HK1043017A1 - An electronic circuit board, an arrangement comprising an insulating material and an electronic circuit board. - Google Patents

An electronic circuit board, an arrangement comprising an insulating material and an electronic circuit board.

Info

Publication number
HK1043017A1
HK1043017A1 HK02104650A HK02104650A HK1043017A1 HK 1043017 A1 HK1043017 A1 HK 1043017A1 HK 02104650 A HK02104650 A HK 02104650A HK 02104650 A HK02104650 A HK 02104650A HK 1043017 A1 HK1043017 A1 HK 1043017A1
Authority
HK
Hong Kong
Prior art keywords
circuit board
electronic circuit
insulating material
conducting
area
Prior art date
Application number
HK02104650A
Other languages
English (en)
Inventor
Johan Ulf Mercke
Jonas Bengtsson
Stefan Hellstrom
Michael Kellerman
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of HK1043017A1 publication Critical patent/HK1043017A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Battery Mounting, Suspending (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Secondary Cells (AREA)
  • Elimination Of Static Electricity (AREA)
HK02104650A 1999-01-22 2002-06-21 An electronic circuit board, an arrangement comprising an insulating material and an electronic circuit board. HK1043017A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9900230A SE513667C2 (sv) 1999-01-22 1999-01-22 Ett elektroniskt mönsterkort samt en anordning innefattande ett isolationsmaterial
PCT/EP2000/000272 WO2000044213A1 (en) 1999-01-22 2000-01-14 An electronic circuit board, an arrangement comprising an insulating material and an electronic circuit board

Publications (1)

Publication Number Publication Date
HK1043017A1 true HK1043017A1 (en) 2002-08-30

Family

ID=20414225

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02104650A HK1043017A1 (en) 1999-01-22 2002-06-21 An electronic circuit board, an arrangement comprising an insulating material and an electronic circuit board.

Country Status (14)

Country Link
US (1) US6295193B1 (xx)
EP (1) EP1149521B1 (xx)
JP (1) JP3822793B2 (xx)
CN (1) CN1183809C (xx)
AT (1) ATE236504T1 (xx)
AU (1) AU2291400A (xx)
CA (1) CA2359670C (xx)
DE (1) DE60001922D1 (xx)
HK (1) HK1043017A1 (xx)
MY (1) MY123511A (xx)
SE (1) SE513667C2 (xx)
TR (1) TR200102119T2 (xx)
WO (1) WO2000044213A1 (xx)
ZA (1) ZA200105486B (xx)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005054846A1 (en) * 2003-12-03 2005-06-16 Lifescan Scotland Limited Improvements relating to hand held anaytical devices
KR100660860B1 (ko) * 2005-02-11 2006-12-26 삼성전자주식회사 서지 전압으로 인한 집적 회로의 오동작 방지용 장치 및 방법
TWI449271B (zh) * 2011-11-16 2014-08-11 Dawning Leading Technology Inc 具有連接介面的電子裝置、其電路基板以及其製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3130324A1 (de) * 1981-07-31 1983-02-17 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
JPS6167295A (ja) * 1984-09-10 1986-04-07 日本電気株式会社 無線装置の筐体構造
US4677520A (en) 1985-09-13 1987-06-30 James Price Static charge protector for integrated circuits
US4754880A (en) * 1987-10-01 1988-07-05 Ncr Corporation Surface mount electronic device package
US4992340A (en) 1989-04-20 1991-02-12 Motorola, Inc. Intrinsic safe battery having self test capability
US5317476A (en) * 1989-05-26 1994-05-31 Loral Vought Systems Corporation Electronically monitored and controlled electrostatic discharge flooring system
US5167326A (en) * 1990-03-19 1992-12-01 R. H. Murphy Co., Inc. Carriers for integrated circuits and the like
JPH0832494B2 (ja) * 1990-08-18 1996-03-29 三菱電機株式会社 携帯形半導体記憶装置
FR2737068B1 (fr) * 1995-07-18 1997-10-03 Alcatel Mobile Comm France Appareil de communication avec protection electrostatique
DE19601650A1 (de) * 1996-01-18 1997-07-24 Telefunken Microelectron Anordnung zum Schutz elektrischer und elektronischer Bauelemente vor elektrostatischen Entladungen
JP3731951B2 (ja) 1996-09-24 2006-01-05 ローム株式会社 リチウムイオン電池保護回路
SE516507C2 (sv) 1996-12-23 2002-01-22 Ericsson Telefon Ab L M Uppladdningsbart batteri med inbyggd säkerhetskrets för en portabel elektrisk apparat

Also Published As

Publication number Publication date
ATE236504T1 (de) 2003-04-15
EP1149521A1 (en) 2001-10-31
JP2002535826A (ja) 2002-10-22
TR200102119T2 (tr) 2002-02-21
SE9900230D0 (sv) 1999-01-22
CN1338196A (zh) 2002-02-27
SE9900230L (sv) 2000-07-23
AU2291400A (en) 2000-08-07
CN1183809C (zh) 2005-01-05
WO2000044213A1 (en) 2000-07-27
US6295193B1 (en) 2001-09-25
ZA200105486B (en) 2002-07-03
CA2359670C (en) 2006-07-11
JP3822793B2 (ja) 2006-09-20
MY123511A (en) 2006-05-31
DE60001922D1 (de) 2003-05-08
CA2359670A1 (en) 2000-07-27
EP1149521B1 (en) 2003-04-02
SE513667C2 (sv) 2000-10-16

Similar Documents

Publication Publication Date Title
EP1041633A4 (en) SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE
EP1250033A3 (en) Printed circuit board and electronic component
EP1005086A3 (en) Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrate
TW342580B (en) Printed circuit assembly and method of manufacture therefor
TW353859B (en) Structure and method for supporting one or more electronic components
EP0873046A4 (en) COMPONENT WITH PRINTED CIRCUIT BOARD
WO2003030255A3 (en) Multiple die interconnect system
EP0996154A4 (en) SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD, CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE
EP0977298A3 (en) High-frequency module
SE9801794D0 (sv) Integrerad mikrovåghybridkrets
WO2004038798A3 (en) Stacked electronic structures including offset substrates
WO2005060401A3 (en) Direct contact power transfer pad and method of making same
EP0907199A3 (en) Wiring substrate and gas discharge display device
SE9802157D0 (sv) Elektrisk komponent
WO2005062803A3 (en) Printed circuit dielectric foil and embedded capacitors
SG103839A1 (en) High density contact arrangement
TW200518270A (en) Semiconductor device, and wiring-layout design system for automatically designing wiring-layout in such semiconductor device
HK1043017A1 (en) An electronic circuit board, an arrangement comprising an insulating material and an electronic circuit board.
ATE158113T1 (de) Bitleitungsanordnung für integrierte schaltungen
EP0822596A3 (en) Improvements in or relating to integrated circuits
AU1025602A (en) An integrated circuit carrier
IL105753A (en) Printed circuit substrates
KR910016227A (ko) 전자기 간섭을 방지하는 인쇄회로기판
WO2000011441A3 (en) Pressure sensor and method of forming the same
TW348365B (en) Multi-layered printed circuit board, and grid array package adopting the same

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180114