HK1046388B - Suitable for the etching of the ink feed slot of a fully integrated thermal inkjet print head - Google Patents

Suitable for the etching of the ink feed slot of a fully integrated thermal inkjet print head Download PDF

Info

Publication number
HK1046388B
HK1046388B HK02107817.4A HK02107817A HK1046388B HK 1046388 B HK1046388 B HK 1046388B HK 02107817 A HK02107817 A HK 02107817A HK 1046388 B HK1046388 B HK 1046388B
Authority
HK
Hong Kong
Prior art keywords
trench
substrate
layer
thin film
ink
Prior art date
Application number
HK02107817.4A
Other languages
German (de)
English (en)
French (fr)
Chinese (zh)
Other versions
HK1046388A1 (en
Inventor
E. Trueba Kenneth
C. Haluzak Charles
R. Thomas David
Van Vooren Colby
Original Assignee
Hewlett-Packard Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Company filed Critical Hewlett-Packard Company
Publication of HK1046388A1 publication Critical patent/HK1046388A1/en
Publication of HK1046388B publication Critical patent/HK1046388B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1635—Manufacturing processes dividing the wafer into individual chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B41J2/1639—Manufacturing processes molding sacrificial molding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49346—Rocket or jet device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
HK02107817.4A 2001-03-15 2002-10-29 Suitable for the etching of the ink feed slot of a fully integrated thermal inkjet print head HK1046388B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US811052 2001-03-15
US09/811,052 US6517735B2 (en) 2001-03-15 2001-03-15 Ink feed trench etch technique for a fully integrated thermal inkjet printhead

Publications (2)

Publication Number Publication Date
HK1046388A1 HK1046388A1 (en) 2003-01-10
HK1046388B true HK1046388B (en) 2005-09-23

Family

ID=25205411

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02107817.4A HK1046388B (en) 2001-03-15 2002-10-29 Suitable for the etching of the ink feed slot of a fully integrated thermal inkjet print head

Country Status (5)

Country Link
US (1) US6517735B2 (enExample)
EP (1) EP1241009B1 (enExample)
JP (1) JP4278335B2 (enExample)
DE (1) DE60204251T2 (enExample)
HK (1) HK1046388B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6675476B2 (en) * 2000-12-05 2004-01-13 Hewlett-Packard Development Company, L.P. Slotted substrates and techniques for forming same
US7052117B2 (en) 2002-07-03 2006-05-30 Dimatix, Inc. Printhead having a thin pre-fired piezoelectric layer
KR100499132B1 (ko) * 2002-10-24 2005-07-04 삼성전자주식회사 잉크젯 프린트헤드 및 그 제조방법
CN100355573C (zh) * 2002-12-27 2007-12-19 佳能株式会社 用于制造喷墨记录头的基础件
US7036913B2 (en) * 2003-05-27 2006-05-02 Samsung Electronics Co., Ltd. Ink-jet printhead
US7281778B2 (en) 2004-03-15 2007-10-16 Fujifilm Dimatix, Inc. High frequency droplet ejection device and method
US8491076B2 (en) 2004-03-15 2013-07-23 Fujifilm Dimatix, Inc. Fluid droplet ejection devices and methods
US8708441B2 (en) 2004-12-30 2014-04-29 Fujifilm Dimatix, Inc. Ink jet printing
JP4854328B2 (ja) * 2005-04-13 2012-01-18 キヤノン株式会社 液体吐出記録ヘッド
US7390745B2 (en) 2005-09-23 2008-06-24 International Business Machines Corporation Pattern enhancement by crystallographic etching
US7988247B2 (en) 2007-01-11 2011-08-02 Fujifilm Dimatix, Inc. Ejection of drops having variable drop size from an ink jet printer
US9016837B2 (en) 2013-05-14 2015-04-28 Stmicroelectronics, Inc. Ink jet printhead device with compressive stressed dielectric layer
US9016836B2 (en) * 2013-05-14 2015-04-28 Stmicroelectronics, Inc. Ink jet printhead with polarity-changing driver for thermal resistors
US11746005B2 (en) * 2021-03-04 2023-09-05 Funai Electric Co. Ltd Deep reactive ion etching process for fluid ejection heads
CN113584456A (zh) * 2021-07-21 2021-11-02 深圳清华大学研究院 超滑骨架及其加工方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2635043B2 (ja) 1986-04-28 1997-07-30 ヒューレット・パッカード・カンパニー 熱インクジエツト式プリントヘツド
US4789425A (en) 1987-08-06 1988-12-06 Xerox Corporation Thermal ink jet printhead fabricating process
US4864329A (en) 1988-09-22 1989-09-05 Xerox Corporation Fluid handling device with filter and fabrication process therefor
US5001085A (en) * 1990-07-17 1991-03-19 Micron Technology, Inc. Process for creating a metal etch mask which may be utilized for halogen-plasma excavation of deep trenches
US5648806A (en) 1992-04-02 1997-07-15 Hewlett-Packard Company Stable substrate structure for a wide swath nozzle array in a high resolution inkjet printer
US5852459A (en) 1994-10-31 1998-12-22 Hewlett-Packard Company Printer using print cartridge with internal pressure regulator
US6305790B1 (en) * 1996-02-07 2001-10-23 Hewlett-Packard Company Fully integrated thermal inkjet printhead having multiple ink feed holes per nozzle
DE69730667T2 (de) 1996-11-11 2005-09-22 Canon K.K. Verfahren zur Herstellung eines Durchgangslochs, Gebrauch dieses Verfahrens zur Herstellung eines Slikonsubstrates mit einem solchen Durchgangsloch oder eine Vorrichtung mit diesem Substrat, Verfahren zur Herstellung eines Tintenstrahl-Druckkopfes und Gebrauch dieses Verfahrens zur Herstellung eines Tintenstrahldruckkopfes
US6019907A (en) * 1997-08-08 2000-02-01 Hewlett-Packard Company Forming refill for monolithic inkjet printhead
US6154234A (en) * 1998-01-09 2000-11-28 Hewlett-Packard Company Monolithic ink jet nozzle formed from an oxide and nitride composition
US6391527B2 (en) * 1998-04-16 2002-05-21 Canon Kabushiki Kaisha Method of producing micro structure, method of production liquid discharge head

Also Published As

Publication number Publication date
US20020129495A1 (en) 2002-09-19
JP4278335B2 (ja) 2009-06-10
JP2002283580A (ja) 2002-10-03
US6517735B2 (en) 2003-02-11
EP1241009A3 (en) 2003-07-02
HK1046388A1 (en) 2003-01-10
EP1241009A2 (en) 2002-09-18
EP1241009B1 (en) 2005-05-25
DE60204251D1 (de) 2005-06-30
DE60204251T2 (de) 2006-05-11

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20140308