CN1413337A - 电子标签 - Google Patents

电子标签 Download PDF

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CN1413337A
CN1413337A CN00817570A CN00817570A CN1413337A CN 1413337 A CN1413337 A CN 1413337A CN 00817570 A CN00817570 A CN 00817570A CN 00817570 A CN00817570 A CN 00817570A CN 1413337 A CN1413337 A CN 1413337A
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chip
electronic tag
antenna
lead
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CN1178162C (zh
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弗朗西斯·德罗兹
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Nagravision SARL
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    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
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    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • HELECTRICITY
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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Abstract

电子标签由柔性支承物(2)上的电子芯片(4)和天线组成。为了避免受到损坏,电子芯片(4)需要刚性区域。因此通常利用增强所述刚性区的树脂覆盖电子芯片。为了减小所述刚性区域,除去覆盖芯片的树脂,并用由直接安装在柔性支承物(2)上的刚性部件提供的保护物(5)替代所述树脂。

Description

电子标签
本发明涉及电子标签,尤其涉及柔性电子标签。
就电子标签来说,我们知道包括至少一个柔性支承物、天线和电子芯片的组件。根据需要,该组件可包括几个天线或几个芯片。电子标签呈按键、智能卡甚至行李标签的形式。通过天线它们可与远距离的阅读器通信。天线不仅用作通信装置,而且还可用于产生电子芯片所必需的能量。
根据实施例,天线被附加在柔性支承物上或者直接刻在或嵌在柔性支承物上。
存在功能各不相同的多种芯片,例如其中一些只允许阅读信息,而另一些允许它们存储器的记忆和修改。后者其中一种用途是用于电子钱包,由于用户的消费,电子钱包不得不变小。
本发明的目的是柔性电子标签。我们发现它们在展览票券或者证章的箍套(bracelet)中,甚至嵌入衣服的材料中。它们可被加入诸如一件衣服之类的物体内或者采取该物体(例如用作箍套的柔性支承物)的形式。
如果以细铜线组件的形式制造的天线易于弯曲和扭曲,则为了植入电子芯片,电子芯片本身需要一个刚性区。事实上,硅芯片易碎,这就是把硅芯片嵌入保护其免受机械损伤和化学侵蚀(腐蚀)的树脂中的原因。该树脂还保护芯片和天线之间的触点。
为了不损坏芯片或其触点,芯片区是不能折叠的区域。由于芯片的嵌入,该区域的直径约为5-7毫米。芯片的嵌入是一个额外的制造操作,并且使这种标签的成本变得更高。
本发明的目的是一方面减小柔性支承物上的刚性区,同时确保芯片的保护。
该目的由包括至少一个柔性支承物、一个天线和一个电子芯片的柔性电子标签实现,所述芯片装配在柔性支承物上并且与天线相连。该标签的特征在于芯片的保护由附着在支承物上的刚性部件保证。
这样,不再是芯片的嵌入确保其刚性,而是放置在芯片上方或者放置在芯片下面的刚性部件确保其刚性。该部件可用作装饰性部件。
例如,刚性部件可以是装配在柔性支承物上的刚性部件,例如固定件或者扣件的扩展。这样,箍套的扣件可延伸到覆盖装配在箍套的柔性部分上的芯片。这适用于所有类型的扣件,无论它是具有舌状物的表带还是专用于医院患者的扣件。总是存在可用作芯片保护物的刚性部件。
在缺少扣件的情况下,刚性部件也可采取刚性圆盖的形式,所述刚性圆盖是独立的,在柔性支承物的任意一面上覆盖芯片所处的位置,并且具有穿过柔性支承物从而为此接合平板的底脚。
根据另一实施例,刚性圆盖放置在电子芯片之下。
可想象其它形式或者方式的装配,例如胶合、焊接或者底脚的热变形。
在某些应用中,感兴趣的是稍后再装配芯片,甚至根据需要改变芯片。为此,本发明被同样应用于包括电子芯片的刚性部件,电子芯片通过为此预设的触点盘与天线相连。
参考作为非限制性例子给出的附图,根据下述详细说明,将更好地理解本发明,其中:
图1表示包括根据本发明的电子标签的具有扣件的箍套,所述扣件具有一个舌状物;
图2表示包括电子标签和附加的刚性部件的柔性箍套;
图3表示图2的柔性箍套的横截面图;
图4表示其上可连接电子芯片的电子标签的天线;
图5表示与装配在柔性支承物上的天线接触的电子芯片的组件。
在图1中,我们可以虚线区分包括在柔性箍套2中的天线3。天线通常实现于两层织物之间,从而对其进行机械保护。电子芯片4沿着天线3布置,并且一般通过两条金线与天线3相连。扣件(fastener)1是刚性的,并且在本例中具有覆盖放置芯片4的位置的突出物1a。
其它形式的扣件可例如和芯片一起使用,其一部分将被延伸到刚好放置在电子芯片上面。
当使用低成本箍套时,该箍套可以只有一层;天线和电子芯片贴在根据本发明的箍套内侧,一部分扣件覆盖电子芯片。
图2表示了我们不希望使用扣件1的一部分保护芯片的实现。这种这情况下我们使用附在芯片上面的部件5。这里呈圆盖形式的部件5贴在柔性支承物2上。通过胶合或热胶合,或者通过接合,可以几种方式保持部件5。该圆盖可用作广告支承物,例如具有公司的徽标的形式。
这种装配电子标签的方式应用于每种柔性支承物,并不局限于箍套。我们可把这样的组件加入机票或者戏票中,加入一件衣服内,加入赛跑者后背上的号码中。
图3表示这种刚性部件的一种实现例子的横截面图。我们可辨别具有两个底脚5a和5b的圆盖5的顶部,所述两个底脚5a和5b穿过柔性支承物2接合到平板6中。柔性支承物2由顶层2a和底层2b组成。天线3放置在这两层之间并且与电子芯片4相连。在一种没有示出的实现形式中,顶层覆盖电子芯片。在图3中所示的另一实施例中,顶层具有使电子芯片穿过的小孔。后一种结构可减小厚度。
根据另一种实施例,圆盖5具有用于利用诸如环氧树脂或者硅树脂之类的填充材料填充芯片4上的空间的小孔5c和5d。这可防止芯片4受到由于潮湿、汽化或者腐蚀性清洗剂引起的腐蚀。树脂通过第一个小孔5c被注入,并且当圆盖5下面的空间被填充时,多余的树脂通过小孔5d再次流出。
根据这种实现的一个实施例,在把圆盖5放置就位之间预先用一滴树脂填充圆盖5。多余的树脂通过预留的一个小孔流出。
图4表示包括天线3但是不具有电子芯片4的柔性支承物2的一种实现。柔性支承物2显现两个区域7a和7b,在这两个区域中可接近天线的两个导电端。根据需要,这两个区域被涂覆导电材料(金、铝、铜或碳)。为了方便该组件,在凹槽的两侧配置用于该组件的两个小孔2c和2d。
图5中图解说明了该实现的组件。刚性部件5包括电子芯片4。从而,正是通过放置保护物的动作,芯片将与天线接触,从而标签能够工作。为此,根据一个实施例,刚性部件5包含其上放置电子芯片的基体9。同样在该基体上,有放置在两个凹槽7a和7b前方与天线3连接的两条导线8a和8b。例如可通过沉积碳实现这些导线。底脚5a和5b穿过柔性支承物的刚性部件5的组件的优点在于同时确保天线和芯片之间触点的定位。
为了改善芯片和天线之间的稳定性和导电性,可对触点涂覆导电胶用作导电粘结剂。
芯片的其它形式的实现不需要存在基体9。称为“正面向下”的包括用于连接的凸纹(relief)的电子芯片已为人们所知。由于这些凸纹,芯片可直接贴在柔性支承物上,从而与天线相连。根据另一实施例,在芯片上涂覆一层确保芯片和天线之间传导的导电膜。在这种实现中通过热处理画出导电区的轮廓。
根据这种实现的一个实施例,刚性部件5包括诸如电池、振动器、LED或者用于标签各种应用的传感器之类的附件。
专用箍套被用于例如控制进入展览会或识别医院患者。这些专用箍套被设想成只能通过损坏箍套才能打开这样的箍套。鉴于此,可利用和目视验证相同的资格(title)同样地中断电子标签完成的验证是重要的。
根据一个实施例,其一部分覆盖电子芯片的扣件被布置成在试图打开箍套的情况下会损坏芯片或者天线。几个实施例可用于此目的。
根据第一实施例,覆盖芯片的扣件部分被胶粘到芯片上。这样,在强制打开扣件的情况下,电子芯片被撕离其柔性支承物,并且不与天线接触,因此电子芯片不能再工作。把芯片保持在柔性支承物上的粘胶的胶合力小于把芯片粘在扣件上的粘胶的胶合力。
根据第二实施例,保护芯片的扣件部分具有穿过柔性箍套的两个插销。使柔性箍套的小孔更接近,并且天线的至少一个导线通过它们之间。这两个插销在其端部被加宽,以防止它们重新脱出。通过借助接合而添加的部分或者通过插销的变形,例如通过加热而获得的部分可确保这种功能。
在试图强制打开插销的情况下,不撕裂两个插销小孔之间的通路插销就不能从小孔中脱出,而撕裂两个小孔之间的通路最后将导致天线中断,因此标签不能再工作。
虽然这种安全措施也适合于针对扣件的侵犯,但是对于骗子来说总是存在切断箍套从而将其转送给第三人的可能性,由于标签的电子功能,第三人从而能够识别他/她自己。
为了防止这种花招,根据本发明的一个特定实施例,我们建议沿着电子标签的全长至少展示(display)一圈天线。这样不可能在不中断天线,从而不中断电子模块的功能的情况下切断这种箍套。
不必沿着箍套的长度方向展示所有天线;一圈天线从扣件的其中一个部分转到扣件的另一部分,同时不留下使箍套中断的通路就足够了。
根据这种实现的一个实施例,电子芯片具有两个接线,两个接线之间必须强制连接以便允许芯片的功能。这两个接线被连接到一个导体上,所述导体沿着电子标签的长度方向延伸,并且保证电子标签的任何切割都会不可避免地中断该导体,从而终止芯片的工作。
导线的这种相同功能可用于自动使标签不能工作。我们可想像其一部分被刻划(score),但是让导线通过的机票。在机票的确认过程中,工作人员剪下位于为此预留位置的附单,中断导线。这种操作使电子模块不能工作。
通过刻划或者通过使标签的某一区域变薄,可获得用于分割的部分。事实上,为了便于这种切割,可减小柔性支承物的厚度。

Claims (18)

1、一种柔性电子标签,包括至少一个柔性支承物(2)、一个天线(3)和一个电子芯片(4),所述芯片(4)与天线(3)相连,其特征在于芯片(4)的保护由附着在支承物至少一面上的刚性部件(1、5)保证。
2、按照权利要求1所述的电子标签,其特征在于附加的部件(1)是用作标签的封闭部件或固定件的部件的一部分(1a)。
3、按照权利要求1所述的电子标签,其特征在于附加的部件(1)是专用的独立部件(5)。
4、按照权利要求3所述的电子标签,其特征在于通过胶合、焊接或者通过接合,把独立的部件(5)装配到柔性支承物(2)上。
5、按照权利要求3和4所述的电子标签,其特征在于利用覆盖芯片(4)的物质填充独立部件(5)。
6、按照权利要求1-5所述的电子标签,其特征在于它包括沿其全长展示的至少一条导线,所述导线的中断会停止所述标签的工作。
7、按照权利要求6所述的电子标签,其特征在于该导线是天线(3)的一部分。
8、按照权利要求6所述的电子标签,其特征在于该导线的两端与电子芯片(4)连接。
9、按照权利要求6-8所述的电子标签,其特征在于该导线穿过坚固性降低的分隔区。
10、按照权利要求1-9所述的电子标签,其特征在于刚性部件(1)具有在把刚性部件(1)和柔性支承物(2)分开的过程中破坏芯片(4)和/或天线(3)的装置。
11、按照权利要求10所述的电子标签,其特征在于这些装置包含布置在芯片(4)和刚性部件(1)之间的粘胶,该粘胶的胶合力大于放置在芯片(4)和柔性支承物(2)之间的粘结剂的胶合力。
12、按照权利要求10所述的电子标签,其特征在于柔性支承物(2)至少具有两个小孔,天线(3)的至少一个导线在这两个小孔之间穿过,并且所述这些装置包括与刚性部件(1)相连、并且穿过所述小孔的至少两个插销,通过附加一个部件或者通过变形,所述插销在其端部被加宽。
13、装配在柔性支承物(2)上,包括至少一个天线(3)和一个电子芯片(4)的电子标签,其特征在于天线包括与其电极电接触的两个区域(7a和7b),以及一个附加的刚性部件(5),所述刚性部件(5)包含电子芯片(4)和在刚性部件(5)的装配过程中用于接触天线(3)的两个区域(7a和7b)的两个电连接区(8a和8b)。
14、按照权利要求13所述的电子标签,其特征在于刚性部件(5)包括诸如电池、振动器、LED或者传感器之类的附件。
15、按照权利要求13和14所述的电子标签,其特征在于它包含沿其全长展示的至少一条导线,所述导线的中断会终止所述标签的工作。
16、按照权利要求15所述的电子标签,其特征在于所述导线是天线(3)的一部分。
17、按照权利要求15所述的电子标签,其特征在于该导线的两端与电子芯片(4)连接。
18、按照权利要求15-17所述的电子标签,其特征在于该导线穿过坚固性降低的分隔区。
CNB008175705A 1999-12-23 2000-12-22 电子标签 Expired - Fee Related CN1178162C (zh)

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CN101122959B (zh) * 2006-08-10 2010-10-06 富士通株式会社 Rfid标签和rfid标签生产方法
CN106023323A (zh) * 2016-05-16 2016-10-12 江阴市四方游泳设备有限公司 用于游泳馆的智能手环及其管理系统以及管理方法
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US20020190131A1 (en) 2002-12-19
CA2395316C (en) 2010-04-27

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