HK1021750A1 - Circuitry and method for an electroplating plant or etching plant pulse power supply - Google Patents

Circuitry and method for an electroplating plant or etching plant pulse power supply

Info

Publication number
HK1021750A1
HK1021750A1 HK00100598A HK00100598A HK1021750A1 HK 1021750 A1 HK1021750 A1 HK 1021750A1 HK 00100598 A HK00100598 A HK 00100598A HK 00100598 A HK00100598 A HK 00100598A HK 1021750 A1 HK1021750 A1 HK 1021750A1
Authority
HK
Hong Kong
Prior art keywords
plant
rectifiers
change
circuitry
power supply
Prior art date
Application number
HK00100598A
Other languages
English (en)
Inventor
Manfred Maurer
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1021750A1 publication Critical patent/HK1021750A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Supply And Distribution Of Alternating Current (AREA)
  • Catching Or Destruction (AREA)
  • Keying Circuit Devices (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Control Of El Displays (AREA)
  • Optical Communication System (AREA)
  • ing And Chemical Polishing (AREA)
  • Coating With Molten Metal (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
HK00100598A 1997-02-27 2000-01-31 Circuitry and method for an electroplating plant or etching plant pulse power supply HK1021750A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19707905A DE19707905C1 (de) 1997-02-27 1997-02-27 Verfahren zur Pulsstromversorgung von Galvanisieranlagen
PCT/DE1998/000383 WO1998038357A1 (de) 1997-02-27 1998-02-02 Schaltungsanordnung und verfahren zur pulsstromversorgung von galvanisier- oder ätzanlagen

Publications (1)

Publication Number Publication Date
HK1021750A1 true HK1021750A1 (en) 2000-06-30

Family

ID=7821683

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00100598A HK1021750A1 (en) 1997-02-27 2000-01-31 Circuitry and method for an electroplating plant or etching plant pulse power supply

Country Status (16)

Country Link
US (1) US6179984B1 (ja)
EP (1) EP0966557B1 (ja)
JP (1) JP4095675B2 (ja)
KR (1) KR100490223B1 (ja)
CN (1) CN1204300C (ja)
AT (1) ATE217037T1 (ja)
AU (1) AU6494898A (ja)
BR (1) BR9807269B1 (ja)
CA (1) CA2282391A1 (ja)
DE (2) DE19707905C1 (ja)
ES (1) ES2175687T3 (ja)
HK (1) HK1021750A1 (ja)
HU (1) HUP0000593A3 (ja)
MY (1) MY119720A (ja)
PL (1) PL187880B1 (ja)
WO (1) WO1998038357A1 (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19726510C2 (de) * 1997-06-23 2000-12-28 Georg Hesse Vorrichtung und Verfahren zur elektrolytischen Metallabscheidung mittels Pulsstrom
US7135461B1 (en) * 2000-06-16 2006-11-14 Myelos Corporation Retro-inverso peptides derived from interleukin-6
DE19931230A1 (de) * 1999-07-07 2001-01-18 Atotech Deutschland Gmbh Verfahren zur Galvanisier- und Ätzstrom-Erzeugung in elektrolytischen Anlagen
US6294060B1 (en) 1999-10-21 2001-09-25 Ati Properties, Inc. Conveyorized electroplating device
KR100439356B1 (ko) * 2002-01-16 2004-07-12 소치재 배터리의 충전전압 보상 안정화 회로
DE10202431C1 (de) * 2002-01-22 2003-05-28 Egon Huebel Vorrichtung und Verfahren zum elektrochemischen Behandeln von Gut mit Pulsstrom
US20040140219A1 (en) * 2003-01-21 2004-07-22 Texas Instruments Incorporated System and method for pulse current plating
GB2403609A (en) * 2003-07-01 2005-01-05 Univ Leicester Pulse charging an electrochemical device
US20070068821A1 (en) * 2005-09-27 2007-03-29 Takahisa Hirasawa Method of manufacturing chromium plated article and chromium plating apparatus
JP4877548B2 (ja) * 2006-11-30 2012-02-15 日立オートモティブシステムズ株式会社 クロムめっき装置
US20100307924A1 (en) * 2007-09-20 2010-12-09 Heid Guenter Power control device of a power network of an electrochemical coating facility
CN101469442B (zh) * 2007-12-29 2011-12-14 比亚迪股份有限公司 脉冲调制电源及具有该电源的电化学抛光装置
CA2767557A1 (en) 2009-07-10 2011-01-13 National Research Council Of Canada Novel pulsed power supply for plasma electrolytic deposition and other processes
JP6259917B2 (ja) * 2013-11-19 2018-01-10 ヘッカー エレクトロニカ ポテンシャ ワイ プロセサス ソシエダッド アノニマ 銅及び他の製品を電解採取または電解精錬するための電解セル群に供給するｄｃにａｃを重畳するためのシステム
EP3029178A1 (en) 2014-12-05 2016-06-08 ATOTECH Deutschland GmbH Method and apparatus for electroplating a metal onto a substrate
EP3279676B1 (en) * 2016-08-04 2020-04-01 Robert Bosch GmbH Method and device for the detection of corrosion within an at least partially electrically conductive housing of an electric energy storage unit and corresponding electric energy storage system
CN114174559A (zh) * 2019-08-05 2022-03-11 Sms集团有限公司 使用脉冲技术对导电带材和/或织物进行电解涂层的方法和设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3959088A (en) * 1975-03-19 1976-05-25 The United States Of America As Represented By The Secretary Of The Army Method and apparatus for generating high amperage pulses from an A-C power source
US4656411A (en) * 1984-11-13 1987-04-07 Carlson Daniel P DC current controller for hydroset battery electrode electroformation
DE3609296A1 (de) * 1986-03-19 1987-09-24 Siemens Ag Vorrichtung zur impulsartigen stromaenderung in einem gleichstromverbraucher, insbesondere einem elektrolytischen bad zur stoffabscheidung bzw. stoffabtragung
US4863579A (en) * 1986-12-27 1989-09-05 Shizuoka Seiki Co., Ltd. Power supply system for electrolytic processing apparatus
KR910006552B1 (ko) * 1987-09-17 1991-08-28 시즈오카 세이키 가부시기가이샤 전해가공에 의한 마무리 가공방법
US4839002A (en) * 1987-12-23 1989-06-13 International Hardcoat, Inc. Method and capacitive discharge apparatus for aluminum anodizing
DE3869110D1 (de) * 1988-01-11 1992-04-16 Shizuoka Seiki Co Ltd Fertigbearbeitungsmethode, die ein elektrochemisches verfahren benutzt und elektrochemische fertigbearbeitungsmaschine.
GB8801827D0 (en) * 1988-01-27 1988-02-24 Jct Controls Ltd Improvements in electrochemical processes
JPH0271932A (ja) * 1988-09-07 1990-03-12 Shizuoka Seiki Co Ltd 電解仕上げ加工装置の芯出し方法
US5007993A (en) * 1989-06-20 1991-04-16 Hull Harry F Electrolytic processing apparatus and method with time multiplexed power supply
DE3939681A1 (de) * 1989-12-01 1991-06-06 Schering Ag Verfahren zur steuerung des ablaufes von galvanischen anlagen, sowie zur durchfuehrung des verfahrens dienender anordnung
KR910018111A (ko) * 1990-04-26 1991-11-30 시기 모리야 전해가공방법 및 전해가공장치

Also Published As

Publication number Publication date
BR9807269A (pt) 2000-05-23
JP2001513146A (ja) 2001-08-28
HUP0000593A2 (en) 2000-07-28
CN1237215A (zh) 1999-12-01
KR20000068882A (ko) 2000-11-25
ES2175687T3 (es) 2002-11-16
US6179984B1 (en) 2001-01-30
ATE217037T1 (de) 2002-05-15
CA2282391A1 (en) 1998-09-03
DE59803980D1 (de) 2002-06-06
PL187880B1 (pl) 2004-10-29
DE19707905C1 (de) 1998-02-05
HUP0000593A3 (en) 2002-02-28
AU6494898A (en) 1998-09-18
EP0966557A1 (de) 1999-12-29
JP4095675B2 (ja) 2008-06-04
MY119720A (en) 2005-07-29
BR9807269B1 (pt) 2010-06-01
PL333139A1 (en) 1999-11-22
WO1998038357A1 (de) 1998-09-03
EP0966557B1 (de) 2002-05-02
KR100490223B1 (ko) 2005-05-17
CN1204300C (zh) 2005-06-01

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150202