HK1050918A1 - Carrier serving for supplying current to workpieces and a method for electrolytically treating workpieces - Google Patents

Carrier serving for supplying current to workpieces and a method for electrolytically treating workpieces

Info

Publication number
HK1050918A1
HK1050918A1 HK03103092A HK03103092A HK1050918A1 HK 1050918 A1 HK1050918 A1 HK 1050918A1 HK 03103092 A HK03103092 A HK 03103092A HK 03103092 A HK03103092 A HK 03103092A HK 1050918 A1 HK1050918 A1 HK 1050918A1
Authority
HK
Hong Kong
Prior art keywords
workpieces
supplying current
carrier serving
electrolytically treating
electrolytically
Prior art date
Application number
HK03103092A
Other languages
English (en)
Inventor
Egon Huebel
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10007799A external-priority patent/DE10007799C1/de
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1050918A1 publication Critical patent/HK1050918A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
HK03103092A 1999-10-12 2003-04-30 Carrier serving for supplying current to workpieces and a method for electrolytically treating workpieces HK1050918A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19950324 1999-10-12
DE10007799A DE10007799C1 (de) 1999-10-12 2000-02-15 Zur Stromzuführung zu elektrolytisch zu behandelnden Werkstücken oder Gegenelektroden dienender Träger und Verfahren zur elektrolytischen Behandlung von Werkstücken
PCT/DE2000/003220 WO2001027358A1 (fr) 1999-10-12 2000-09-13 Support servant a amener du courant a des pieces a traiter par voie electrolytique ou a des contre-electrodes et procede de traitement electrolytique de pieces

Publications (1)

Publication Number Publication Date
HK1050918A1 true HK1050918A1 (en) 2003-07-11

Family

ID=26004440

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03103092A HK1050918A1 (en) 1999-10-12 2003-04-30 Carrier serving for supplying current to workpieces and a method for electrolytically treating workpieces

Country Status (6)

Country Link
US (1) US6695961B1 (fr)
CN (1) CN1262690C (fr)
AU (1) AU1379901A (fr)
HK (1) HK1050918A1 (fr)
TW (1) TW589409B (fr)
WO (1) WO2001027358A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005524931A (ja) 2002-05-06 2005-08-18 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 光軸が異なる２つの部分を有する反射器を伴う照明器具
US20070068821A1 (en) * 2005-09-27 2007-03-29 Takahisa Hirasawa Method of manufacturing chromium plated article and chromium plating apparatus
DE102011050131B3 (de) * 2011-05-05 2012-08-16 Lpkf Laser & Electronics Ag Verfahren zur Herstellung von Metallisierungen auf Kunststoffteilen
US11237216B1 (en) * 2017-08-15 2022-02-01 Qnovo Inc. Method of detecting metal plating in intercalation cells
TWI748864B (zh) 2021-02-03 2021-12-01 英發企業股份有限公司 工具萬向接頭

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2951708A1 (de) 1979-12-19 1981-07-02 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren und vorrichtung zur automatischen regelung von teilstromstaerken eines gleichrichters
DE3771755D1 (de) * 1986-02-28 1991-09-05 Schering Ag Langgestreckte gestelle und zugehoerige teile zum loesbaren befestigen von zu galvanisierenden leiterplatten, sowie zugehoerige leiterplatten.
DE3732476A1 (de) * 1987-09-24 1989-04-13 Schering Ag Verfahren zur angleichung der teilstroeme in einem elektrolytischen bad
DE4041598C1 (fr) * 1990-12-22 1992-06-25 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
DE4205659C1 (en) * 1991-12-31 1993-05-06 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De Plant for electrolytic treatment of workpieces
US5558757A (en) * 1991-12-31 1996-09-24 Atotech Deutschland Gmbh Process for improving the coating of electrolytically treated work pieces, and arrngement for carrying out the process
DE4205660C1 (fr) 1991-12-31 1993-05-06 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
JPH05320994A (ja) * 1992-05-21 1993-12-07 Nitto Denko Corp プリント回路板の電解メッキ用治具
DE9309768U1 (de) * 1993-07-01 1993-11-04 Metzka Gmbh Kontaktiereinrichtung für ein Leiterplattengestell einer Galvanikanlage

Also Published As

Publication number Publication date
TW589409B (en) 2004-06-01
WO2001027358A1 (fr) 2001-04-19
CN1379829A (zh) 2002-11-13
CN1262690C (zh) 2006-07-05
US6695961B1 (en) 2004-02-24
AU1379901A (en) 2001-04-23

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20100913