HK1061823A1 - Controlled attenuation capillary. - Google Patents
Controlled attenuation capillary.Info
- Publication number
- HK1061823A1 HK1061823A1 HK04104807A HK04104807A HK1061823A1 HK 1061823 A1 HK1061823 A1 HK 1061823A1 HK 04104807 A HK04104807 A HK 04104807A HK 04104807 A HK04104807 A HK 04104807A HK 1061823 A1 HK1061823 A1 HK 1061823A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- cylindrical section
- capillary
- controlled attenuation
- section
- diameter
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Wire Bonding (AREA)
- Magnetic Resonance Imaging Apparatus (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Details Of Garments (AREA)
- Control Of Combustion (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/795,270 US6523733B2 (en) | 2000-04-28 | 2001-02-28 | Controlled attenuation capillary |
PCT/US2002/006170 WO2002068145A1 (en) | 2001-02-28 | 2002-02-26 | Controlled attenuation capillary |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1061823A1 true HK1061823A1 (en) | 2004-10-08 |
Family
ID=25165149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK04104807A HK1061823A1 (en) | 2001-02-28 | 2004-07-05 | Controlled attenuation capillary. |
Country Status (12)
Country | Link |
---|---|
US (1) | US6523733B2 (ko) |
EP (1) | EP1381489B1 (ko) |
JP (1) | JP4153790B2 (ko) |
KR (1) | KR100855548B1 (ko) |
CN (1) | CN1251833C (ko) |
AT (1) | ATE271439T1 (ko) |
DE (1) | DE60200792T2 (ko) |
HK (1) | HK1061823A1 (ko) |
MY (1) | MY122922A (ko) |
PT (1) | PT1381489E (ko) |
TW (1) | TW535257B (ko) |
WO (1) | WO2002068145A1 (ko) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6497356B2 (en) * | 2000-04-28 | 2002-12-24 | Kulicke & Soffa Investments, Inc. | Controlled attenuation capillary with planar surface |
US6910612B2 (en) * | 2001-07-17 | 2005-06-28 | Kulicke & Soffa Investments, Inc. | Capillary with contained inner chamfer |
US6715658B2 (en) * | 2001-07-17 | 2004-04-06 | Kulicke & Soffa Investments, Inc. | Ultra fine pitch capillary |
EP1332827A1 (de) * | 2002-02-01 | 2003-08-06 | Esec Trading S.A. | Verfahren für die Kalibrierung eines Wire Bonders |
KR20030066348A (ko) | 2002-02-01 | 2003-08-09 | 에섹 트레이딩 에스에이 | 와이어본더의 보정을 위한 방법 |
US20040211814A1 (en) * | 2003-04-23 | 2004-10-28 | Jackson Hsieh | Wire bonding capillary for an image sensor |
US7261230B2 (en) * | 2003-08-29 | 2007-08-28 | Freescale Semiconductor, Inc. | Wirebonding insulated wire and capillary therefor |
US7249702B2 (en) * | 2003-12-04 | 2007-07-31 | Kulicke And Soffa Industries, Inc. | Multi-part capillary |
US7320425B2 (en) * | 2004-05-12 | 2008-01-22 | Kulicke And Soffa Industries, Inc. | Low-profile capillary for wire bonding |
KR100718889B1 (ko) * | 2005-11-28 | 2007-05-16 | 이정구 | 투스텝 하이 보틀넥을 갖는 와이어 본딩 캐필러리 |
SG133508A1 (en) * | 2005-12-06 | 2007-07-30 | Asm Tech Singapore Pte Ltd | Capillary for a bonding tool |
US7597231B2 (en) * | 2006-04-10 | 2009-10-06 | Small Precision Tools Inc. | Wire bonding capillary tool having multiple outer steps |
JP2014007430A (ja) * | 2009-09-30 | 2014-01-16 | Toto Ltd | ボンディングキャピラリー |
JP2012039032A (ja) * | 2010-08-11 | 2012-02-23 | Fujitsu Ltd | ワイヤボンディング装置用キャピラリ及び超音波トランスデューサ |
KR101295948B1 (ko) | 2011-11-30 | 2013-08-13 | 김선희 | 초음파 용착기의 공구혼 |
US20130213552A1 (en) * | 2012-02-20 | 2013-08-22 | Branson Ultrasonics Corporation | Vibratory welder having low thermal conductivity tool |
US10679962B2 (en) * | 2016-02-09 | 2020-06-09 | Texas Instruments Incorporated | Capillary jig for wire bonding and method of installing a capillary |
CN111834350B (zh) * | 2019-04-18 | 2023-04-25 | 无锡华润安盛科技有限公司 | Ipm的封装方法以及ipm封装中的键合方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3894671A (en) | 1971-01-06 | 1975-07-15 | Kulicke & Soffa Ind Inc | Semiconductor wire bonder |
US3917148A (en) | 1973-10-19 | 1975-11-04 | Technical Devices Inc | Welding tip |
US4315128A (en) | 1978-04-07 | 1982-02-09 | Kulicke And Soffa Industries Inc. | Electrically heated bonding tool for the manufacture of semiconductor devices |
US4513190A (en) | 1983-01-03 | 1985-04-23 | Small Precision Tools, Inc. | Protection of semiconductor wire bonding capillary from spark erosion |
JP2527399B2 (ja) | 1992-09-29 | 1996-08-21 | 完テクノソニックス株式会社 | ワイヤ―・ボンダ―・システム |
US5558270A (en) | 1995-01-06 | 1996-09-24 | Kulicke And Soffa Investments, Inc | Fine pitch capillary/wedge bonding tool |
US5890643A (en) | 1996-11-15 | 1999-04-06 | Kulicke And Soffa Investments, Inc. | Low mass ultrasonic bonding tool |
US6006977A (en) | 1996-12-19 | 1999-12-28 | Texas Instruments Incorporated | Wire bonding capillary alignment display system |
US6112972A (en) | 1996-12-19 | 2000-09-05 | Texas Instruments Incorporated | Wire bonding with capillary realignment |
KR19980064247A (ko) | 1996-12-19 | 1998-10-07 | 윌리엄비.켐플러 | 와이어 본딩 캐필러리의 연속 자동 회전 |
US6073827A (en) | 1998-08-27 | 2000-06-13 | Kulicke & Soffa Investments, Inc. | Wire bonding capillary with a conical surface |
US6321969B1 (en) * | 2000-04-28 | 2001-11-27 | Kulicke & Soffa Investments | Efficient energy transfer capillary |
-
2001
- 2001-02-28 US US09/795,270 patent/US6523733B2/en not_active Expired - Lifetime
-
2002
- 2002-01-16 MY MYPI20020162A patent/MY122922A/en unknown
- 2002-01-21 TW TW091100886A patent/TW535257B/zh not_active IP Right Cessation
- 2002-02-26 EP EP02794704A patent/EP1381489B1/en not_active Expired - Lifetime
- 2002-02-26 CN CNB028056531A patent/CN1251833C/zh not_active Expired - Lifetime
- 2002-02-26 JP JP2002567492A patent/JP4153790B2/ja not_active Expired - Lifetime
- 2002-02-26 AT AT02794704T patent/ATE271439T1/de not_active IP Right Cessation
- 2002-02-26 PT PT02794704T patent/PT1381489E/pt unknown
- 2002-02-26 KR KR1020037011209A patent/KR100855548B1/ko active IP Right Grant
- 2002-02-26 DE DE60200792T patent/DE60200792T2/de not_active Expired - Fee Related
- 2002-02-26 WO PCT/US2002/006170 patent/WO2002068145A1/en active IP Right Grant
-
2004
- 2004-07-05 HK HK04104807A patent/HK1061823A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2002068145A8 (en) | 2003-01-09 |
EP1381489A1 (en) | 2004-01-21 |
EP1381489B1 (en) | 2004-07-21 |
KR20030082611A (ko) | 2003-10-22 |
CN1251833C (zh) | 2006-04-19 |
TW535257B (en) | 2003-06-01 |
DE60200792T2 (de) | 2005-08-11 |
PT1381489E (pt) | 2004-11-30 |
DE60200792D1 (de) | 2004-08-26 |
JP4153790B2 (ja) | 2008-09-24 |
MY122922A (en) | 2006-05-31 |
KR100855548B1 (ko) | 2008-09-01 |
US20010045443A1 (en) | 2001-11-29 |
CN1494470A (zh) | 2004-05-05 |
ATE271439T1 (de) | 2004-08-15 |
JP2004525511A (ja) | 2004-08-19 |
US6523733B2 (en) | 2003-02-25 |
WO2002068145A1 (en) | 2002-09-06 |
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Effective date: 20090226 |