HK1042013B - Integrated circuit package having a substrate vent hole - Google Patents

Integrated circuit package having a substrate vent hole Download PDF

Info

Publication number
HK1042013B
HK1042013B HK02103549.8A HK02103549A HK1042013B HK 1042013 B HK1042013 B HK 1042013B HK 02103549 A HK02103549 A HK 02103549A HK 1042013 B HK1042013 B HK 1042013B
Authority
HK
Hong Kong
Prior art keywords
substrate
integrated circuit
opening
package
underfill material
Prior art date
Application number
HK02103549.8A
Other languages
German (de)
English (en)
French (fr)
Chinese (zh)
Other versions
HK1042013A1 (en
Inventor
Suresh Ramalingam
Nagesh Vodrahalli
Michael J. Costello
Mun Leong Loke
Ravi V. Mahajan
Original Assignee
Intel Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corporation filed Critical Intel Corporation
Publication of HK1042013A1 publication Critical patent/HK1042013A1/en
Publication of HK1042013B publication Critical patent/HK1042013B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
HK02103549.8A 1999-06-11 2000-06-05 Integrated circuit package having a substrate vent hole HK1042013B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US330373 1999-06-11
US09/330,373 US6490166B1 (en) 1999-06-11 1999-06-11 Integrated circuit package having a substrate vent hole
PCT/US2000/040107 WO2000078103A1 (en) 1999-06-11 2000-06-05 Integrated circuit package having a substrate vent hole

Publications (2)

Publication Number Publication Date
HK1042013A1 HK1042013A1 (en) 2002-07-26
HK1042013B true HK1042013B (en) 2006-06-02

Family

ID=23289477

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02103549.8A HK1042013B (en) 1999-06-11 2000-06-05 Integrated circuit package having a substrate vent hole

Country Status (9)

Country Link
US (2) US6490166B1 (https=)
EP (1) EP1186212B1 (https=)
JP (1) JP2003501841A (https=)
KR (1) KR100456443B1 (https=)
AU (1) AU5790700A (https=)
DE (1) DE60026028T2 (https=)
HK (1) HK1042013B (https=)
IL (2) IL146865A0 (https=)
WO (1) WO2000078103A1 (https=)

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* Cited by examiner, † Cited by third party
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JPH1154658A (ja) * 1997-07-30 1999-02-26 Hitachi Ltd 半導体装置及びその製造方法並びにフレーム構造体
US6483101B1 (en) 1999-12-08 2002-11-19 Amkor Technology, Inc. Molded image sensor package having lens holder
US6861720B1 (en) * 2001-08-29 2005-03-01 Amkor Technology, Inc. Placement template and method for placing optical dies
US6693239B2 (en) * 2001-09-06 2004-02-17 Delphi Technologies Inc. Overmolded circuit board with underfilled surface-mount component and method therefor
US6800946B2 (en) * 2002-12-23 2004-10-05 Motorola, Inc Selective underfill for flip chips and flip-chip assemblies
US7242097B2 (en) * 2003-06-30 2007-07-10 Intel Corporation Electromigration barrier layers for solder joints
US20050218528A1 (en) * 2004-03-31 2005-10-06 Beatty John J Capillary underfill channel
US20060046321A1 (en) * 2004-08-27 2006-03-02 Hewlett-Packard Development Company, L.P. Underfill injection mold
US20070087481A1 (en) * 2005-10-19 2007-04-19 Himax Technologies, Inc. Underfill aiding process for a tape
WO2009044863A1 (ja) * 2007-10-03 2009-04-09 Fujikura Ltd. モジュール、配線板、及びモジュールの製造方法
US9105647B2 (en) * 2010-05-17 2015-08-11 Stats Chippac, Ltd. Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material
US8522426B2 (en) * 2010-06-05 2013-09-03 Raytheon Company Vent blocking on vented ball grid arrays to provide a cleaner solution barrier
AU2013201130B2 (en) * 2012-02-29 2014-12-11 Robert Bosch (Australia) Pty Ltd Printed circuit board
KR101970667B1 (ko) 2012-07-31 2019-04-19 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
KR101934917B1 (ko) * 2012-08-06 2019-01-04 삼성전자주식회사 반도체 패키지 및 그 제조 방법
US9331370B1 (en) 2013-03-14 2016-05-03 Altera Corporation Multilayer integrated circuit packages with localized air structures
US9917068B2 (en) * 2014-03-14 2018-03-13 Taiwan Semiconductor Manufacturing Company Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices
EP3045909B1 (en) 2015-01-14 2020-11-04 Sensirion AG Sensor package
KR102437774B1 (ko) 2015-11-17 2022-08-30 삼성전자주식회사 인쇄 회로 기판
US9721812B2 (en) * 2015-11-20 2017-08-01 International Business Machines Corporation Optical device with precoated underfill
US20220028704A1 (en) * 2018-12-18 2022-01-27 Octavo Systems Llc Molded packages in a molded device
KR102932547B1 (ko) 2020-05-22 2026-03-03 삼성전자주식회사 반도체 패키지 및 그의 제조 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
US5218234A (en) 1991-12-23 1993-06-08 Motorola, Inc. Semiconductor device with controlled spread polymeric underfill
US5311059A (en) * 1992-01-24 1994-05-10 Motorola, Inc. Backplane grounding for flip-chip integrated circuit
US5313365A (en) * 1992-06-30 1994-05-17 Motorola, Inc. Encapsulated electronic package
US5612576A (en) * 1992-10-13 1997-03-18 Motorola Self-opening vent hole in an overmolded semiconductor device
KR100280762B1 (ko) * 1992-11-03 2001-03-02 비센트 비.인그라시아 노출 후부를 갖는 열적 강화된 반도체 장치 및 그 제조방법
US5385869A (en) * 1993-07-22 1995-01-31 Motorola, Inc. Semiconductor chip bonded to a substrate and method of making
US5473512A (en) * 1993-12-16 1995-12-05 At&T Corp. Electronic device package having electronic device boonded, at a localized region thereof, to circuit board
US5721450A (en) 1995-06-12 1998-02-24 Motorola, Inc. Moisture relief for chip carriers
US5710071A (en) * 1995-12-04 1998-01-20 Motorola, Inc. Process for underfilling a flip-chip semiconductor device
US5766982A (en) * 1996-03-07 1998-06-16 Micron Technology, Inc. Method and apparatus for underfill of bumped or raised die
CA2198305A1 (en) 1996-05-01 1997-11-02 Yinon Degani Integrated circuit bonding method and apparatus
JPH10261661A (ja) 1997-03-19 1998-09-29 Toshiba Corp アンダーフィル充填方法及びプリント配線板構造
US5981312A (en) * 1997-06-27 1999-11-09 International Business Machines Corporation Method for injection molded flip chip encapsulation
US5919329A (en) * 1997-10-14 1999-07-06 Gore Enterprise Holdings, Inc. Method for assembling an integrated circuit chip package having at least one semiconductor device
US6038136A (en) 1997-10-29 2000-03-14 Hestia Technologies, Inc. Chip package with molded underfill
JPH11340375A (ja) 1998-05-26 1999-12-10 Toshiba Corp 配線基板および電子ユニットおよび電子部品実装方法

Also Published As

Publication number Publication date
EP1186212B1 (en) 2006-02-15
JP2003501841A (ja) 2003-01-14
WO2000078103A1 (en) 2000-12-21
KR100456443B1 (ko) 2004-11-09
HK1042013A1 (en) 2002-07-26
USRE44629E1 (en) 2013-12-10
DE60026028D1 (de) 2006-04-20
DE60026028T2 (de) 2006-08-10
EP1186212A1 (en) 2002-03-13
KR20020007424A (ko) 2002-01-26
IL146865A0 (en) 2002-07-25
AU5790700A (en) 2001-01-02
US6490166B1 (en) 2002-12-03
IL146865A (en) 2007-03-08

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20130605