HK1105181A1 - Micro-fluid ejection device having high resistance heater film - Google Patents

Micro-fluid ejection device having high resistance heater film

Info

Publication number
HK1105181A1
HK1105181A1 HK07110454.1A HK07110454A HK1105181A1 HK 1105181 A1 HK1105181 A1 HK 1105181A1 HK 07110454 A HK07110454 A HK 07110454A HK 1105181 A1 HK1105181 A1 HK 1105181A1
Authority
HK
Hong Kong
Prior art keywords
micro
high resistance
ejection device
fluid ejection
resistance heater
Prior art date
Application number
HK07110454.1A
Other languages
English (en)
Inventor
Byron V Bell
Robert W Cornell
Yimin Guan
George K Parish
Original Assignee
Lexmark Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lexmark Int Inc filed Critical Lexmark Int Inc
Publication of HK1105181A1 publication Critical patent/HK1105181A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/03—Specific materials used
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y10T29/49098—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49346—Rocket or jet device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
HK07110454.1A 2004-01-20 2007-09-27 Micro-fluid ejection device having high resistance heater film HK1105181A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/760,726 US7080896B2 (en) 2004-01-20 2004-01-20 Micro-fluid ejection device having high resistance heater film
PCT/US2005/001809 WO2005069947A2 (en) 2004-01-20 2005-01-20 Micro-fluid ejection device having high resistance heater film

Publications (1)

Publication Number Publication Date
HK1105181A1 true HK1105181A1 (en) 2008-02-06

Family

ID=34750056

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07110454.1A HK1105181A1 (en) 2004-01-20 2007-09-27 Micro-fluid ejection device having high resistance heater film

Country Status (13)

Country Link
US (3) US7080896B2 (zh)
EP (2) EP2177360B1 (zh)
JP (1) JP2007526143A (zh)
CN (1) CN1997519B (zh)
AU (1) AU2005206983B2 (zh)
BR (1) BRPI0506936A (zh)
CA (1) CA2552728C (zh)
DE (1) DE602005023410D1 (zh)
HK (1) HK1105181A1 (zh)
MX (1) MXPA06008196A (zh)
TW (1) TWI340091B (zh)
WO (1) WO2005069947A2 (zh)
ZA (1) ZA200605470B (zh)

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US8409458B2 (en) * 2007-03-02 2013-04-02 Texas Instruments Incorporated Process for reactive ion etching a layer of diamond like carbon
US20080214007A1 (en) * 2007-03-02 2008-09-04 Texas Instruments Incorporated Method for removing diamond like carbon residue from a deposition/etch chamber using a plasma clean
US20080213927A1 (en) * 2007-03-02 2008-09-04 Texas Instruments Incorporated Method for manufacturing an improved resistive structure
US9555630B2 (en) 2007-12-02 2017-01-31 Hewlett-Packard Development Company, L.P. Electrically connecting electrically isolated printhead die ground networks at flexible circuit
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EP2563596B1 (en) * 2010-04-29 2015-07-22 Hewlett Packard Development Company, L.P. Fluid ejection device
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US9016837B2 (en) * 2013-05-14 2015-04-28 Stmicroelectronics, Inc. Ink jet printhead device with compressive stressed dielectric layer
CN103325507B (zh) * 2013-06-21 2017-02-22 广州天极电子科技有限公司 一种高稳定性的薄膜电阻器及其制造方法
CN105939857B (zh) * 2014-01-29 2017-09-26 惠普发展公司，有限责任合伙企业 热喷墨打印头
EP3237214B1 (en) * 2015-04-10 2021-06-02 Hewlett-Packard Development Company, L.P. Removing an inclined segment of a metal conductor while forming printheads
US10173420B2 (en) 2015-07-30 2019-01-08 Hewlett-Packard Development Company, L.P. Printhead assembly
US10334879B2 (en) * 2015-12-21 2019-07-02 Funai Electric Co., Ltd Method and apparatus for metering and vaporizing a fluid
EP3405349B1 (en) * 2016-01-20 2021-07-14 Hewlett-Packard Development Company, L.P. Energy efficient printheads
US10314342B2 (en) 2017-10-20 2019-06-11 Altria Client Services Llc E-vaping device using a jet dispensing cartridge, and method of operating the e-vaping device
CN114242361A (zh) * 2021-11-29 2022-03-25 广东风华高新科技股份有限公司 一种薄膜片式电阻器及其制备方法

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Also Published As

Publication number Publication date
TWI340091B (en) 2011-04-11
EP2177360A1 (en) 2010-04-21
US20090094834A1 (en) 2009-04-16
EP2177360B1 (en) 2011-05-25
WO2005069947A3 (en) 2006-10-12
DE602005023410D1 (de) 2010-10-21
US7918015B2 (en) 2011-04-05
EP1716000A4 (en) 2009-08-26
AU2005206983A1 (en) 2005-08-04
US20050157089A1 (en) 2005-07-21
WO2005069947A2 (en) 2005-08-04
CA2552728A1 (en) 2005-08-04
US20060197807A1 (en) 2006-09-07
MXPA06008196A (es) 2007-02-02
BRPI0506936A (pt) 2007-06-12
JP2007526143A (ja) 2007-09-13
CA2552728C (en) 2010-10-05
AU2005206983B2 (en) 2009-12-03
TW200530048A (en) 2005-09-16
CN1997519A (zh) 2007-07-11
CN1997519B (zh) 2011-05-25
EP1716000B1 (en) 2010-09-08
ZA200605470B (en) 2008-09-25
US7080896B2 (en) 2006-07-25
EP1716000A2 (en) 2006-11-02

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170120