HK107291A - Lead frame and electronic device employing the same - Google Patents

Lead frame and electronic device employing the same

Info

Publication number
HK107291A
HK107291A HK1072/91A HK107291A HK107291A HK 107291 A HK107291 A HK 107291A HK 1072/91 A HK1072/91 A HK 1072/91A HK 107291 A HK107291 A HK 107291A HK 107291 A HK107291 A HK 107291A
Authority
HK
Hong Kong
Prior art keywords
same
electronic device
lead frame
device employing
employing
Prior art date
Application number
HK1072/91A
Other languages
English (en)
Inventor
Ichio Shimizu
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of HK107291A publication Critical patent/HK107291A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F3/00—Cores, Yokes, or armatures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/06—Electromagnets; Actuators including electromagnets
    • H01F7/08—Electromagnets; Actuators including electromagnets with armatures
    • H01F7/16—Rectilinearly-movable armatures
    • H01F7/1607—Armatures entering the winding
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49544—Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
HK1072/91A 1984-07-25 1991-12-23 Lead frame and electronic device employing the same HK107291A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15288484A JPS6132452A (ja) 1984-07-25 1984-07-25 リ−ドフレ−ムとそれを用いた電子装置

Publications (1)

Publication Number Publication Date
HK107291A true HK107291A (en) 1992-01-03

Family

ID=15550224

Family Applications (1)

Application Number Title Priority Date Filing Date
HK1072/91A HK107291A (en) 1984-07-25 1991-12-23 Lead frame and electronic device employing the same

Country Status (8)

Country Link
US (3) US4797787A (fr)
EP (1) EP0173847B1 (fr)
JP (1) JPS6132452A (fr)
KR (1) KR930011455B1 (fr)
DE (1) DE3575239D1 (fr)
HK (1) HK107291A (fr)
MY (1) MY101858A (fr)
SG (1) SG97491G (fr)

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US5592130A (en) * 1987-02-27 1997-01-07 Seiko Epson Corporation Piezoelectric oscillator including a piezoelectric resonator with outer lead
JP2522524B2 (ja) * 1988-08-06 1996-08-07 株式会社東芝 半導体装置の製造方法
US5255156A (en) * 1989-02-22 1993-10-19 The Boeing Company Bonding pad interconnection on a multiple chip module having minimum channel width
JP2515406B2 (ja) * 1989-09-05 1996-07-10 株式会社東芝 樹脂封止型半導体装置
US5012213A (en) * 1989-12-19 1991-04-30 Motorola, Inc. Providing a PGA package with a low reflection line
US5233133A (en) * 1990-07-25 1993-08-03 Hitachi Chemical Company Ltd. Coaxial conductor interconnection wiring board
JP2741281B2 (ja) * 1990-08-08 1998-04-15 ローム株式会社 リードフレームおよびこれを使用して製造された半導体装置
JP2745933B2 (ja) * 1992-02-17 1998-04-28 日本電気株式会社 Ｔａｂ−集積回路
US5970607A (en) * 1993-09-30 1999-10-26 Illinois Tool Works Inc. Method of making an electrical subassembly
JP2820645B2 (ja) * 1994-08-30 1998-11-05 アナム インダストリアル カンパニー インコーポレーティド 半導体リードフレーム
KR0156622B1 (ko) * 1995-04-27 1998-10-15 문정환 반도체 패키지,리드프레임 및 제조방법
US5781682A (en) * 1996-02-01 1998-07-14 International Business Machines Corporation Low-cost packaging for parallel optical computer link
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
JP2009141080A (ja) * 2007-12-05 2009-06-25 Toshiba Corp リードフレームおよび半導体装置
JP2009200253A (ja) * 2008-02-21 2009-09-03 Powertech Technology Inc 半導体装置
US20110012240A1 (en) * 2009-07-15 2011-01-20 Chenglin Liu Multi-Connect Lead
US9978669B2 (en) * 2016-06-30 2018-05-22 Nxp Usa, Inc. Packaged semiconductor device having a lead frame and inner and outer leads and method for forming

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BE757101A (fr) * 1969-10-06 1971-03-16 Grisby Barton Inc Assemblage de relais
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US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
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JPS6132452A (ja) * 1984-07-25 1986-02-15 Hitachi Ltd リ−ドフレ−ムとそれを用いた電子装置

Also Published As

Publication number Publication date
SG97491G (en) 1992-01-17
US4907129A (en) 1990-03-06
EP0173847B1 (fr) 1990-01-03
KR860001478A (ko) 1986-02-26
JPS6132452A (ja) 1986-02-15
DE3575239D1 (de) 1990-02-08
MY101858A (en) 1992-01-31
US5121300A (en) 1992-06-09
KR930011455B1 (ko) 1993-12-08
EP0173847A1 (fr) 1986-03-12
US4797787A (en) 1989-01-10

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