HK1021750A1 - Circuitry and method for an electroplating plant or etching plant pulse power supply - Google Patents
Circuitry and method for an electroplating plant or etching plant pulse power supplyInfo
- Publication number
- HK1021750A1 HK1021750A1 HK00100598A HK00100598A HK1021750A1 HK 1021750 A1 HK1021750 A1 HK 1021750A1 HK 00100598 A HK00100598 A HK 00100598A HK 00100598 A HK00100598 A HK 00100598A HK 1021750 A1 HK1021750 A1 HK 1021750A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- plant
- rectifiers
- change
- circuitry
- power supply
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Supply And Distribution Of Alternating Current (AREA)
- Catching Or Destruction (AREA)
- Keying Circuit Devices (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Control Of El Displays (AREA)
- Optical Communication System (AREA)
- ing And Chemical Polishing (AREA)
- Coating With Molten Metal (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19707905A DE19707905C1 (de) | 1997-02-27 | 1997-02-27 | Verfahren zur Pulsstromversorgung von Galvanisieranlagen |
PCT/DE1998/000383 WO1998038357A1 (de) | 1997-02-27 | 1998-02-02 | Schaltungsanordnung und verfahren zur pulsstromversorgung von galvanisier- oder ätzanlagen |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1021750A1 true HK1021750A1 (en) | 2000-06-30 |
Family
ID=7821683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK00100598A HK1021750A1 (en) | 1997-02-27 | 2000-01-31 | Circuitry and method for an electroplating plant or etching plant pulse power supply |
Country Status (16)
Country | Link |
---|---|
US (1) | US6179984B1 (xx) |
EP (1) | EP0966557B1 (xx) |
JP (1) | JP4095675B2 (xx) |
KR (1) | KR100490223B1 (xx) |
CN (1) | CN1204300C (xx) |
AT (1) | ATE217037T1 (xx) |
AU (1) | AU6494898A (xx) |
BR (1) | BR9807269B1 (xx) |
CA (1) | CA2282391A1 (xx) |
DE (2) | DE19707905C1 (xx) |
ES (1) | ES2175687T3 (xx) |
HK (1) | HK1021750A1 (xx) |
HU (1) | HUP0000593A3 (xx) |
MY (1) | MY119720A (xx) |
PL (1) | PL187880B1 (xx) |
WO (1) | WO1998038357A1 (xx) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19726510C2 (de) * | 1997-06-23 | 2000-12-28 | Georg Hesse | Vorrichtung und Verfahren zur elektrolytischen Metallabscheidung mittels Pulsstrom |
US7135461B1 (en) * | 2000-06-16 | 2006-11-14 | Myelos Corporation | Retro-inverso peptides derived from interleukin-6 |
DE19931230A1 (de) * | 1999-07-07 | 2001-01-18 | Atotech Deutschland Gmbh | Verfahren zur Galvanisier- und Ätzstrom-Erzeugung in elektrolytischen Anlagen |
US6294060B1 (en) | 1999-10-21 | 2001-09-25 | Ati Properties, Inc. | Conveyorized electroplating device |
KR100439356B1 (ko) * | 2002-01-16 | 2004-07-12 | 소치재 | 배터리의 충전전압 보상 안정화 회로 |
DE10202431C1 (de) * | 2002-01-22 | 2003-05-28 | Egon Huebel | Vorrichtung und Verfahren zum elektrochemischen Behandeln von Gut mit Pulsstrom |
US20040140219A1 (en) * | 2003-01-21 | 2004-07-22 | Texas Instruments Incorporated | System and method for pulse current plating |
GB2403609A (en) * | 2003-07-01 | 2005-01-05 | Univ Leicester | Pulse charging an electrochemical device |
US20070068821A1 (en) * | 2005-09-27 | 2007-03-29 | Takahisa Hirasawa | Method of manufacturing chromium plated article and chromium plating apparatus |
JP4877548B2 (ja) * | 2006-11-30 | 2012-02-15 | 日立オートモティブシステムズ株式会社 | クロムめっき装置 |
US20100307924A1 (en) * | 2007-09-20 | 2010-12-09 | Heid Guenter | Power control device of a power network of an electrochemical coating facility |
CN101469442B (zh) * | 2007-12-29 | 2011-12-14 | 比亚迪股份有限公司 | 脉冲调制电源及具有该电源的电化学抛光装置 |
CA2767557A1 (en) | 2009-07-10 | 2011-01-13 | National Research Council Of Canada | Novel pulsed power supply for plasma electrolytic deposition and other processes |
JP6259917B2 (ja) * | 2013-11-19 | 2018-01-10 | ヘッカー エレクトロニカ ポテンシャ ワイ プロセサス ソシエダッド アノニマ | 銅及び他の製品を電解採取または電解精錬するための電解セル群に供給するdcにacを重畳するためのシステム |
EP3029178A1 (en) | 2014-12-05 | 2016-06-08 | ATOTECH Deutschland GmbH | Method and apparatus for electroplating a metal onto a substrate |
EP3279676B1 (en) * | 2016-08-04 | 2020-04-01 | Robert Bosch GmbH | Method and device for the detection of corrosion within an at least partially electrically conductive housing of an electric energy storage unit and corresponding electric energy storage system |
CN114174559A (zh) * | 2019-08-05 | 2022-03-11 | Sms集团有限公司 | 使用脉冲技术对导电带材和/或织物进行电解涂层的方法和设备 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3959088A (en) * | 1975-03-19 | 1976-05-25 | The United States Of America As Represented By The Secretary Of The Army | Method and apparatus for generating high amperage pulses from an A-C power source |
US4656411A (en) * | 1984-11-13 | 1987-04-07 | Carlson Daniel P | DC current controller for hydroset battery electrode electroformation |
DE3609296A1 (de) * | 1986-03-19 | 1987-09-24 | Siemens Ag | Vorrichtung zur impulsartigen stromaenderung in einem gleichstromverbraucher, insbesondere einem elektrolytischen bad zur stoffabscheidung bzw. stoffabtragung |
US4863579A (en) * | 1986-12-27 | 1989-09-05 | Shizuoka Seiki Co., Ltd. | Power supply system for electrolytic processing apparatus |
KR910006552B1 (ko) * | 1987-09-17 | 1991-08-28 | 시즈오카 세이키 가부시기가이샤 | 전해가공에 의한 마무리 가공방법 |
US4839002A (en) * | 1987-12-23 | 1989-06-13 | International Hardcoat, Inc. | Method and capacitive discharge apparatus for aluminum anodizing |
DE3869110D1 (de) * | 1988-01-11 | 1992-04-16 | Shizuoka Seiki Co Ltd | Fertigbearbeitungsmethode, die ein elektrochemisches verfahren benutzt und elektrochemische fertigbearbeitungsmaschine. |
GB8801827D0 (en) * | 1988-01-27 | 1988-02-24 | Jct Controls Ltd | Improvements in electrochemical processes |
JPH0271932A (ja) * | 1988-09-07 | 1990-03-12 | Shizuoka Seiki Co Ltd | 電解仕上げ加工装置の芯出し方法 |
US5007993A (en) * | 1989-06-20 | 1991-04-16 | Hull Harry F | Electrolytic processing apparatus and method with time multiplexed power supply |
DE3939681A1 (de) * | 1989-12-01 | 1991-06-06 | Schering Ag | Verfahren zur steuerung des ablaufes von galvanischen anlagen, sowie zur durchfuehrung des verfahrens dienender anordnung |
KR910018111A (ko) * | 1990-04-26 | 1991-11-30 | 시기 모리야 | 전해가공방법 및 전해가공장치 |
-
1997
- 1997-02-27 DE DE19707905A patent/DE19707905C1/de not_active Expired - Fee Related
-
1998
- 1998-02-02 AU AU64948/98A patent/AU6494898A/en not_active Abandoned
- 1998-02-02 HU HU0000593A patent/HUP0000593A3/hu unknown
- 1998-02-02 CA CA002282391A patent/CA2282391A1/en not_active Abandoned
- 1998-02-02 AT AT98910610T patent/ATE217037T1/de not_active IP Right Cessation
- 1998-02-02 ES ES98910610T patent/ES2175687T3/es not_active Expired - Lifetime
- 1998-02-02 DE DE59803980T patent/DE59803980D1/de not_active Expired - Lifetime
- 1998-02-02 US US09/297,400 patent/US6179984B1/en not_active Expired - Fee Related
- 1998-02-02 WO PCT/DE1998/000383 patent/WO1998038357A1/de active IP Right Grant
- 1998-02-02 JP JP53715698A patent/JP4095675B2/ja not_active Expired - Lifetime
- 1998-02-02 CN CNB988012537A patent/CN1204300C/zh not_active Expired - Lifetime
- 1998-02-02 PL PL33313998A patent/PL187880B1/pl not_active IP Right Cessation
- 1998-02-02 EP EP98910610A patent/EP0966557B1/de not_active Expired - Lifetime
- 1998-02-02 BR BRPI9807269-2A patent/BR9807269B1/pt not_active IP Right Cessation
- 1998-02-02 KR KR10-1999-7003880A patent/KR100490223B1/ko not_active IP Right Cessation
- 1998-02-19 MY MYPI98000714A patent/MY119720A/en unknown
-
2000
- 2000-01-31 HK HK00100598A patent/HK1021750A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
BR9807269A (pt) | 2000-05-23 |
JP2001513146A (ja) | 2001-08-28 |
HUP0000593A2 (en) | 2000-07-28 |
CN1237215A (zh) | 1999-12-01 |
KR20000068882A (ko) | 2000-11-25 |
ES2175687T3 (es) | 2002-11-16 |
US6179984B1 (en) | 2001-01-30 |
ATE217037T1 (de) | 2002-05-15 |
CA2282391A1 (en) | 1998-09-03 |
DE59803980D1 (de) | 2002-06-06 |
PL187880B1 (pl) | 2004-10-29 |
DE19707905C1 (de) | 1998-02-05 |
HUP0000593A3 (en) | 2002-02-28 |
AU6494898A (en) | 1998-09-18 |
EP0966557A1 (de) | 1999-12-29 |
JP4095675B2 (ja) | 2008-06-04 |
MY119720A (en) | 2005-07-29 |
BR9807269B1 (pt) | 2010-06-01 |
PL333139A1 (en) | 1999-11-22 |
WO1998038357A1 (de) | 1998-09-03 |
EP0966557B1 (de) | 2002-05-02 |
KR100490223B1 (ko) | 2005-05-17 |
CN1204300C (zh) | 2005-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20150202 |