HK1090959A1 - Power supply device in a device for electrochemical treatment - Google Patents

Power supply device in a device for electrochemical treatment

Info

Publication number
HK1090959A1
HK1090959A1 HK06112633.2A HK06112633A HK1090959A1 HK 1090959 A1 HK1090959 A1 HK 1090959A1 HK 06112633 A HK06112633 A HK 06112633A HK 1090959 A1 HK1090959 A1 HK 1090959A1
Authority
HK
Hong Kong
Prior art keywords
power supply
electrochemical treatment
supply device
electrochemical
treatment
Prior art date
Application number
HK06112633.2A
Other languages
English (en)
Inventor
Britta Scheller
Klaus Brehm
Olaf Lorenz
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1090959A1 publication Critical patent/HK1090959A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Connection Of Batteries Or Terminals (AREA)
HK06112633.2A 2003-09-04 2006-11-16 Power supply device in a device for electrochemical treatment HK1090959A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10340888A DE10340888B3 (de) 2003-09-04 2003-09-04 Stromversorgungseinrichtung in einer Vorrichtung zur elektrochemischen Behandlung
PCT/EP2004/009272 WO2005028718A2 (fr) 2003-09-04 2004-08-18 Systeme d'alimentation en courant dans un dispositif de traitement electrochimique

Publications (1)

Publication Number Publication Date
HK1090959A1 true HK1090959A1 (en) 2007-01-05

Family

ID=34352764

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06112633.2A HK1090959A1 (en) 2003-09-04 2006-11-16 Power supply device in a device for electrochemical treatment

Country Status (11)

Country Link
US (1) US7815777B2 (fr)
EP (1) EP1660701B1 (fr)
JP (1) JP4621204B2 (fr)
KR (1) KR101120048B1 (fr)
CN (1) CN1839221B (fr)
BR (1) BRPI0414090B1 (fr)
DE (1) DE10340888B3 (fr)
HK (1) HK1090959A1 (fr)
NO (1) NO20060793L (fr)
TW (1) TWI349046B (fr)
WO (1) WO2005028718A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1032174C2 (nl) * 2006-07-14 2008-01-15 Elsyca N V Inrichting geschikt voor het elektrochemisch bewerken van een voorwerp alsmede werkwijze voor het vervaardigen van een dergelijke inrichting, werkwijze voor het elektrochemisch bewerken van een voorwerp met een dergelijke inrichting alsmede voorwerp vervaardigd met een dergelijke werkwijze.
NL2005480C2 (nl) 2010-10-07 2012-04-11 Meco Equip Eng Inrichting voor het eenzijdig elektrolytisch behandelen van een vlak substraat.
CN102601470A (zh) * 2012-03-21 2012-07-25 南京航空航天大学 一种管电极电解加工过程稳定性提高方法
US20140033762A1 (en) 2012-08-03 2014-02-06 Air Products And Chemicals, Inc. Heavy Hydrocarbon Removal From A Natural Gas Stream
CN104805490A (zh) * 2015-04-29 2015-07-29 广汽吉奥汽车有限公司 一种电镀单体零件、端部电镀结构及电镀方法
TWI692551B (zh) * 2019-03-04 2020-05-01 聯策科技股份有限公司 不對稱式水封導電夾
CN111485276B (zh) * 2020-06-05 2021-10-12 厦门通富微电子有限公司 一种电镀设备
EP4206364A1 (fr) 2022-01-03 2023-07-05 Atotech Deutschland GmbH & Co. KG Dispositif de préhension d'une pièce à usiner, procédé de fabrication du dispositif, et système de transport et appareil de traitement de surface électrochimique comprenant au moins un tel dispositif

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DE3603856C2 (de) 1986-02-07 1994-05-05 Bosch Gmbh Robert Verfahren und Vorrichtung zur Galvanisierung von ebenen Werkstücken wie Leiterplatten
ES2024439B3 (es) 1986-02-28 1992-03-01 Schering Ag Berlin Und Bergkamen Armazones alargados y piezas correspondientes para la fijacion soltable de placas de circuito impreso que han de galvanizarse, y placas de circuito impreso correspondientes.
DE58905370D1 (de) 1988-07-07 1993-09-30 Siemens Nixdorf Inf Syst Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten.
DE3839972C1 (fr) * 1988-11-26 1989-12-28 Deutsche Automobilgesellschaft Mbh, 3000 Hannover, De
JPH02118967U (fr) * 1989-03-10 1990-09-25
DE3939256A1 (de) 1989-11-28 1991-05-29 Schering Ag Halte- und kontakteinrichtung fuer in einem elektrolysebad zu behandelnde bauelemente
JPH0385849U (fr) * 1989-12-19 1991-08-30
DE4211253A1 (de) * 1992-04-03 1993-10-07 Siemens Ag Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten
AT395915B (de) * 1991-06-27 1993-04-26 Avl Verbrennungskraft Messtech Innenelektrode einer polarographischen elektrode
US5223116A (en) 1992-05-11 1993-06-29 Siemens Aktiengesellschaft Apparatus for electrophoretic application of a lacquer onto plate-shaped work pieces
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DE19504517C1 (de) 1995-02-11 1996-08-08 Atotech Deutschland Gmbh Verfahren zum Galvanisieren von plattenförmigem Behandlungsgut in horizontalen Durchlaufanlagen sowie Vorrichtung zur Durchführung des Verfahrens
JPH0931686A (ja) * 1995-07-21 1997-02-04 Toshiba Corp 電気メッキ装置および電気メッキ方法
US6099712A (en) * 1997-09-30 2000-08-08 Semitool, Inc. Semiconductor plating bowl and method using anode shield
DE19717512C3 (de) 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
DE29708602U1 (de) * 1997-05-14 1997-07-17 Strecker, Günther, 74080 Heilbronn Haltevorrichtung für Tauchgalvanisierung
DE19736352C1 (de) 1997-08-21 1998-12-10 Atotech Deutschland Gmbh Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen
DE29721741U1 (de) * 1997-12-09 1998-03-05 Strecker, Günther, 74080 Heilbronn Klammerartige Haltevorrichtung für Tauchgalvanisierung
US6322678B1 (en) * 1998-07-11 2001-11-27 Semitool, Inc. Electroplating reactor including back-side electrical contact apparatus
ATE299537T1 (de) 1998-08-19 2005-07-15 Atotech Deutschland Gmbh Elektrochemische behandlungsanlage und verfahren zur zuführung von strom zu elektrolytisch behandelndem leiterplattenmaterial
US6294060B1 (en) 1999-10-21 2001-09-25 Ati Properties, Inc. Conveyorized electroplating device
DE10019720A1 (de) * 2000-04-20 2001-10-31 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrischen Kontaktieren von plattenförmigem Behandlungsgut bei elektrolytischen Prozessen
DE10040935C2 (de) * 2000-08-19 2003-05-15 Adelwitz Technologie Zentrum G Verfahren zur galvanischen Beschichtung von Hochtemperatur-Supraleitern mit Cu-Verbindungen
DE10043815C2 (de) * 2000-09-06 2002-08-08 Egon Huebel Verfahren und Vorrichtung zur elektrischen Kontaktierung von zu behandelndem Gut in elektrolytischen Anlagen
DE10065643C2 (de) * 2000-12-29 2003-03-20 Egon Huebel Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut
JP3677488B2 (ja) * 2002-05-14 2005-08-03 丸仲工業株式会社 電気メッキ装置におけるクリップ式のワークハンガー
DE10207941A1 (de) * 2002-02-17 2003-09-04 Egon Huebel Verfahren und Vorrichtung zur elektrischen Kontaktierung von flachem Gut in elektrolytischen Anlagen
US7118658B2 (en) * 2002-05-21 2006-10-10 Semitool, Inc. Electroplating reactor

Also Published As

Publication number Publication date
EP1660701B1 (fr) 2015-02-25
DE10340888B3 (de) 2005-04-21
BRPI0414090A (pt) 2006-10-31
NO20060793L (no) 2006-04-04
TW200513547A (en) 2005-04-16
US7815777B2 (en) 2010-10-19
TWI349046B (en) 2011-09-21
EP1660701A2 (fr) 2006-05-31
JP4621204B2 (ja) 2011-01-26
JP2007504359A (ja) 2007-03-01
BRPI0414090B1 (pt) 2015-08-11
WO2005028718A2 (fr) 2005-03-31
KR101120048B1 (ko) 2012-03-23
CN1839221B (zh) 2011-12-21
CN1839221A (zh) 2006-09-27
US20070039816A1 (en) 2007-02-22
WO2005028718A3 (fr) 2005-06-09
KR20060118424A (ko) 2006-11-23

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170818