HK1047819A1 - 電感元件 - Google Patents

電感元件

Info

Publication number
HK1047819A1
HK1047819A1 HK02109256.8A HK02109256A HK1047819A1 HK 1047819 A1 HK1047819 A1 HK 1047819A1 HK 02109256 A HK02109256 A HK 02109256A HK 1047819 A1 HK1047819 A1 HK 1047819A1
Authority
HK
Hong Kong
Prior art keywords
inductor element
inductor
Prior art date
Application number
HK02109256.8A
Other languages
English (en)
Inventor
岡本明
池田毅
Original Assignee
新瀉精密株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新瀉精密株式會社 filed Critical 新瀉精密株式會社
Priority to HK05109102A priority Critical patent/HK1077396A1/xx
Publication of HK1047819A1 publication Critical patent/HK1047819A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Filters And Equalizers (AREA)
HK02109256.8A 1999-08-17 2002-12-20 電感元件 HK1047819A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
HK05109102A HK1077396A1 (en) 1999-08-17 2002-12-20 Inductor element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11230293A JP2001052928A (ja) 1999-08-17 1999-08-17 インダクタ素子
PCT/JP2000/005385 WO2001013384A1 (en) 1999-08-17 2000-08-10 Inductor element

Publications (1)

Publication Number Publication Date
HK1047819A1 true HK1047819A1 (zh) 2003-03-07

Family

ID=16905559

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02109256.8A HK1047819A1 (zh) 1999-08-17 2002-12-20 電感元件

Country Status (7)

Country Link
US (1) US7046113B1 (zh)
EP (1) EP1213729A4 (zh)
JP (1) JP2001052928A (zh)
CN (2) CN100382208C (zh)
HK (1) HK1047819A1 (zh)
TW (1) TW457500B (zh)
WO (1) WO2001013384A1 (zh)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
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JPWO2005096007A1 (ja) * 2004-03-31 2008-02-21 日本電気株式会社 磁界センサ
WO2007080531A1 (en) * 2006-01-09 2007-07-19 Nxp B.V. Integrated circuit inductor with small floating metal structures
JPWO2009041304A1 (ja) * 2007-09-28 2011-01-27 日本電気株式会社 発振回路
US8138876B2 (en) * 2008-01-29 2012-03-20 International Business Machines Corporation On-chip integrated voltage-controlled variable inductor, methods of making and tuning such variable inductors, and design structures integrating such variable inductors
JP2010135453A (ja) * 2008-12-03 2010-06-17 Renesas Electronics Corp 半導体装置、半導体装置の製造方法
KR20100078877A (ko) * 2008-12-30 2010-07-08 주식회사 동부하이텍 반도체 소자 및 그 형성 방법
EP4234001A3 (en) 2009-03-09 2023-10-18 NuCurrent, Inc. System and method for wireless power transfer in implantable medical devices
US9444213B2 (en) 2009-03-09 2016-09-13 Nucurrent, Inc. Method for manufacture of multi-layer wire structure for high efficiency wireless communication
US9306358B2 (en) 2009-03-09 2016-04-05 Nucurrent, Inc. Method for manufacture of multi-layer wire structure for high efficiency wireless communication
US9439287B2 (en) 2009-03-09 2016-09-06 Nucurrent, Inc. Multi-layer wire structure for high efficiency wireless communication
US11476566B2 (en) 2009-03-09 2022-10-18 Nucurrent, Inc. Multi-layer-multi-turn structure for high efficiency wireless communication
US9232893B2 (en) 2009-03-09 2016-01-12 Nucurrent, Inc. Method of operation of a multi-layer-multi-turn structure for high efficiency wireless communication
US9208942B2 (en) 2009-03-09 2015-12-08 Nucurrent, Inc. Multi-layer-multi-turn structure for high efficiency wireless communication
US9300046B2 (en) 2009-03-09 2016-03-29 Nucurrent, Inc. Method for manufacture of multi-layer-multi-turn high efficiency inductors
US9142342B2 (en) * 2010-05-17 2015-09-22 Ronald Lambert Haner Compact-area capacitive plates for use with spiral inductors having more than one turn
US20130068499A1 (en) * 2011-09-15 2013-03-21 Nucurrent Inc. Method for Operation of Multi-Layer Wire Structure for High Efficiency Wireless Communication
JP6221736B2 (ja) * 2013-12-25 2017-11-01 三菱電機株式会社 半導体装置
JP5837708B1 (ja) * 2015-02-09 2015-12-24 アンリツ株式会社 高周波用チョークコイルおよびその製造方法
US9941729B2 (en) 2015-08-07 2018-04-10 Nucurrent, Inc. Single layer multi mode antenna for wireless power transmission using magnetic field coupling
US10658847B2 (en) 2015-08-07 2020-05-19 Nucurrent, Inc. Method of providing a single structure multi mode antenna for wireless power transmission using magnetic field coupling
US10636563B2 (en) 2015-08-07 2020-04-28 Nucurrent, Inc. Method of fabricating a single structure multi mode antenna for wireless power transmission using magnetic field coupling
US9948129B2 (en) 2015-08-07 2018-04-17 Nucurrent, Inc. Single structure multi mode antenna for wireless power transmission using magnetic field coupling having an internal switch circuit
US11205848B2 (en) 2015-08-07 2021-12-21 Nucurrent, Inc. Method of providing a single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling
US9960629B2 (en) 2015-08-07 2018-05-01 Nucurrent, Inc. Method of operating a single structure multi mode antenna for wireless power transmission using magnetic field coupling
US9941743B2 (en) 2015-08-07 2018-04-10 Nucurrent, Inc. Single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling
US9941590B2 (en) 2015-08-07 2018-04-10 Nucurrent, Inc. Single structure multi mode antenna for wireless power transmission using magnetic field coupling having magnetic shielding
US9960628B2 (en) 2015-08-07 2018-05-01 Nucurrent, Inc. Single structure multi mode antenna having a single layer structure with coils on opposing sides for wireless power transmission using magnetic field coupling
US10063100B2 (en) 2015-08-07 2018-08-28 Nucurrent, Inc. Electrical system incorporating a single structure multimode antenna for wireless power transmission using magnetic field coupling
US10985465B2 (en) 2015-08-19 2021-04-20 Nucurrent, Inc. Multi-mode wireless antenna configurations
US10923259B2 (en) * 2016-07-07 2021-02-16 Samsung Electro-Mechanics Co., Ltd. Coil component
KR20190038587A (ko) 2016-08-26 2019-04-08 누커런트, 인코포레이티드 무선 커넥터 시스템
US10432031B2 (en) 2016-12-09 2019-10-01 Nucurrent, Inc. Antenna having a substrate configured to facilitate through-metal energy transfer via near field magnetic coupling
US11223235B2 (en) 2017-02-13 2022-01-11 Nucurrent, Inc. Wireless electrical energy transmission system
US11283295B2 (en) 2017-05-26 2022-03-22 Nucurrent, Inc. Device orientation independent wireless transmission system
FR3082046A1 (fr) 2018-05-30 2019-12-06 Commissariat A L'energie Atomique Et Aux Energies Alternatives Circuit integre comportant une inductance
ES2736075A1 (es) * 2018-06-21 2019-12-23 Bsh Electrodomesticos Espana Sa Dispositivo de aparato de cocción por inducción
US11271430B2 (en) 2019-07-19 2022-03-08 Nucurrent, Inc. Wireless power transfer system with extended wireless charging range
US11227712B2 (en) 2019-07-19 2022-01-18 Nucurrent, Inc. Preemptive thermal mitigation for wireless power systems
US11189563B2 (en) * 2019-08-01 2021-11-30 Nanya Technology Corporation Semiconductor structure and manufacturing method thereof
US11056922B1 (en) 2020-01-03 2021-07-06 Nucurrent, Inc. Wireless power transfer system for simultaneous transfer to multiple devices
US11283303B2 (en) 2020-07-24 2022-03-22 Nucurrent, Inc. Area-apportioned wireless power antenna for maximized charging volume
US11876386B2 (en) 2020-12-22 2024-01-16 Nucurrent, Inc. Detection of foreign objects in large charging volume applications
US11881716B2 (en) 2020-12-22 2024-01-23 Nucurrent, Inc. Ruggedized communication for wireless power systems in multi-device environments
US11532693B2 (en) * 2021-01-19 2022-12-20 Texas Instruments Incorporated Passive components with improved characteristics
US11695302B2 (en) 2021-02-01 2023-07-04 Nucurrent, Inc. Segmented shielding for wide area wireless power transmitter
US12003116B2 (en) 2022-03-01 2024-06-04 Nucurrent, Inc. Wireless power transfer system for simultaneous transfer to multiple devices with cross talk and interference mitigation
US11831174B2 (en) 2022-03-01 2023-11-28 Nucurrent, Inc. Cross talk and interference mitigation in dual wireless power transmitter

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0377360A (ja) 1989-08-18 1991-04-02 Mitsubishi Electric Corp 半導体装置
JP2946971B2 (ja) 1992-10-28 1999-09-13 日本電気株式会社 高周波増幅半導体集積回路
JP3161147B2 (ja) 1993-04-23 2001-04-25 松下電器産業株式会社 スパイラルインダクタ素子
JP3808557B2 (ja) 1996-08-30 2006-08-16 新潟精密株式会社 インダクタ素子
JPH10208940A (ja) 1997-01-26 1998-08-07 T I F:Kk インダクタ素子
JPH11273949A (ja) * 1998-03-24 1999-10-08 Tif:Kk インダクタ素子
JPH11317621A (ja) * 1998-05-07 1999-11-16 Tif:Kk Ｌｃ発振器
JP2001044754A (ja) * 1999-07-26 2001-02-16 Niigata Seimitsu Kk Ｌｃ発振器

Also Published As

Publication number Publication date
EP1213729A1 (en) 2002-06-12
CN1252745C (zh) 2006-04-19
EP1213729A4 (en) 2003-04-09
US7046113B1 (en) 2006-05-16
TW457500B (en) 2001-10-01
JP2001052928A (ja) 2001-02-23
CN1370322A (zh) 2002-09-18
WO2001013384A1 (en) 2001-02-22
CN100382208C (zh) 2008-04-16
CN1629988A (zh) 2005-06-22

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