HK1056752A1 - Device and method for electrically contacting withthe product to be electrolytic treated. - Google Patents

Device and method for electrically contacting withthe product to be electrolytic treated.

Info

Publication number
HK1056752A1
HK1056752A1 HK03109099A HK03109099A HK1056752A1 HK 1056752 A1 HK1056752 A1 HK 1056752A1 HK 03109099 A HK03109099 A HK 03109099A HK 03109099 A HK03109099 A HK 03109099A HK 1056752 A1 HK1056752 A1 HK 1056752A1
Authority
HK
Hong Kong
Prior art keywords
contact
electrically contacting
electrolytic treated
contacting withthe
product
Prior art date
Application number
HK03109099A
Other languages
English (en)
Inventor
Egon Hubel
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1056752A1 publication Critical patent/HK1056752A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Push-Button Switches (AREA)
  • Thermistors And Varistors (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
HK03109099A 2000-04-20 2003-12-13 Device and method for electrically contacting withthe product to be electrolytic treated. HK1056752A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10019720A DE10019720A1 (de) 2000-04-20 2000-04-20 Verfahren und Vorrichtung zum elektrischen Kontaktieren von plattenförmigem Behandlungsgut bei elektrolytischen Prozessen
PCT/DE2001/001355 WO2001081659A1 (fr) 2000-04-20 2001-03-30 Element de connexion par contact electrique a base de materiau elastique

Publications (1)

Publication Number Publication Date
HK1056752A1 true HK1056752A1 (en) 2004-02-27

Family

ID=7639534

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03109099A HK1056752A1 (en) 2000-04-20 2003-12-13 Device and method for electrically contacting withthe product to be electrolytic treated.

Country Status (9)

Country Link
US (1) US6926813B2 (fr)
EP (1) EP1274885B1 (fr)
JP (1) JP4871480B2 (fr)
CN (1) CN1190524C (fr)
AT (1) ATE280250T1 (fr)
CA (1) CA2405573A1 (fr)
DE (2) DE10019720A1 (fr)
HK (1) HK1056752A1 (fr)
WO (1) WO2001081659A1 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10340888B3 (de) * 2003-09-04 2005-04-21 Atotech Deutschland Gmbh Stromversorgungseinrichtung in einer Vorrichtung zur elektrochemischen Behandlung
DE102007038116A1 (de) * 2007-07-30 2009-02-05 Gebr. Schmid Gmbh & Co. Haltemittel, Vorrichtung und Verfahren zum Transport von Substraten, insbesondere Leiterplatten
WO2010095415A1 (fr) * 2009-02-17 2010-08-26 シャープ株式会社 Procédé de fabrication d'un moule et structure d'électrode utilisée pour celui-ci
JP4617402B2 (ja) * 2009-03-05 2011-01-26 シャープ株式会社 型の製造方法およびそれに用いられる電極構造
DE102009018393B4 (de) * 2009-04-22 2017-05-24 Atotech Deutschland Gmbh Verfahren, Haltemittel, Vorrichtung und System zum Transportieren eines flächigen Behandlungsgutes und Be- oder Entladeeinrichtung
CN101570876B (zh) * 2009-06-08 2011-11-30 深圳市常兴金刚石磨具有限公司 用于钻头电镀的电镀设备、电镀方法
EP2473654B1 (fr) * 2009-09-01 2013-10-30 Imec Procédé de traitement électrochimique d'échantillons non plats
WO2011135976A1 (fr) * 2010-04-28 2011-11-03 シャープ株式会社 Moule et procédé de production de moule
NL2005480C2 (nl) * 2010-10-07 2012-04-11 Meco Equip Eng Inrichting voor het eenzijdig elektrolytisch behandelen van een vlak substraat.
US8535501B2 (en) * 2011-01-28 2013-09-17 Ppg Industries Ohio, Inc. Electrical contact arrangement for a coating process
DE102011050131B3 (de) * 2011-05-05 2012-08-16 Lpkf Laser & Electronics Ag Verfahren zur Herstellung von Metallisierungen auf Kunststoffteilen
DE102012206800B3 (de) * 2012-04-25 2013-09-05 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Abscheiden eines Abscheidemetalls auf einem Werkstück
JP3176980U (ja) * 2012-04-28 2012-07-12 丸仲工業株式会社 水平搬送メッキ処理装置における薄板状被処理物のクランプ治具
DE102012019389B4 (de) * 2012-10-02 2018-03-29 Atotech Deutschland Gmbh Haltevorrichtung für eine Ware und Behandlungsverfahren
CN104805490A (zh) * 2015-04-29 2015-07-29 广汽吉奥汽车有限公司 一种电镀单体零件、端部电镀结构及电镀方法
TWI573899B (zh) * 2016-07-19 2017-03-11 蔡涵雲 線桿壓持式電鍍用掛架
TWI706058B (zh) * 2019-04-03 2020-10-01 聯策科技股份有限公司 加壓式水封導電夾
TWI723640B (zh) * 2019-11-21 2021-04-01 聯策科技股份有限公司 水封導電夾

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE71920C (de) O. FISCHER in Göppersdorf i. S Schmutzfänger in Flottenzuleitungsrohren von Schleudermaschinen zum Färben, Waschen, Bleichen u. s. w
US1773042A (en) * 1929-06-13 1930-08-12 William S Jones Mold or plate hanger
US3525681A (en) * 1967-04-21 1970-08-25 Rapid Electroplating Process I Electrolytic device
US3649954A (en) * 1970-06-26 1972-03-14 John O Kurtz Clamp-type electrical terminals
GB1512959A (en) * 1974-10-16 1978-06-01 Lucas Electrical Ltd Electro-plating jigs
JPS5191832A (en) * 1975-10-06 1976-08-12 Jushiseikeihinno metsukishorisochi
US4100054A (en) * 1977-03-11 1978-07-11 Essex Group, Inc. Combination insulating sleeve and electrical contact member for electro-plating rack
US4158612A (en) * 1977-12-27 1979-06-19 The International Nickel Company, Inc. Polymeric mandrel for electroforming and method of electroforming
US4155815A (en) * 1978-04-03 1979-05-22 Francis William L Method of continuous electroplating and continuous electroplating machine for printed circuit board terminals
JPS5634373A (en) * 1979-08-29 1981-04-06 Daiichi Shokai Kk Video game machine
IT1140510B (it) * 1980-01-16 1986-10-01 Oronzio De Nora Impianti Elettrolizzatore bipolare e procedimento di elettrolisi di elettrolisi di alogenuri
JPS6024199B2 (ja) * 1980-10-31 1985-06-11 信越ポリマ−株式会社 めつき用通電体
JPS57101698A (en) * 1980-12-12 1982-06-24 Shin Etsu Polymer Co Ltd Electrifying member for electroplating
JPS5864091A (ja) * 1981-10-14 1983-04-16 富士プラント工業株式会社 プリント配線基板へのメツキ方法および装置
DE3612220A1 (de) 1986-04-11 1987-10-15 Schering Ag Haltezange
US4755271A (en) 1986-07-28 1988-07-05 Siemens Aktiengesellschaft Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
FR2617869B1 (fr) * 1987-07-07 1989-12-15 Laminage Continu Ste Rouleau conducteur rotatif pour le depot electrolytique en continu sur des feuillards metalliques ou autres feuillards electroconducteurs
SU1650790A1 (ru) * 1988-05-27 1991-05-23 Всесоюзный Научно-Исследовательский Институт Электромашиностроения Устройство дл закреплени деталей, преимущественно, в гальванической ванне
JPH089774B2 (ja) * 1990-06-25 1996-01-31 三菱電機株式会社 薄膜形成装置
JPH083158B2 (ja) * 1990-07-09 1996-01-17 ワイケイケイ株式会社 スライドファスナーチェーンの務歯に表面処理を施すための給電ドラム
US5324565A (en) * 1992-12-17 1994-06-28 United Technologies Corporation Conductive elastomeric compression pad for use in electrolysis cells
FI953971A0 (fi) * 1995-08-24 1995-08-24 Galvatek Oy Ab Apparatur foer faestande av en kropp pao sin plats foer elektrolytisk behandling
JP3669797B2 (ja) * 1996-12-10 2005-07-13 株式会社フジクラ エレクトロケミカルエッチング用ウエハジグ
JPH11200096A (ja) * 1997-11-06 1999-07-27 Ebara Corp ウエハのメッキ用治具
BR9913118B1 (pt) * 1998-08-19 2011-02-08 equipamento para tratamento eletroquìmico para material de placas de circuito impresso e processo para a alimentação de corrente para material de placa de circuito impresso.
DE10019713C2 (de) * 2000-04-20 2003-11-13 Atotech Deutschland Gmbh Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen
US6627052B2 (en) * 2000-12-12 2003-09-30 International Business Machines Corporation Electroplating apparatus with vertical electrical contact

Also Published As

Publication number Publication date
CN1190524C (zh) 2005-02-23
DE50104217D1 (de) 2004-11-25
ATE280250T1 (de) 2004-11-15
US6926813B2 (en) 2005-08-09
WO2001081659A1 (fr) 2001-11-01
DE10019720A1 (de) 2001-10-31
JP2003533590A (ja) 2003-11-11
EP1274885B1 (fr) 2004-10-20
CN1427902A (zh) 2003-07-02
EP1274885A1 (fr) 2003-01-15
JP4871480B2 (ja) 2012-02-08
CA2405573A1 (fr) 2001-11-01
US20030121790A1 (en) 2003-07-03

Similar Documents

Publication Publication Date Title
HK1056752A1 (en) Device and method for electrically contacting withthe product to be electrolytic treated.
TW200510577A (en) Device and method for electrolytically treating electrically insulated structures
BR0211270B1 (pt) dispositivo para tratamento eletrolìtico de peças e método de tratamento eletrolìtico de peças.
MXPA06000291A (es) Metodos para el tratamiento de poros en la piel con electricidad.
WO1999010568A3 (fr) Dispositif et procede pour egaliser l'epaisseur de couches metalliques au niveau des points de mise en contact electriques sur un produit a traiter
MXPA02000926A (es) Dispositivo electroluminiscente y su metodo de elaboracion.
ATE193337T1 (de) Elektrolytisches verfahren zur reinigung von elektrisch leitenden oberflächen
MY146651A (en) Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as dielectric substrate
DE60230796D1 (de) Vorrichtung für die kontrollierte abgabe eines wirkstoffes in die haut
DK1387901T3 (da) Fremgangsmåde og apparat il behandlinger af tekstilmaterialer
TW200420751A (en) Device and method for electrolytically treating an at least superficially electrically conducting work piece
ATE178664T1 (de) Galvanisiervorrichtung
DE50008866D1 (de) Verfahren und vorrichtung zum elektrolytischen behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen strukturen auf oberflächen von elektrisch isolierendem folienmaterial sowie anwendungen des verfahrens
PL355633A1 (en) Method for modifying wooden surfaces by electrical discharges at atmospheric pressure
SG52581A1 (en) Method and apparatus for electrolytically metallising or etching material
ATE249748T1 (de) Humane krustentiere verarbeitung
YU63800A (sh) Uređaj i postupak za obradu kontinualnog električno provodljivog materijala
ATE259004T1 (de) Verfahren und vorrichtung zum elektrolytischen behandeln von elektrisch leitfähigen oberflächen von gegeneinander vereinzelten platten- und folienmaterialstücken sowie anwendungen des verfahrens
HK1102970A1 (en) Device and method for electrolytically treating flat work pieces
ATE299537T1 (de) Elektrochemische behandlungsanlage und verfahren zur zuführung von strom zu elektrolytisch behandelndem leiterplattenmaterial
ES2136293T3 (es) Tratamiento electrolitico de materiales.
DE69811836D1 (de) Elektroplattierungsanlage, Verwendung von Elektrode und Gegenhalter dafür und Elektroplattierungsverfahren
UA4669U (uk) Пристрій для відновлення ушкоджених провідних шляхів нервової системи за о.о.нахабою

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150330