HK1070399A1 - Liquid tank - Google Patents

Liquid tank

Info

Publication number
HK1070399A1
HK1070399A1 HK05103050A HK05103050A HK1070399A1 HK 1070399 A1 HK1070399 A1 HK 1070399A1 HK 05103050 A HK05103050 A HK 05103050A HK 05103050 A HK05103050 A HK 05103050A HK 1070399 A1 HK1070399 A1 HK 1070399A1
Authority
HK
Hong Kong
Prior art keywords
liquid tank
tank
liquid
Prior art date
Application number
HK05103050A
Other languages
English (en)
Inventor
Wataru Yamamoto
Original Assignee
Yamamoto Ms Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamamoto Ms Co Ltd filed Critical Yamamoto Ms Co Ltd
Publication of HK1070399A1 publication Critical patent/HK1070399A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1669—Agitation, e.g. air introduction
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning In General (AREA)
  • Devices For Medical Bathing And Washing (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
HK05103050A 2003-06-06 2005-04-11 Liquid tank HK1070399A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003161657A JP3930832B2 (ja) 2003-06-06 2003-06-06 水槽

Publications (1)

Publication Number Publication Date
HK1070399A1 true HK1070399A1 (en) 2005-06-17

Family

ID=33157211

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05103050A HK1070399A1 (en) 2003-06-06 2005-04-11 Liquid tank

Country Status (8)

Country Link
US (1) US7361225B2 (ko)
EP (1) EP1484431B1 (ko)
JP (1) JP3930832B2 (ko)
KR (1) KR101027810B1 (ko)
CN (1) CN1303261C (ko)
DE (1) DE602004019014D1 (ko)
HK (1) HK1070399A1 (ko)
TW (1) TWI249592B (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4834087B2 (ja) * 2006-05-26 2011-12-07 新日本製鐵株式会社 金属板の連続溶融めっき浴槽内における巻き上がり防止装置
CN102851726B (zh) * 2011-06-30 2016-08-10 扬州市金杨电镀设备有限公司 小零件电镀装置
TWI454595B (zh) * 2011-12-29 2014-10-01 Chii Rong Yang 複合材料電鍍設備
CN104342723A (zh) * 2013-07-31 2015-02-11 南昌欧菲光科技有限公司 电铸设备
JP6552485B2 (ja) * 2014-05-12 2019-07-31 株式会社山本鍍金試験器 めっき装置及び収容槽
KR101606987B1 (ko) * 2014-05-30 2016-03-28 현대제철 주식회사 전기도금 모사장치
CN105214893B (zh) * 2015-10-08 2018-05-11 遵义市润丰源钢铁铸造有限公司 一种涂料槽
CN106835257B (zh) * 2017-01-19 2018-09-25 南京麦文环保设备工程有限责任公司 用于镀铜工艺的硫酸铜溶液全自动配制系统
CN106757294B (zh) * 2017-01-19 2018-09-25 南京麦文环保设备工程有限责任公司 一种用于补充镀铜槽内硫酸铜的方法
IT201700012608A1 (it) * 2017-02-06 2018-08-06 Arnaldo Morganti Componenti meccanici antifrizione perfezionati, procedimento di rivestimento e vasca dell’impianto per la loro fabbricazione
WO2018189901A1 (ja) * 2017-04-14 2018-10-18 Ykk株式会社 めっき材及びその製造方法
CN113528996B (zh) * 2021-06-30 2023-08-15 扬州澳洋顺昌金属材料有限公司 一种去除助镀液中铁盐的方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2554803A (en) * 1949-09-12 1951-05-29 Pittsburgh Plate Glass Co Apparatus for the application of finishing materials by dipping
US3496082A (en) * 1964-10-19 1970-02-17 Ransburg Electro Coating Corp Electrophoretic coating method and apparatus utilizing bath circulation to minimize impurities
US3638799A (en) * 1970-09-03 1972-02-01 Gilbert J Serowiecki Clamping unit and drain filter for washing machine drain lines
NO151230L (ko) * 1979-11-13
JPH0531566Y2 (ko) * 1985-05-27 1993-08-13
US4805553A (en) * 1986-10-27 1989-02-21 Morton Thiokol, Inc. Apparatus for bailout elimination and for enhancing plating bath stability in electrosynthesis/electrodialysis electroless copper purification process
EP0460645B1 (en) * 1990-06-06 1995-03-01 C. Uyemura & Co, Ltd Composite plating apparatus
JP3162243B2 (ja) 1994-03-28 2001-04-25 株式会社日立製作所 無電解めっき方法
JPH093694A (ja) * 1995-06-21 1997-01-07 Nec Corp めっき槽
CN2270056Y (zh) * 1996-06-14 1997-12-10 吕安 可移式电镀装置
DE29701888U1 (de) * 1997-02-04 1997-03-27 Wolters, Ralf, Dipl.-Ing., 44866 Bochum Sterilisierbare, platzsparende Laborpumpe mit Rührkern als Rotor
KR100804714B1 (ko) * 2000-03-17 2008-02-18 가부시키가이샤 에바라 세이사꾸쇼 도금장치 및 방법
KR20030013046A (ko) * 2001-08-06 2003-02-14 주식회사 미래소재 양극-음극-교반기 결합 일체형 전기도금장치
KR100752121B1 (ko) * 2001-08-17 2007-08-24 주식회사 포스코 전기도금공정의 표면처리용액 순환저장탱크

Also Published As

Publication number Publication date
TW200508421A (en) 2005-03-01
JP3930832B2 (ja) 2007-06-13
CN1572914A (zh) 2005-02-02
CN1303261C (zh) 2007-03-07
TWI249592B (en) 2006-02-21
KR20040108578A (ko) 2004-12-24
EP1484431B1 (en) 2009-01-14
DE602004019014D1 (de) 2009-03-05
EP1484431A2 (en) 2004-12-08
US20040245106A1 (en) 2004-12-09
KR101027810B1 (ko) 2011-04-07
US7361225B2 (en) 2008-04-22
EP1484431A3 (en) 2007-01-24
JP2004360032A (ja) 2004-12-24

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20140527