HK1073759A1 - Method and device for coating printed boards with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened - Google Patents
Method and device for coating printed boards with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardenedInfo
- Publication number
- HK1073759A1 HK1073759A1 HK05106182A HK05106182A HK1073759A1 HK 1073759 A1 HK1073759 A1 HK 1073759A1 HK 05106182 A HK05106182 A HK 05106182A HK 05106182 A HK05106182 A HK 05106182A HK 1073759 A1 HK1073759 A1 HK 1073759A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- printed boards
- roller
- solder stop
- galvanoresists
- structured
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
- B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
- B05C1/0826—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets
- B05C1/083—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets being passed between the coating roller and one or more backing rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
- B05C1/025—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles to flat rectangular articles, e.g. flat sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
- B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1563—Reversing the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laser Beam Processing (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10247861 | 2002-10-14 | ||
DE10250485 | 2002-10-29 | ||
DE10252897 | 2002-11-12 | ||
DE10300344A DE10300344A1 (de) | 2002-10-14 | 2003-01-05 | Mittels Laser strukturierbarer thermisch härtbarer Lötstopplack Verfahren und Vorrichtung zur Beschichtung von Leiterplatten |
PCT/EP2003/011369 WO2004036967A1 (de) | 2002-10-14 | 2003-10-14 | Verfahren und vorrichtung zur beschichtung von leiterplatten mit laser-strukturierbaren, thermisch härtbaren lötstopplacken sowie galvanoresisten |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1073759A1 true HK1073759A1 (en) | 2005-10-14 |
Family
ID=32110879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK05106182A HK1073759A1 (en) | 2002-10-14 | 2005-07-21 | Method and device for coating printed boards with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened |
Country Status (11)
Country | Link |
---|---|
US (1) | US20070141263A1 (xx) |
EP (1) | EP1552730B1 (xx) |
JP (1) | JP4347294B2 (xx) |
KR (1) | KR100946973B1 (xx) |
AT (1) | ATE365442T1 (xx) |
AU (1) | AU2003274002A1 (xx) |
CA (1) | CA2502140A1 (xx) |
DE (1) | DE50307530D1 (xx) |
HK (1) | HK1073759A1 (xx) |
TW (1) | TWI290016B (xx) |
WO (1) | WO2004036967A1 (xx) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4675227B2 (ja) * | 2005-12-21 | 2011-04-20 | トヨタ自動車株式会社 | 凸部の頂面に被覆膜を形成する方法 |
GB2452320B (en) * | 2007-09-03 | 2012-04-11 | Dek Int Gmbh | Workpiece processing system and method |
US8707898B2 (en) * | 2008-02-13 | 2014-04-29 | Ncr Corporation | Apparatus for fanfolding media |
US9975368B2 (en) | 2008-02-13 | 2018-05-22 | Iconex Llc | Fanfold media dust inhibitor |
JP5293839B2 (ja) * | 2010-12-24 | 2013-09-18 | トヨタ自動車株式会社 | 塗工装置および電極板の製造方法 |
CN106696475B (zh) * | 2015-11-13 | 2019-06-18 | 富泰华工业(深圳)有限公司 | 打印机及利用打印机打印电路板的方法 |
US10076800B2 (en) | 2015-11-30 | 2018-09-18 | Cree Fayetteville, Inc. | Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly |
DE102017207491A1 (de) * | 2017-05-04 | 2018-11-08 | Bayerische Motoren Werke Aktiengesellschaft | Elektronikmodul |
KR102477944B1 (ko) * | 2018-01-04 | 2022-12-14 | 엘지전자 주식회사 | 유기 증착 장치 |
CN110756378A (zh) * | 2019-11-07 | 2020-02-07 | 安徽嘉禾整木家居有限公司 | 一种用于家具面板平面滚漆装置 |
CN112996251B (zh) * | 2021-02-07 | 2022-02-15 | 深圳市鸿南电子有限公司 | Pcba板封装设备及pcba板封装方法 |
CN114340193B (zh) * | 2021-12-20 | 2024-06-04 | 黄石永兴隆电子有限公司 | 一种Mini LED板新型高效阻焊生产工艺 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3535157A (en) * | 1967-12-18 | 1970-10-20 | Shipley Co | Method of coating printed circuit board having through-holes |
DE2861486D1 (en) * | 1977-11-21 | 1982-02-18 | Ciba Geigy Ag | Process for the application of soldering masks to printed circuits with through holes for contacting |
DE3816614A1 (de) * | 1988-05-16 | 1989-11-30 | Siemens Ag | Verfahren und vorrichtung zur beschichtung von flachbaugruppen |
DE59407101D1 (de) * | 1993-05-12 | 1998-11-19 | Ciba Geigy Ag | Verfahren und vorrichtung zum beschichten von leiterplatten |
US5843621A (en) * | 1993-05-12 | 1998-12-01 | Ciba-Geigy Ag | Process and apparatus for coating printed circuit boards |
DE19516193A1 (de) * | 1994-05-13 | 1995-11-16 | Schaefer Hans Juergen | Verfahren und Vorrichtung zum Beschichten von Leiterplatten, insbesondere zur Herstellung von Multi-Chip-Modulen |
US5804256A (en) * | 1994-06-23 | 1998-09-08 | Schaefer; Hans-Jorgen | Method and device for coating printed-circuit boards |
DE19704260A1 (de) * | 1996-03-15 | 1997-11-06 | Schaefer Hans Juergen | Verfahren und Vorrichtung zum selektiven Beschichten von Lacken auf Leiterplatten |
EP1843650B1 (en) * | 1998-09-03 | 2012-03-07 | Ibiden Co., Ltd. | Method of manufacturing a multilayered printed circuit board |
DE10101359A1 (de) * | 2001-01-13 | 2002-07-25 | Conti Temic Microelectronic | Verfahren zur Herstellung einer elektronischen Baugruppe |
-
2003
- 2003-10-13 TW TW092128464A patent/TWI290016B/zh not_active IP Right Cessation
- 2003-10-14 EP EP03757973A patent/EP1552730B1/de not_active Expired - Lifetime
- 2003-10-14 KR KR1020057004858A patent/KR100946973B1/ko not_active IP Right Cessation
- 2003-10-14 US US10/531,394 patent/US20070141263A1/en not_active Abandoned
- 2003-10-14 CA CA002502140A patent/CA2502140A1/en not_active Abandoned
- 2003-10-14 WO PCT/EP2003/011369 patent/WO2004036967A1/de active IP Right Grant
- 2003-10-14 AT AT03757973T patent/ATE365442T1/de active
- 2003-10-14 AU AU2003274002A patent/AU2003274002A1/en not_active Abandoned
- 2003-10-14 JP JP2005501290A patent/JP4347294B2/ja not_active Expired - Fee Related
- 2003-10-14 DE DE50307530T patent/DE50307530D1/de not_active Expired - Lifetime
-
2005
- 2005-07-21 HK HK05106182A patent/HK1073759A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4347294B2 (ja) | 2009-10-21 |
US20070141263A1 (en) | 2007-06-21 |
WO2004036967A1 (de) | 2004-04-29 |
TW200417300A (en) | 2004-09-01 |
ATE365442T1 (de) | 2007-07-15 |
KR100946973B1 (ko) | 2010-03-15 |
KR20050053680A (ko) | 2005-06-08 |
TWI290016B (en) | 2007-11-11 |
AU2003274002A1 (en) | 2004-05-04 |
EP1552730B1 (de) | 2007-06-20 |
JP2006503444A (ja) | 2006-01-26 |
CA2502140A1 (en) | 2004-04-29 |
EP1552730A1 (de) | 2005-07-13 |
DE50307530D1 (de) | 2007-08-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20111014 |