HK108393A - Method for bonding integrated circuit chips - Google Patents

Method for bonding integrated circuit chips

Info

Publication number
HK108393A
HK108393A HK1083/93A HK108393A HK108393A HK 108393 A HK108393 A HK 108393A HK 1083/93 A HK1083/93 A HK 1083/93A HK 108393 A HK108393 A HK 108393A HK 108393 A HK108393 A HK 108393A
Authority
HK
Hong Kong
Prior art keywords
integrated circuit
circuit chips
bonding integrated
bonding
solvent
Prior art date
Application number
HK1083/93A
Other languages
English (en)
Inventor
William Frank Graham
Mel Augustine Lofurno
Byron Christos Sakiadis
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of HK108393A publication Critical patent/HK108393A/xx

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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
HK1083/93A 1987-03-30 1993-10-14 Method for bonding integrated circuit chips HK108393A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3179387A 1987-03-30 1987-03-30
US8814187A 1987-08-21 1987-08-21

Publications (1)

Publication Number Publication Date
HK108393A true HK108393A (en) 1993-10-22

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HK1083/93A HK108393A (en) 1987-03-30 1993-10-14 Method for bonding integrated circuit chips

Country Status (8)

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EP (1) EP0285051B1 (xx)
JP (1) JP2515844B2 (xx)
KR (1) KR910002828B1 (xx)
CA (1) CA1290676C (xx)
DE (1) DE3881929T2 (xx)
HK (1) HK108393A (xx)
IL (1) IL85892A (xx)
MY (1) MY103254A (xx)

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JP2927982B2 (ja) * 1991-03-18 1999-07-28 ジャパンゴアテックス株式会社 半導体装置
DE4124053A1 (de) * 1991-07-19 1993-01-21 Siemens Ag Verfahren zum herstellen einer haftverbindung zwischen wenigstens einem bauteil und einem metallischen substrat
US5286417A (en) * 1991-12-06 1994-02-15 International Business Machines Corporation Method and composition for making mechanical and electrical contact
CH686325A5 (de) * 1992-11-27 1996-02-29 Esec Sempac Sa Elektronikmodul und Chip-Karte.
US5471017A (en) * 1994-05-31 1995-11-28 Texas Instruments Incorporated No fixture method to cure die attach for bonding IC dies to substrates
WO1996029730A1 (fr) 1994-12-26 1996-09-26 Hitachi Chemical Company, Ltd. Procede de stratification utilisant un film de stratification en un materiau organique adherant a la matrice, procede d'adhesion a la matrice, dispositif de stratification, dispositif d'adhesion a la matrice, dispositif semi-conducteur et procede pour fabriquer le dispositif semi-conducteur
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
TW310481B (xx) 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
JP3842362B2 (ja) * 1996-02-28 2006-11-08 株式会社東芝 熱圧着方法および熱圧着装置
JP3928753B2 (ja) 1996-08-06 2007-06-13 日立化成工業株式会社 マルチチップ実装法、および接着剤付チップの製造方法
JPH11312881A (ja) 1998-04-28 1999-11-09 Matsushita Electric Ind Co Ltd 基板の接合方法、及び高周波回路、アンテナ、導波管、線路変換器、線路分岐回路、並びに通信システム
TW413912B (en) * 1998-04-28 2000-12-01 Lucent Technologies Inc Process for controlling resin bleeding in integrated circuit packaging
JP4537555B2 (ja) 2000-09-11 2010-09-01 新日鐵化学株式会社 半導体パッケージの製造方法及び半導体パッケージ
KR100517075B1 (ko) 2003-08-11 2005-09-26 삼성전자주식회사 반도체 소자 제조 방법
JP4743131B2 (ja) * 2007-02-15 2011-08-10 宇部興産株式会社 張合わせウエハ−及びその製造方法、基板
JP5919625B2 (ja) * 2011-02-22 2016-05-18 富士通株式会社 半導体装置及びその製造方法、電源装置
GB201405495D0 (en) * 2014-03-27 2014-05-14 Strip Tinning Ltd Busbars

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Also Published As

Publication number Publication date
MY103254A (en) 1993-05-29
IL85892A0 (en) 1988-09-30
EP0285051B1 (en) 1993-06-23
DE3881929T2 (de) 1993-12-02
IL85892A (en) 1994-05-30
EP0285051A3 (en) 1989-05-10
JP2515844B2 (ja) 1996-07-10
DE3881929D1 (de) 1993-07-29
EP0285051A2 (en) 1988-10-05
KR880012129A (ko) 1988-11-03
CA1290676C (en) 1991-10-15
KR910002828B1 (ko) 1991-05-06
JPS63289822A (ja) 1988-11-28

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