HK1053525A1 - Electronic label. - Google Patents

Electronic label.

Info

Publication number
HK1053525A1
HK1053525A1 HK03105698A HK03105698A HK1053525A1 HK 1053525 A1 HK1053525 A1 HK 1053525A1 HK 03105698 A HK03105698 A HK 03105698A HK 03105698 A HK03105698 A HK 03105698A HK 1053525 A1 HK1053525 A1 HK 1053525A1
Authority
HK
Hong Kong
Prior art keywords
rigid
resin
chip
zone
electronic label
Prior art date
Application number
HK03105698A
Other languages
English (en)
Inventor
Francois Droz
Original Assignee
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagraid Sa filed Critical Nagraid Sa
Publication of HK1053525A1 publication Critical patent/HK1053525A1/xx

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/07762—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement making the record carrier wearable, e.g. having the form of a ring, watch, glove or bracelet
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Burglar Alarm Systems (AREA)
  • Support Of Aerials (AREA)
HK03105698A 1999-12-23 2003-08-08 Electronic label. HK1053525A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH236199 1999-12-23
CH1672000 2000-01-28
CH2162000 2000-02-03
PCT/IB2000/001952 WO2001048687A1 (fr) 1999-12-23 2000-12-22 Etiquette electronique

Publications (1)

Publication Number Publication Date
HK1053525A1 true HK1053525A1 (en) 2003-10-24

Family

ID=27173655

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03105698A HK1053525A1 (en) 1999-12-23 2003-08-08 Electronic label.

Country Status (20)

Country Link
US (1) US6971581B2 (cs)
EP (1) EP1240619B1 (cs)
JP (1) JP4687940B2 (cs)
KR (1) KR100731852B1 (cs)
CN (1) CN1178162C (cs)
AT (1) ATE260493T1 (cs)
AU (1) AU771053B2 (cs)
BR (1) BRPI0016714B1 (cs)
CA (1) CA2395316C (cs)
CZ (1) CZ301189B6 (cs)
DE (1) DE60008591T2 (cs)
ES (1) ES2215763T3 (cs)
HK (1) HK1053525A1 (cs)
HU (1) HU229540B1 (cs)
IL (1) IL150140A0 (cs)
MA (1) MA25512A1 (cs)
MX (1) MXPA02006235A (cs)
NO (1) NO334608B1 (cs)
PL (1) PL203214B1 (cs)
WO (1) WO2001048687A1 (cs)

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NL1021207C2 (nl) * 2002-08-05 2004-02-06 Stormpolder Onroerende Zaken B Kledingstuk of kledingaccessoire.
JP4109039B2 (ja) * 2002-08-28 2008-06-25 株式会社ルネサステクノロジ 電子タグ用インレットおよびその製造方法
WO2005018366A1 (ja) * 2003-08-22 2005-03-03 Ykk Corporation ファスナー及び同ファスナーを被着した被着体
EP1710733A4 (en) * 2004-01-29 2008-12-17 Ykk Corp ARTICLE EQUIPPED WITH A MEANS OF IDENTIFICATION, DECISION DI CHOTOMIC ABOUT SUCH AN ARTICLE, AND METHOD OF CONTROLLING THE DISTRIBUTION OF GOODS
JP4567988B2 (ja) * 2004-02-05 2010-10-27 株式会社日立製作所 紙状ｒｆｉｄタグおよびその製造方法
CN1938717B (zh) * 2004-07-08 2010-12-08 Ykk株式会社 带无线ic标签的系固制品
JP2006301896A (ja) * 2005-04-20 2006-11-02 Toppan Forms Co Ltd 非接触型データ受送信体
EP1801739A4 (en) 2004-10-13 2009-07-15 Toppan Forms Co Ltd CONTACTLESS INTEGRATED CIRCUIT LABEL AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME
EP1826710A4 (en) 2004-12-20 2009-06-17 Toppan Forms Co Ltd CONTACTLESS DATA RECEIVER / TRANSMITTER
US7607249B2 (en) * 2005-07-15 2009-10-27 Innovatier Inc. RFID bracelet and method for manufacturing a RFID bracelet
US7535356B2 (en) * 2005-11-29 2009-05-19 Bartronics America, Inc. Identification band using a conductive fastening for enhanced security and functionality
GB0610015D0 (en) * 2006-05-19 2006-06-28 Schwertner Michael Data storage device
JP2008046668A (ja) * 2006-08-10 2008-02-28 Fujitsu Ltd Ｒｆｉｄタグ
WO2008082617A2 (en) 2006-12-29 2008-07-10 Solicore, Inc. Mailing apparatus for powered cards
WO2008082616A1 (en) 2006-12-29 2008-07-10 Solicore, Inc. Card configured to receive separate battery
NL2001279C2 (nl) * 2008-02-12 2009-08-13 Championchip B V Draagbaar samenstel ingericht voor ten minste één van tijdmeting, snelheidsbepaling en positiebepaling van een respectieve gebruiker.
JP2013228916A (ja) * 2012-04-26 2013-11-07 Toska Banok Co Ltd ファスナー部材及びそのファスナー部材の装着器具
CN103943957B (zh) * 2014-04-10 2016-05-04 信维创科通信技术（北京）有限公司 一种智能手表及其带扣天线
CN106295771B (zh) * 2015-06-02 2023-12-19 上海交通大学 用于书画管理的电子标签
CH711847A2 (fr) 2015-11-25 2017-05-31 Oréade Mft De Boîtes Sa Boucle déployante.
CN106023323B (zh) * 2016-05-16 2018-05-01 江阴四方游泳康复产业股份有限公司 用于游泳馆的智能手环的管理系统
US10519697B1 (en) 2018-09-12 2019-12-31 Ebay Inc. Tamper proof tag for watches

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DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
US4754285A (en) * 1987-05-01 1988-06-28 Timex Corporation Expansion band antenna for a wristwatch application
ATE136674T1 (de) * 1991-12-19 1996-04-15 Ake Gustafson Sicherheitsverschliessvorrichtung
FR2689663A1 (fr) 1993-05-18 1993-10-08 Alcatel Business Systems Equipement portatif individuel pour système de localisation de personnes et/ou d'objets dans une zone surveillée.
US5519201A (en) * 1994-04-29 1996-05-21 Us3, Inc. Electrical interconnection for structure including electronic and/or electromagnetic devices
DE19528730A1 (de) * 1995-08-04 1997-02-06 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers
EP0788069A3 (de) * 1996-02-01 2000-01-19 Kaba Schliesssysteme AG Mitführbarer Identifikationsträger
DE19654902C2 (de) * 1996-03-15 2000-02-03 David Finn Chipkarte
DE19613491B4 (de) * 1996-04-04 2005-07-21 Junghans Uhren Gmbh Transponder-Armbanduhr
US6027027A (en) * 1996-05-31 2000-02-22 Lucent Technologies Inc. Luggage tag assembly
JPH1079007A (ja) * 1996-09-03 1998-03-24 U S Ii:Kk データキャリア
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JPH10181262A (ja) * 1996-12-24 1998-07-07 Dainippon Printing Co Ltd 非接触ｉｃカード及び非接触ｉｃカードの製造方法
JPH10208003A (ja) * 1997-01-22 1998-08-07 Sony Corp カセットラベル、および、ビデオカセットテープ
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Also Published As

Publication number Publication date
MA25512A1 (fr) 2002-07-01
US20020190131A1 (en) 2002-12-19
IL150140A0 (en) 2002-12-01
CN1413337A (zh) 2003-04-23
PL203214B1 (pl) 2009-09-30
JP4687940B2 (ja) 2011-05-25
CZ20022084A3 (cs) 2002-11-13
NO20022928D0 (no) 2002-06-18
JP2003519424A (ja) 2003-06-17
EP1240619A1 (fr) 2002-09-18
CZ301189B6 (cs) 2009-12-02
ATE260493T1 (de) 2004-03-15
PL363107A1 (en) 2004-11-15
DE60008591T2 (de) 2004-12-16
BRPI0016714B1 (pt) 2016-11-01
HU229540B1 (hu) 2014-01-28
EP1240619B1 (fr) 2004-02-25
CA2395316C (en) 2010-04-27
NO20022928L (no) 2002-06-18
US6971581B2 (en) 2005-12-06
AU771053B2 (en) 2004-03-11
KR20020063915A (ko) 2002-08-05
ES2215763T3 (es) 2004-10-16
WO2001048687A1 (fr) 2001-07-05
CA2395316A1 (en) 2001-07-05
CN1178162C (zh) 2004-12-01
NO334608B1 (no) 2014-04-22
BR0016714A (pt) 2002-09-03
AU1879201A (en) 2001-07-09
HUP0203879A2 (en) 2003-03-28
MXPA02006235A (es) 2002-12-05
KR100731852B1 (ko) 2007-06-25
DE60008591D1 (de) 2004-04-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20191225