HK1076860A1 - Electrode cartridge and a system for measuring an internal stress for a film of plating - Google Patents

Electrode cartridge and a system for measuring an internal stress for a film of plating

Info

Publication number
HK1076860A1
HK1076860A1 HK05108688A HK05108688A HK1076860A1 HK 1076860 A1 HK1076860 A1 HK 1076860A1 HK 05108688 A HK05108688 A HK 05108688A HK 05108688 A HK05108688 A HK 05108688A HK 1076860 A1 HK1076860 A1 HK 1076860A1
Authority
HK
Hong Kong
Prior art keywords
plating
measuring
film
internal stress
electrode cartridge
Prior art date
Application number
HK05108688A
Other languages
English (en)
Inventor
Wataru Yamamoto
Katsunori Akiyama
Fumio Harada
Yutaka Tsuru
Original Assignee
Yamamoto Ms Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamamoto Ms Co Ltd filed Critical Yamamoto Ms Co Ltd
Publication of HK1076860A1 publication Critical patent/HK1076860A1/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Measurement Of Force In General (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
HK05108688A 2004-02-03 2005-09-30 Electrode cartridge and a system for measuring an internal stress for a film of plating HK1076860A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004027300A JP4074592B2 (ja) 2004-02-03 2004-02-03 電極カートリッジ及びめっき内部応力測定システム

Publications (1)

Publication Number Publication Date
HK1076860A1 true HK1076860A1 (en) 2006-01-27

Family

ID=34675485

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05108688A HK1076860A1 (en) 2004-02-03 2005-09-30 Electrode cartridge and a system for measuring an internal stress for a film of plating

Country Status (8)

Country Link
US (1) US7682493B2 (xx)
EP (1) EP1561844B1 (xx)
JP (1) JP4074592B2 (xx)
KR (1) KR101148216B1 (xx)
CN (1) CN1308664C (xx)
DE (1) DE602005019802D1 (xx)
HK (1) HK1076860A1 (xx)
TW (1) TWI287631B (xx)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101714535B1 (ko) * 2008-12-22 2017-03-09 삼성전자주식회사 탈이온화 장치 및 그 제어방법
TWI426255B (zh) * 2009-10-29 2014-02-11 Univ Nat Pingtung Sci & Tech 厚膜拉力測試裝置
WO2015198185A1 (en) * 2014-06-23 2015-12-30 Ecole Polytechnique Federale De Lausanne (Epfl) Electrochemical coating stress sensor, apparatus and method for accurately monitoring and controlling electrochemical reactions and material coating
JP6472631B2 (ja) * 2014-10-02 2019-02-20 日置電機株式会社 電気化学センサおよび電気化学測定装置
US9945045B2 (en) 2015-12-02 2018-04-17 Ashwin-Ushas Corporation, Inc. Electrochemical deposition apparatus and methods of using the same
KR102373893B1 (ko) * 2018-03-13 2022-03-11 가부시키가이샤 야마모토메키시켄키 도금 장치 및 도금 시스템
TWI769559B (zh) * 2020-10-16 2022-07-01 遠東科技大學 評估鍍膜層耐蝕性方法
CN112857624B (zh) * 2021-01-04 2021-12-24 北京科技大学 一种镀层内应力的测量装置及操作方法
CN114910114B (zh) * 2021-02-07 2023-12-12 哈尔滨工业大学 一种电铸过程中镀层内应力和镀液pH在线原位监测装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB112315A (en) * 1917-01-04 1918-01-04 John Francis O'rourke Improved Process of Making Tunnels.
US2675348A (en) * 1950-09-16 1954-04-13 Greenspan Lawrence Apparatus for metal plating
US4086154A (en) * 1976-07-26 1978-04-25 The Boeing Company Apparatus for determining stress in an electrodeposit
US4648944A (en) * 1985-07-18 1987-03-10 Martin Marietta Corporation Apparatus and method for controlling plating induced stress in electroforming and electroplating processes
US4786376A (en) * 1988-01-05 1988-11-22 The United States Of America As Represented By The Secretary Of The Air Force Electrodeposition without internal deposit stress
US4986130A (en) * 1989-10-19 1991-01-22 Engelhaupt Darell E Apparatus and method for monitoring stress as a coating is applied
US5149419A (en) * 1991-07-18 1992-09-22 Eastman Kodak Company Method for fabricating long array orifice plates
US5227046A (en) * 1991-10-07 1993-07-13 Unisys Corporation Low temperature tin-bismuth electroplating system
JPH09291395A (ja) * 1996-04-26 1997-11-11 Toyota Motor Corp めっき残留応力の制御方法
JP2000002598A (ja) 1998-06-15 2000-01-07 Yamamoto Mekki Shikenki:Kk 高速電気めっきの内部応力試験装置
US7070686B2 (en) * 2000-03-27 2006-07-04 Novellus Systems, Inc. Dynamically variable field shaping element
DE19936036C2 (de) * 1999-07-30 2003-05-08 Claho Engineering Gmbh Verfahren und Vorrichtung zur Herstellung eines dreidimensionalen metallischen Bauteils
JP3730836B2 (ja) * 2000-05-24 2006-01-05 株式会社山本鍍金試験器 電気めっき試験器の陰極カートリッジ
JP3328812B2 (ja) * 2000-10-06 2002-09-30 株式会社山本鍍金試験器 電気めっき試験器の陰極カートリッジおよび陽極カートリッジ
JP2008002598A (ja) * 2006-06-23 2008-01-10 Toshiba Home Technology Corp 断熱材及びその製造方法

Also Published As

Publication number Publication date
TW200535405A (en) 2005-11-01
JP2005221269A (ja) 2005-08-18
EP1561844A3 (en) 2008-03-26
DE602005019802D1 (de) 2010-04-22
EP1561844A2 (en) 2005-08-10
TWI287631B (en) 2007-10-01
KR101148216B1 (ko) 2012-05-25
CN1651884A (zh) 2005-08-10
KR20060041635A (ko) 2006-05-12
US20050189220A1 (en) 2005-09-01
CN1308664C (zh) 2007-04-04
JP4074592B2 (ja) 2008-04-09
US7682493B2 (en) 2010-03-23
EP1561844B1 (en) 2010-03-10

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170203