HK1077250A1 - Laser machining apparatus - Google Patents

Laser machining apparatus

Info

Publication number
HK1077250A1
HK1077250A1 HK05109263.6A HK05109263A HK1077250A1 HK 1077250 A1 HK1077250 A1 HK 1077250A1 HK 05109263 A HK05109263 A HK 05109263A HK 1077250 A1 HK1077250 A1 HK 1077250A1
Authority
HK
Hong Kong
Prior art keywords
machining apparatus
laser machining
laser
machining
Prior art date
Application number
HK05109263.6A
Other languages
English (en)
Inventor
Ishii Kazuhisa
Watanabe Fumio
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of HK1077250A1 publication Critical patent/HK1077250A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
    • A45C2011/002—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 for portable handheld communication devices, e.g. mobile phone, pager, beeper, PDA, smart phone

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Laser Surgery Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
HK05109263.6A 2004-01-20 2005-10-20 Laser machining apparatus HK1077250A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004012425A JP4184288B2 (ja) 2004-01-20 2004-01-20 レーザ加工機

Publications (1)

Publication Number Publication Date
HK1077250A1 true HK1077250A1 (en) 2006-02-10

Family

ID=34792379

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05109263.6A HK1077250A1 (en) 2004-01-20 2005-10-20 Laser machining apparatus

Country Status (6)

Country Link
US (1) US7473867B2 (fr)
JP (1) JP4184288B2 (fr)
KR (1) KR101100514B1 (fr)
CN (1) CN1644296B (fr)
HK (1) HK1077250A1 (fr)
TW (1) TWI331061B (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101104223B (zh) * 2006-07-10 2012-05-23 彩霸阳光株式会社 激光加工装置
JP4917382B2 (ja) * 2006-08-09 2012-04-18 株式会社ディスコ レーザー光線照射装置およびレーザー加工機
JP5137488B2 (ja) * 2007-07-25 2013-02-06 オリンパス株式会社 レーザ照射装置およびそれを用いたレーザ加工システム
JP4401410B2 (ja) * 2007-11-21 2010-01-20 三菱電機株式会社 レーザ加工装置
JP5011072B2 (ja) * 2007-11-21 2012-08-29 株式会社ディスコ レーザー加工装置
CN103212788A (zh) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 激光切割折转光路与聚焦镜自准直系统
JP5964604B2 (ja) * 2012-02-09 2016-08-03 株式会社ディスコ レーザー加工装置
JP5931537B2 (ja) * 2012-03-28 2016-06-08 東レエンジニアリング株式会社 レーザの光軸アライメント方法およびそれを用いたレーザ加工装置
CN104180969B (zh) * 2013-05-22 2017-05-31 上海微电子装备有限公司 灯室光锥的检测装置及其检测方法
TWI621497B (zh) * 2013-05-27 2018-04-21 Nippon Sharyo Ltd Laser processing machine
DE102014200633B3 (de) * 2014-01-15 2015-05-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bearbeitungsvorrichtung und -verfahren zur Laserbearbeitung einer Oberfläche
JP6521870B2 (ja) * 2014-02-10 2019-05-29 ギガフォトン株式会社 レーザ装置
JP2015182104A (ja) * 2014-03-24 2015-10-22 ファナック株式会社 レーザ光の伝播監視機能を備えたレーザ加工機
CN112352358A (zh) * 2018-05-15 2021-02-09 松下知识产权经营株式会社 激光装置和使用了该激光装置的激光加工装置
US11285670B2 (en) * 2018-08-27 2022-03-29 The Boeing Company Laser fabrication additive system and method
CN109877446B (zh) * 2018-12-21 2020-07-31 中国科学院西安光学精密机械研究所 一种激光光束的指向精度检测调节方法
JP6697108B2 (ja) * 2019-04-22 2020-05-20 ギガフォトン株式会社 レーザ装置及び極端紫外光生成システム
JP7517241B2 (ja) 2021-04-23 2024-07-17 株式会社デンソー レーザ光軸調整方法
CN115016096A (zh) * 2022-07-06 2022-09-06 中国航空制造技术研究院 一种多级反射光路自动对准装置及方法
CN116623144A (zh) * 2023-04-06 2023-08-22 无锡翔域半导体有限公司 一种用于铝离子注入机的激光预热装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4710604A (en) * 1985-12-20 1987-12-01 Nippon Kogaku K. K. Machining apparatus with laser beam
JP2716121B2 (ja) * 1987-02-06 1998-02-18 株式会社ニコン レーザ光軸検出装置
US5172356A (en) * 1990-06-07 1992-12-15 Ricoh Company, Ltd. Separation type optical pickup device
JPH05228673A (ja) 1992-02-18 1993-09-07 Toshiba Corp レ−ザ−加工装置
US5536916A (en) * 1994-09-30 1996-07-16 Sanyo Machine Works, Ltd. Method for performing automatic alignment-adjustment of laser robot and the device
FR2832945A1 (fr) * 2001-11-30 2003-06-06 Technifor Dispositif d'usinage de pieces a l'aide d'un faisceau laser

Also Published As

Publication number Publication date
TWI331061B (en) 2010-10-01
CN1644296B (zh) 2011-06-15
JP4184288B2 (ja) 2008-11-19
KR101100514B1 (ko) 2011-12-29
CN1644296A (zh) 2005-07-27
JP2005205429A (ja) 2005-08-04
US20050161445A1 (en) 2005-07-28
KR20050076624A (ko) 2005-07-26
TW200533453A (en) 2005-10-16
US7473867B2 (en) 2009-01-06

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150118