HK1081577A1 - Polymide coated polymeric particles - Google Patents
Polymide coated polymeric particlesInfo
- Publication number
- HK1081577A1 HK1081577A1 HK06101432A HK06101432A HK1081577A1 HK 1081577 A1 HK1081577 A1 HK 1081577A1 HK 06101432 A HK06101432 A HK 06101432A HK 06101432 A HK06101432 A HK 06101432A HK 1081577 A1 HK1081577 A1 HK 1081577A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- polymide
- polymeric particles
- coated polymeric
- coated
- particles
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
- C08J3/126—Polymer particles coated by polymer, e.g. core shell structures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37931102P | 2002-05-09 | 2002-05-09 | |
PCT/US2003/014452 WO2003095574A1 (en) | 2002-05-09 | 2003-05-08 | Polymide coated polymeric particles |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1081577A1 true HK1081577A1 (en) | 2006-05-19 |
Family
ID=29420508
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06101432A HK1081577A1 (en) | 2002-05-09 | 2006-02-02 | Polymide coated polymeric particles |
Country Status (9)
Country | Link |
---|---|
US (1) | US20050164002A1 (xx) |
EP (1) | EP1501905B1 (xx) |
JP (1) | JP2005524753A (xx) |
KR (1) | KR100967276B1 (xx) |
CN (1) | CN1307273C (xx) |
AU (1) | AU2003241395A1 (xx) |
CA (1) | CA2483037A1 (xx) |
HK (1) | HK1081577A1 (xx) |
WO (1) | WO2003095574A1 (xx) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100782959B1 (ko) * | 2005-01-25 | 2007-12-11 | 한양대학교 산학협력단 | 다공성 유기 고분자, 이의 제조방법 및 이를 이용한 기체 분리막 |
US7754108B2 (en) * | 2005-06-08 | 2010-07-13 | UBE Industires, Ltd. | Polyimide powder for antistatic polyimide molded product and polyimide molded product thereby |
US20070154716A1 (en) * | 2005-12-30 | 2007-07-05 | Saint-Gobain Performance Plastics Corporation | Composite material |
US20120142825A1 (en) * | 2010-12-07 | 2012-06-07 | E.I. Du Pont De Nemours And Company | Filled polyimide polymers |
US20120142824A1 (en) * | 2010-12-07 | 2012-06-07 | E. I. Du Pont De Nemours And Company | Polymer blend compositions |
WO2013003397A2 (en) * | 2011-06-28 | 2013-01-03 | E. I. Du Pont De Nemours And Company | Polyimide-coated fillers |
CN103928202B (zh) * | 2011-09-26 | 2016-03-02 | 南通大学 | 一种三维电极反应器的绝缘粒子及应用方法 |
JP6031840B2 (ja) * | 2012-01-13 | 2016-11-24 | 宇部興産株式会社 | ポリイミドパウダーとポリイミド前駆体とを含む凝集体とその製造方法、並びにこれを用いたポリイミド成形体 |
WO2013157568A1 (ja) * | 2012-04-20 | 2013-10-24 | 株式会社カネカ | 導電性ポリイミドフィルムの製造方法 |
US20140152155A1 (en) * | 2012-12-05 | 2014-06-05 | Ge Oil & Gas Esp, Inc. | High temperature downhole motors with advanced polyimide insulation materials |
JP2015034289A (ja) * | 2013-07-09 | 2015-02-19 | 宇部興産株式会社 | ポリイミドを含有する混合粉体の凝集体、及びこれを用いた成形体 |
CN103739205B (zh) * | 2013-11-08 | 2017-06-13 | 北京京东方光电科技有限公司 | 功能材料及其制备方法、显示结构形成材料、彩膜基板、显示装置 |
DE112014005493T5 (de) | 2013-12-31 | 2016-08-18 | Saint-Gobain Performance Plastics Corporation | Verbundwerkstofflager, umfassend eine Polyimidmatrix |
WO2016015412A1 (zh) | 2014-07-29 | 2016-02-04 | 京东方科技集团股份有限公司 | 功能材料及其制备方法、导光油墨、导光板 |
JP6578600B2 (ja) * | 2015-10-23 | 2019-09-25 | 国立大学法人 東京大学 | コアシェル粒子 |
JP6993673B2 (ja) * | 2017-09-26 | 2022-01-13 | 河村産業株式会社 | ポリイミド粉体、ポリイミドワニス及びポリイミドフィルム |
JP6993672B2 (ja) * | 2017-09-26 | 2022-01-13 | 河村産業株式会社 | ポリイミド粉体、ポリイミドワニス及びポリイミドフィルム |
WO2019065136A1 (ja) * | 2017-09-26 | 2019-04-04 | 河村産業株式会社 | ポリイミド粉体、ポリイミドワニス及びポリイミドフィルム |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL288197A (xx) * | 1962-01-26 | 1900-01-01 | ||
JPS61281150A (ja) * | 1985-06-05 | 1986-12-11 | Nitto Electric Ind Co Ltd | ポリイミド粉末およびその製法 |
JPS6250372A (ja) * | 1985-08-29 | 1987-03-05 | Mitsui Toatsu Chem Inc | 耐熱性接着剤 |
US5438105A (en) * | 1990-04-27 | 1995-08-01 | Toho Rayon Co., Ltd. | Polyamic acid composite, polyimide composite and processes for producing the same |
US5563001A (en) * | 1992-11-16 | 1996-10-08 | General Motors Corporation | Encapsulated ferromagnetic particles suitable for high temperature use |
DE69404195T2 (de) * | 1993-04-09 | 1997-10-30 | Gen Motors Corp | Magnetkörper aus eingebetteten ferromagnetischen Partikeln und Herstellungsverfahren dafür |
JP3216849B2 (ja) * | 1993-11-26 | 2001-10-09 | セントラル硝子株式会社 | ポリイミド前駆体組成物、ポリイミド組成物およびその製造法 |
US5509738A (en) * | 1994-08-05 | 1996-04-23 | E. I. Du Pont De Nemours And Company | Composite journal and thrust bearing system |
US5700863A (en) * | 1996-08-19 | 1997-12-23 | E. I. Du Pont De Nemours And Company | Polyimide polymeric blends |
US6114156A (en) * | 1996-10-31 | 2000-09-05 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Molecular level coating for metal oxide particles |
JP3478094B2 (ja) * | 1997-11-28 | 2003-12-10 | 東レ株式会社 | 耐熱性ポリマー前駆体の脱水閉環方法 |
JP3531719B2 (ja) | 1998-10-21 | 2004-05-31 | 宇部興産株式会社 | ポリイミド樹脂成形体の製造法 |
US6328798B1 (en) * | 1999-02-19 | 2001-12-11 | Equistar Chemicals, Lp | Coated polymeric particles having improved anti-block characteristics, method of making such particles, and apparatus therefor |
US6733943B2 (en) * | 2001-09-07 | 2004-05-11 | Xerox Corporation | Pressure belt having polyimide outer layer |
-
2003
- 2003-05-06 US US10/429,987 patent/US20050164002A1/en not_active Abandoned
- 2003-05-08 KR KR1020047017959A patent/KR100967276B1/ko not_active IP Right Cessation
- 2003-05-08 WO PCT/US2003/014452 patent/WO2003095574A1/en active Application Filing
- 2003-05-08 CA CA002483037A patent/CA2483037A1/en not_active Abandoned
- 2003-05-08 JP JP2004503572A patent/JP2005524753A/ja active Pending
- 2003-05-08 EP EP03731129A patent/EP1501905B1/en not_active Expired - Lifetime
- 2003-05-08 CN CNB038104687A patent/CN1307273C/zh not_active Expired - Fee Related
- 2003-05-08 AU AU2003241395A patent/AU2003241395A1/en not_active Abandoned
-
2006
- 2006-02-02 HK HK06101432A patent/HK1081577A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2005524753A (ja) | 2005-08-18 |
EP1501905A1 (en) | 2005-02-02 |
EP1501905B1 (en) | 2012-06-13 |
KR20040104712A (ko) | 2004-12-10 |
US20050164002A1 (en) | 2005-07-28 |
CN1653147A (zh) | 2005-08-10 |
WO2003095574A1 (en) | 2003-11-20 |
CN1307273C (zh) | 2007-03-28 |
AU2003241395A1 (en) | 2003-11-11 |
KR100967276B1 (ko) | 2010-07-01 |
CA2483037A1 (en) | 2003-11-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20120508 |