TW348365B - Multi-layered printed circuit board, and grid array package adopting the same - Google Patents

Multi-layered printed circuit board, and grid array package adopting the same

Info

Publication number
TW348365B
TW348365B TW085111755A TW85111755A TW348365B TW 348365 B TW348365 B TW 348365B TW 085111755 A TW085111755 A TW 085111755A TW 85111755 A TW85111755 A TW 85111755A TW 348365 B TW348365 B TW 348365B
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
same
grid array
layered printed
Prior art date
Application number
TW085111755A
Other languages
Chinese (zh)
Inventor
Toru Otaki
Yasuteru Ichida
Yasushi Takeuchi
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP23056396A external-priority patent/JP3513333B2/en
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of TW348365B publication Critical patent/TW348365B/en

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A multi-layered printed circuit board comprising: an LSI mounted on the circuit board, the LSI having a plurality of power supply pins and a plurality of signal pins; a conductive pattern, such as a circuit patter, formed on the circuit board, one end of the conductive pattern being connected to at least one of the plurality of power supply pins of the LSI; and a power supply pattern formed on the circuit board, the power supply pattern being connected to the other end of the conductive pattern.
TW085111755A 1996-04-02 1996-09-25 Multi-layered printed circuit board, and grid array package adopting the same TW348365B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7993196 1996-04-02
JP23056396A JP3513333B2 (en) 1995-09-29 1996-08-30 Multilayer printed wiring board and electronic equipment mounting the same

Publications (1)

Publication Number Publication Date
TW348365B true TW348365B (en) 1998-12-21

Family

ID=58264083

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085111755A TW348365B (en) 1996-04-02 1996-09-25 Multi-layered printed circuit board, and grid array package adopting the same

Country Status (1)

Country Link
TW (1) TW348365B (en)

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees