en) | IC antenna structures and applications thereof | |
US7944398B2 (en) | Integrated circuit having a low efficiency antenna | |
US7894777B1 (en) | IC with a configurable antenna structure | |
US7839334B2 (en) | IC with a 55-64 GHz antenna | |
US8090044B2 (en) | Multimode transceiver for use with multiple antennas and method for use therewith | |
US20090117855A1 (en) | Transceiver for use with multiple antennas and method for use therewith |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1122906 Country of ref document: HK |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: GR Ref document number: 1122906 Country of ref document: HK |
|
TR01 | Transfer of patent right |
Effective date of registration: 20170828 Address after: American Texas Patentee after: NXP America Co Ltd Address before: Park Road, Irvine, California, USA, 16215, 92618-7013 Patentee before: Zyray Wireless Inc. |
|
TR01 | Transfer of patent right |