HK101896A - Encapsulated electrical or electronic device - Google Patents

Encapsulated electrical or electronic device

Info

Publication number
HK101896A
HK101896A HK101896A HK101896A HK101896A HK 101896 A HK101896 A HK 101896A HK 101896 A HK101896 A HK 101896A HK 101896 A HK101896 A HK 101896A HK 101896 A HK101896 A HK 101896A
Authority
HK
Hong Kong
Prior art keywords
electronic device
encapsulated electrical
encapsulated
electrical
electronic
Prior art date
Application number
HK101896A
Other languages
English (en)
Inventor
M Lana Sheer
John C Solenberger
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of HK101896A publication Critical patent/HK101896A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
    • H01B3/421—Polyesters
    • H01B3/422—Linear saturated polyesters derived from dicarboxylic acids and dihydroxy compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/022—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
HK101896A 1988-10-03 1996-06-13 Encapsulated electrical or electronic device HK101896A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25177288A 1988-10-03 1988-10-03

Publications (1)

Publication Number Publication Date
HK101896A true HK101896A (en) 1996-06-21

Family

ID=22953347

Family Applications (1)

Application Number Title Priority Date Filing Date
HK101896A HK101896A (en) 1988-10-03 1996-06-13 Encapsulated electrical or electronic device

Country Status (10)

Country Link
EP (1) EP0375851B1 (de)
JP (1) JPH02198114A (de)
KR (1) KR0132052B1 (de)
AU (1) AU637583B2 (de)
BR (1) BR8905014A (de)
CA (1) CA2000087A1 (de)
DE (1) DE68923945T2 (de)
ES (1) ES2077573T3 (de)
HK (1) HK101896A (de)
IL (1) IL91868A (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5026748A (en) * 1990-05-07 1991-06-25 E. I. Du Pont De Nemours And Company Thermally conductive adhesive
JPH06270175A (ja) * 1991-05-15 1994-09-27 E I Du Pont De Nemours & Co 多段階圧縮成型により熱可塑性シート材料で封入したインサート
IT1268492B1 (it) * 1993-10-26 1997-03-04 Hydor Srl Metodo per realizzare apparecchiature elettromeccaniche funzionanti in immersione ed apparecchiatura ottenuta con il metodo
US6198373B1 (en) * 1997-08-19 2001-03-06 Taiyo Yuden Co., Ltd. Wire wound electronic component
CA2309630A1 (en) * 1997-11-13 1999-05-27 James D. Miller Heat pipe thermal management apparatus
JPH11186003A (ja) * 1997-12-25 1999-07-09 Yazaki Corp Ｐｔｃ素子の放熱構造
DE10328373B4 (de) * 2003-06-24 2015-10-08 Continental Automotive Gmbh Piezoelektrisches Bauteil mit Temperiervorrichtung und Verwendung des Bauteils
WO2009138096A1 (de) * 2008-05-13 2009-11-19 Abb Technology Ag Trockentransformator
JP5534551B2 (ja) * 2009-05-07 2014-07-02 住友電気工業株式会社 リアクトル
EP2355116A1 (de) 2010-01-29 2011-08-10 ABB Research Ltd. Elektrische Vorrichtung und Verfahren zur Herstellung der Vorrichtung
WO2020003484A1 (ja) * 2018-06-29 2020-01-02 新電元工業株式会社 磁性部品

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3030597A (en) * 1958-02-28 1962-04-17 Westinghouse Electric Corp Insulated electrical apparatus
FR2003774A1 (de) * 1968-03-13 1969-11-14 Licentia Gmbh
CH576206A5 (de) * 1974-08-06 1976-05-31 Braun Franz
JPS51111862A (en) * 1975-03-27 1976-10-02 Denki Onkyo Co Ltd Synthetic resin mold
JPS51134869A (en) * 1975-05-19 1976-11-22 Hitachi Ltd Mould coil
US4138525A (en) * 1976-02-11 1979-02-06 Union Carbide Corporation Highly-handleable pitch-based fibers
JPS5450865A (en) * 1977-09-30 1979-04-21 Hitachi Ltd Coil for electrical apparatus
US4632798A (en) * 1983-07-27 1986-12-30 Celanese Corporation Encapsulation of electronic components with anisotropic thermoplastic polymers
LU85462A1 (fr) * 1984-07-11 1986-02-12 Univ Louvain Nouvelles compositions polymeres,procedes pour leur production et leurs applications
JPS6169813U (de) * 1984-10-12 1986-05-13
JPS61296068A (ja) * 1985-06-20 1986-12-26 シ−メンス、アクチエンゲゼルシヤフト プラスチツクコンパウンド
US4888247A (en) * 1986-08-27 1989-12-19 General Electric Company Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite

Also Published As

Publication number Publication date
AU637583B2 (en) 1993-06-03
ES2077573T3 (es) 1995-12-01
KR0132052B1 (ko) 1998-04-24
EP0375851A3 (en) 1990-11-28
EP0375851A2 (de) 1990-07-04
KR900006995A (ko) 1990-05-09
DE68923945D1 (de) 1995-09-28
AU4244989A (en) 1990-04-05
BR8905014A (pt) 1990-05-08
JPH02198114A (ja) 1990-08-06
IL91868A (en) 1994-06-24
CA2000087A1 (en) 1990-04-03
DE68923945T2 (de) 1996-04-25
IL91868A0 (en) 1990-06-10
EP0375851B1 (de) 1995-08-23

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)