HK1018123A1 - Method and apparatus for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detection - Google Patents

Method and apparatus for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detection

Info

Publication number
HK1018123A1
HK1018123A1 HK99102696A HK99102696A HK1018123A1 HK 1018123 A1 HK1018123 A1 HK 1018123A1 HK 99102696 A HK99102696 A HK 99102696A HK 99102696 A HK99102696 A HK 99102696A HK 1018123 A1 HK1018123 A1 HK 1018123A1
Authority
HK
Hong Kong
Prior art keywords
access
processing
particle detection
situ
semiconductor wafer
Prior art date
Application number
HK99102696A
Other languages
English (en)
Inventor
William Mark Hiatt
Barbara Vasquez
Karl Emerson Mautz
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of HK1018123A1 publication Critical patent/HK1018123A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
HK99102696A 1997-08-18 1999-06-23 Method and apparatus for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detection HK1018123A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/912,726 US5963315A (en) 1997-08-18 1997-08-18 Method and apparatus for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detection

Publications (1)

Publication Number Publication Date
HK1018123A1 true HK1018123A1 (en) 1999-12-10

Family

ID=25432337

Family Applications (1)

Application Number Title Priority Date Filing Date
HK99102696A HK1018123A1 (en) 1997-08-18 1999-06-23 Method and apparatus for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detection

Country Status (9)

Country Link
US (1) US5963315A (fr)
EP (1) EP0898300B1 (fr)
JP (1) JPH11150168A (fr)
KR (1) KR100381316B1 (fr)
CN (1) CN1296972C (fr)
DE (1) DE69832131T2 (fr)
HK (1) HK1018123A1 (fr)
SG (1) SG67526A1 (fr)
TW (1) TW423027B (fr)

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US7012684B1 (en) * 1999-09-07 2006-03-14 Applied Materials, Inc. Method and apparatus to provide for automated process verification and hierarchical substrate examination
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US7432634B2 (en) * 2000-10-27 2008-10-07 Board Of Regents, University Of Texas System Remote center compliant flexure device
EP1184724A1 (fr) 2000-08-29 2002-03-06 Motorola, Inc. Dispositif électronique pour récipient de masques lithographiques et méthode l'utilisant
US6696362B2 (en) * 2001-02-08 2004-02-24 Applied Materials Inc. Method for using an in situ particle sensor for monitoring particle performance in plasma deposition processes
US6909930B2 (en) * 2001-07-19 2005-06-21 Hitachi, Ltd. Method and system for monitoring a semiconductor device manufacturing process
SG129992A1 (en) * 2001-08-13 2007-03-20 Micron Technology Inc Method and apparatus for detecting topographical features of microelectronic substrates
US6634686B2 (en) * 2001-10-03 2003-10-21 Applied Materials, Inc. End effector assembly
US7045019B1 (en) * 2001-12-21 2006-05-16 Lam Research Corporation Method for performing site-specific backside particle and contamination removal
US6627466B1 (en) * 2002-05-03 2003-09-30 Lsi Logic Corporation Method and apparatus for detecting backside contamination during fabrication of a semiconductor wafer
US6900135B2 (en) * 2002-08-27 2005-05-31 Applied Materials, Inc. Buffer station for wafer backside cleaning and inspection
US6902647B2 (en) * 2002-08-29 2005-06-07 Asm International N.V. Method of processing substrates with integrated weighing steps
KR20040038783A (ko) * 2002-10-30 2004-05-08 가부시기가이샤 산교세이기 세이사꾸쇼 산업용 로봇
KR100499176B1 (ko) * 2002-11-27 2005-07-01 삼성전자주식회사 반도체 기판의 오염 측정 방법 및 이를 수행하기 위한 장치
DE10332110A1 (de) * 2003-07-09 2005-01-27 Carl Zeiss Smt Ag Vorrichtung zur Streulichtinspektion optischer Elemente
US7158221B2 (en) * 2003-12-23 2007-01-02 Applied Materials, Inc. Method and apparatus for performing limited area spectral analysis
US6909102B1 (en) 2004-01-21 2005-06-21 Varian Semiconductor Equipment Associates, Inc. Ion implanter system, method and program product including particle detection
US20060154385A1 (en) * 2005-01-07 2006-07-13 Ravinder Aggarwal Fabrication pathway integrated metrology device
KR100629377B1 (ko) 2005-02-01 2006-09-29 삼성전자주식회사 웨이퍼 하면의 파티클을 감지하는 웨이퍼 처리 방법 및 장치
TWI278910B (en) * 2005-08-09 2007-04-11 Powerchip Semiconductor Corp System and method for wafer visual inspection
US7268574B2 (en) 2005-09-01 2007-09-11 Micron Technology, Inc. Systems and methods for sensing obstructions associated with electrical testing of microfeature workpieces
US7248975B2 (en) * 2005-09-20 2007-07-24 Tech Semiconductor Singapore Pte Ltd Real time monitoring of particulate contamination in a wafer processing chamber
US7659976B2 (en) * 2005-12-12 2010-02-09 Carl Zeiss Smt Ag Devices and methods for inspecting optical elements with a view to contamination
KR100742279B1 (ko) * 2005-12-22 2007-07-24 삼성전자주식회사 반도체 소자의 제조 장치 및 방법
KR100757349B1 (ko) 2006-01-09 2007-09-11 삼성전자주식회사 기판 이송 로봇 및 이를 갖는 기판 세정 장치
WO2007124007A2 (fr) * 2006-04-21 2007-11-01 Molecular Imprints, Inc. Procédé pour détecter une particule dans un système de lithographie par nano-impression
US20070247165A1 (en) * 2006-04-25 2007-10-25 Applied Materials, Inc. Wafer backside particle detection for track tools
US7572342B2 (en) * 2006-06-02 2009-08-11 Wafertech, Llc Method and apparatus for cleaning semiconductor photolithography tools
JP2008021967A (ja) * 2006-06-13 2008-01-31 Fujitsu Ltd 検査方法及び検査装置
US7740437B2 (en) * 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
KR101209020B1 (ko) * 2007-12-27 2012-12-06 가부시키가이샤 알박 반송 로봇의 진단 시스템
US8009938B2 (en) 2008-02-29 2011-08-30 Applied Materials, Inc. Advanced process sensing and control using near infrared spectral reflectometry
US8095895B2 (en) * 2009-01-14 2012-01-10 Iyun Leu Method for defect diagnosis and management
US9689804B2 (en) 2013-12-23 2017-06-27 Kla-Tencor Corporation Multi-channel backside wafer inspection
US20160372317A1 (en) * 2014-03-06 2016-12-22 Imt Co., Ltd Device and method for cleaning backside or edge of wafer
US9829806B2 (en) 2014-03-14 2017-11-28 Taiwan Semiconductor Manufacturing Company Limited Lithography tool with backside polisher
US10216176B2 (en) * 2014-04-29 2019-02-26 Asm Ip Holding B.V. Substrate processing apparatus
CN105699396A (zh) * 2016-03-29 2016-06-22 同高先进制造科技（太仓）有限公司 基于光扫描的焊接激光头保护镜污染检测装置及方法
US9911634B2 (en) * 2016-06-27 2018-03-06 Globalfoundries Inc. Self-contained metrology wafer carrier systems
US10931143B2 (en) * 2016-08-10 2021-02-23 Globalfoundries U.S. Inc. Rechargeable wafer carrier systems
WO2019182913A1 (fr) * 2018-03-20 2019-09-26 Tokyo Electron Limited Plate-forme hétérogène auto-sensible et de correction incorporant des modules intégrés de traitement de semi-conducteur et son procédé d'utilisation
US11164768B2 (en) 2018-04-27 2021-11-02 Kla Corporation Process-induced displacement characterization during semiconductor production
DE102019117021A1 (de) * 2019-06-25 2020-12-31 Bayerische Motoren Werke Aktiengesellschaft Verfahren und Vorrichtung zum Lackieren eines Bauteils
US11469123B2 (en) * 2019-08-19 2022-10-11 Applied Materials, Inc. Mapping of a replacement parts storage container
US11105978B2 (en) 2020-02-04 2021-08-31 Globalfoundries U.S. Inc. Polarizers including stacked elements
KR102333316B1 (ko) * 2020-11-19 2021-12-02 주식회사 하이퓨리티 오픈패스 방식을 갖는 반도체 공정의 오염 모니터링 장치
US20230008072A1 (en) * 2021-07-08 2023-01-12 Applied Materials, Inc. Method and mechanism for contact-free process chamber characterization

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JP3195200B2 (ja) * 1994-12-09 2001-08-06 キヤノン株式会社 半導体露光装置および異物検出方法
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US5780204A (en) * 1997-02-03 1998-07-14 Advanced Micro Devices, Inc. Backside wafer polishing for improved photolithography

Also Published As

Publication number Publication date
DE69832131D1 (de) 2005-12-08
US5963315A (en) 1999-10-05
EP0898300A3 (fr) 2001-08-22
KR100381316B1 (ko) 2003-08-02
DE69832131T2 (de) 2006-04-20
TW423027B (en) 2001-02-21
EP0898300A2 (fr) 1999-02-24
EP0898300B1 (fr) 2005-11-02
CN1296972C (zh) 2007-01-24
JPH11150168A (ja) 1999-06-02
CN1208951A (zh) 1999-02-24
KR19990023653A (ko) 1999-03-25
SG67526A1 (en) 1999-09-21

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Legal Events

Date Code Title Description
AS Change of ownership

Owner name: FREESCALE SEMICONDUCTOR, INC.

Free format text: FORMER OWNER(S): MOTOROLA, INC

PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150817