HK1037790A1 - Method of connecting electrode, narrow pitch connector, pitch changing device, micromachine, piezoelectric actuator, electrostatic actuator, inkjet head, ink-jet printer, liquid crystal device, and electronic device - Google Patents

Method of connecting electrode, narrow pitch connector, pitch changing device, micromachine, piezoelectric actuator, electrostatic actuator, inkjet head, ink-jet printer, liquid crystal device, and electronic device

Info

Publication number
HK1037790A1
HK1037790A1 HK01107984A HK01107984A HK1037790A1 HK 1037790 A1 HK1037790 A1 HK 1037790A1 HK 01107984 A HK01107984 A HK 01107984A HK 01107984 A HK01107984 A HK 01107984A HK 1037790 A1 HK1037790 A1 HK 1037790A1
Authority
HK
Hong Kong
Prior art keywords
micromachine
ink
liquid crystal
jet printer
inkjet head
Prior art date
Application number
HK01107984A
Other languages
English (en)
Inventor
Eiichi Sato
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of HK1037790A1 publication Critical patent/HK1037790A1/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14201Structure of print heads with piezoelectric elements
    • B41J2/14274Structure of print heads with piezoelectric elements of stacked structure type, deformed by compression/extension and disposed on a diaphragm
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14314Structure of ink jet print heads with electrostatically actuated membrane
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0214Resistance welding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0242Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections comprising means for controlling the temperature, e.g. making use of the curie point
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2002/14491Electrical connection

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Combinations Of Printed Boards (AREA)
HK01107984A 1999-03-31 2001-11-13 Method of connecting electrode, narrow pitch connector, pitch changing device, micromachine, piezoelectric actuator, electrostatic actuator, inkjet head, ink-jet printer, liquid crystal device, and electronic device HK1037790A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9406999 1999-03-31
PCT/JP2000/002069 WO2000059074A1 (fr) 1999-03-31 2000-03-31 Procede de connexion d'electrodes, connecteur a pas etroit, dispositif de modification du pas, micromachine, actionneur piezoelectrique, actionneur electrostatique, tete a jet d'encre, imprimante a jet d'encre, dispositif a cristaux liquides et dispositif electronique

Publications (1)

Publication Number Publication Date
HK1037790A1 true HK1037790A1 (en) 2002-02-15

Family

ID=14100230

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01107984A HK1037790A1 (en) 1999-03-31 2001-11-13 Method of connecting electrode, narrow pitch connector, pitch changing device, micromachine, piezoelectric actuator, electrostatic actuator, inkjet head, ink-jet printer, liquid crystal device, and electronic device

Country Status (6)

Country Link
US (1) US6619785B1 (xx)
KR (1) KR100402871B1 (xx)
CN (1) CN1266806C (xx)
HK (1) HK1037790A1 (xx)
TW (1) TW508877B (xx)
WO (1) WO2000059074A1 (xx)

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Publication number Priority date Publication date Assignee Title
KR100304261B1 (ko) 1999-04-16 2001-09-26 윤종용 테이프 캐리어 패키지, 그를 포함한 액정표시패널 어셈블리,그를 채용한 액정표시장치 및 이들의 조립 방법
US7339568B2 (en) * 1999-04-16 2008-03-04 Samsung Electronics Co., Ltd. Signal transmission film and a liquid crystal display panel having the same
JP2002141576A (ja) * 2000-11-02 2002-05-17 Fujitsu Ltd ピエゾ素子と電極との接合方法及び該接合方法を使用したピエゾマイクロアクチュエータ
JP2003163239A (ja) * 2001-11-27 2003-06-06 Mitsubishi Electric Corp 半導体装置、半導体チップの支持部材及び電気接続用部材
JP4218245B2 (ja) * 2002-01-31 2009-02-04 セイコーエプソン株式会社 インクジェット式プリンタ
WO2004015772A1 (en) * 2002-08-08 2004-02-19 Nanoink, Inc. Protosubstrates
AU2003264456A1 (en) * 2002-10-30 2004-05-25 Sony Corporation Input device and process for manufacturing the same, portable electronic apparatus comprising input device
US6913343B2 (en) * 2003-04-30 2005-07-05 Hewlett-Packard Development Company, L.P. Methods for forming and protecting electrical interconnects and resultant assemblies
US6877840B2 (en) * 2003-04-30 2005-04-12 Hewlett-Packard Development Company, L.P. Fluid-ejection assembly
JP4177798B2 (ja) * 2004-08-23 2008-11-05 株式会社東芝 半導体装置
JP5023488B2 (ja) * 2005-03-09 2012-09-12 セイコーエプソン株式会社 デバイス実装構造とデバイス実装方法、液滴吐出ヘッド及び駆動ユニット並びに半導体装置
JP5088916B2 (ja) * 2005-10-28 2012-12-05 富士フイルム株式会社 無機膜基板の製造方法
JP4635915B2 (ja) 2006-03-08 2011-02-23 エプソンイメージングデバイス株式会社 電気光学装置及び電子機器
CN101394036B (zh) * 2007-09-21 2010-12-15 财团法人工业技术研究院 微型连接器及其制作方法
CN101414715B (zh) * 2007-10-19 2011-01-19 财团法人工业技术研究院 微型连接器及其制作方法
RU2458491C1 (ru) * 2008-08-11 2012-08-10 Шарп Кабусики Кайся Гибкая подложка и структура электрической схемы
JP2010125727A (ja) * 2008-11-28 2010-06-10 Seiko Epson Corp 液体噴射ヘッド及びその製造方法並びに液体噴射装置
EP2639072B1 (en) * 2010-11-08 2016-06-15 Konica Minolta, Inc. Inkjet head and method for producing inkjet head
JP6415859B2 (ja) * 2014-06-04 2018-10-31 エスアイアイ・プリンテック株式会社 液体噴射ヘッド及び液体噴射装置
JP7037401B2 (ja) * 2018-03-26 2022-03-16 ローム株式会社 サーマルプリントヘッド
US10850519B2 (en) * 2018-09-26 2020-12-01 Seiko Epson Corporation Liquid ejecting head and liquid ejecting apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH037181A (ja) 1989-06-02 1991-01-14 Kobe Steel Ltd スキー板
JPH04182133A (ja) 1990-11-16 1992-06-29 Citizen Watch Co Ltd 液滴噴射記録装置
ATE172407T1 (de) * 1993-01-19 1998-11-15 Canon Kk Aufzeichnungsgerät
JPH06333652A (ja) 1993-05-24 1994-12-02 Sumitomo Electric Ind Ltd 電子部品用端子ピッチ変換コネクタ
JP2868687B2 (ja) * 1993-05-25 1999-03-10 株式会社三協精機製作所 磁気カードリーダ
JP3022081B2 (ja) 1993-08-30 2000-03-15 シャープ株式会社 端子接続構造
JP3007181U (ja) * 1994-07-26 1995-02-07 しなのポリマー株式会社 ピッチ変換電気コネクタ
JP3492025B2 (ja) * 1995-06-02 2004-02-03 株式会社トクヤマ 回路基板構造
JP2666131B2 (ja) 1996-03-19 1997-10-22 株式会社潤工社 フラットケーブル用接続構造体及びその製造方法
EP0820871B1 (en) * 1996-07-26 2003-01-22 Seiko Epson Corporation Ink jet type recording head
JPH10247118A (ja) 1997-03-03 1998-09-14 Canon Inc マイクロダンパ、及び該マイクロダンパを有するセンサ、アクチュエータ、プローブ、並びに該プローブを有する走査型プローブ顕微鏡、加工装置、情報処理装置
JPH1142779A (ja) 1997-07-25 1999-02-16 Seiko Epson Corp インクジェット式記録装置

Also Published As

Publication number Publication date
KR100402871B1 (ko) 2003-10-22
CN1266806C (zh) 2006-07-26
CN1297595A (zh) 2001-05-30
WO2000059074A1 (fr) 2000-10-05
KR20010043916A (ko) 2001-05-25
TW508877B (en) 2002-11-01
US6619785B1 (en) 2003-09-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190331