HK1007828A1 - Laminated lc element and method for manufacturing the same - Google Patents

Laminated lc element and method for manufacturing the same

Info

Publication number
HK1007828A1
HK1007828A1 HK98106857A HK98106857A HK1007828A1 HK 1007828 A1 HK1007828 A1 HK 1007828A1 HK 98106857 A HK98106857 A HK 98106857A HK 98106857 A HK98106857 A HK 98106857A HK 1007828 A1 HK1007828 A1 HK 1007828A1
Authority
HK
Hong Kong
Prior art keywords
laminated
manufacturing
same
Prior art date
Application number
HK98106857A
Other languages
English (en)
Inventor
Takeshi Ikeda
Original Assignee
Takeshi Ikeda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takeshi Ikeda filed Critical Takeshi Ikeda
Publication of HK1007828A1 publication Critical patent/HK1007828A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G7/00—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F2017/0093—Common mode choke coil

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Filters And Equalizers (AREA)
  • Coils Or Transformers For Communication (AREA)
HK98106857A 1989-12-25 1998-06-26 Laminated lc element and method for manufacturing the same HK1007828A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33569489 1989-12-25

Publications (1)

Publication Number Publication Date
HK1007828A1 true HK1007828A1 (en) 1999-04-23

Family

ID=18291445

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98106857A HK1007828A1 (en) 1989-12-25 1998-06-26 Laminated lc element and method for manufacturing the same

Country Status (5)

Country Link
US (2) US5126707A (ko)
EP (1) EP0435230B1 (ko)
KR (1) KR100216095B1 (ko)
DE (1) DE69024185T2 (ko)
HK (1) HK1007828A1 (ko)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126707A (en) * 1989-12-25 1992-06-30 Takeshi Ikeda Laminated lc element and method for manufacturing the same
CA2059864C (en) * 1991-01-23 1995-10-17 Mitsunobu Esaki Lc filter
JP2539367Y2 (ja) * 1991-01-30 1997-06-25 株式会社村田製作所 積層型電子部品
US5402098A (en) * 1991-03-25 1995-03-28 Satosen Co., Ltd. Coil
US5404118A (en) * 1992-07-27 1995-04-04 Murata Manufacturing Co., Ltd. Band pass filter with resonator having spiral electrodes formed of coil electrodes on plurality of dielectric layers
US5910755A (en) * 1993-03-19 1999-06-08 Fujitsu Limited Laminate circuit board with selectable connections between wiring layers
US5497028A (en) * 1993-11-10 1996-03-05 Ikeda; Takeshi LC element and semiconductor device having a signal transmission line and LC element manufacturing method
TW293955B (ko) * 1994-02-09 1996-12-21 Mitsubishi Materials Corp
JPH08316766A (ja) * 1995-05-16 1996-11-29 Murata Mfg Co Ltd Ｌｃフィルタ
US5821846A (en) * 1995-05-22 1998-10-13 Steward, Inc. High current ferrite electromagnetic interference suppressor and associated method
US5614757A (en) * 1995-10-26 1997-03-25 Dale Electronics, Inc. Monolithic multilayer chip inductor having a no-connect terminal
JPH09270325A (ja) * 1996-03-29 1997-10-14 Tokin Corp 電子部品
KR980005227A (ko) * 1996-06-12 1998-03-30 엄길용 음극선관의 필름형 편향부재용 양면 필름
US5705966A (en) * 1996-08-02 1998-01-06 I.T.-Tel Ltd. LC-type dielectric strip line resonator
US6038134A (en) * 1996-08-26 2000-03-14 Johanson Dielectrics, Inc. Modular capacitor/inductor structure
US5818313A (en) * 1997-01-31 1998-10-06 Motorola Inc. Multilayer lowpass filter with single point ground plane configuration
US5880662A (en) * 1997-08-21 1999-03-09 Dale Electronics, Inc. High self resonant frequency multilayer inductor and method for making same
US5945902A (en) * 1997-09-22 1999-08-31 Zefv Lipkes Core and coil structure and method of making the same
JP3307307B2 (ja) * 1997-12-19 2002-07-24 株式会社村田製作所 多層型高周波電子部品
JP2976971B1 (ja) * 1998-07-10 1999-11-10 株式会社村田製作所 同相型インダクタ
JP2001053571A (ja) 1999-08-06 2001-02-23 Murata Mfg Co Ltd Ｌｃノイズフィルタ
US7161089B2 (en) 2002-12-04 2007-01-09 Tdk Corporation Electronic component
JP3900104B2 (ja) * 2003-04-10 2007-04-04 松下電器産業株式会社 静電気対策部品
JP4231857B2 (ja) * 2005-03-31 2009-03-04 Ｔｄｋ株式会社 ノイズ抑制回路
JP4150394B2 (ja) * 2005-09-29 2008-09-17 Ｔｄｋ株式会社 積層型フィルタの製造方法
US20070171992A1 (en) * 2006-01-26 2007-07-26 Broadcom Corporation, A California Corporation Near field RFID system with multiple reader coils
JP4708372B2 (ja) * 2006-02-28 2011-06-22 株式会社日本自動車部品総合研究所 差動伝送用の回路基板装置
US8493744B2 (en) * 2007-04-03 2013-07-23 Tdk Corporation Surface mount devices with minimum lead inductance and methods of manufacturing the same
KR101162154B1 (ko) * 2008-04-28 2012-07-04 가부시키가이샤 무라타 세이사쿠쇼 적층 코일 부품 및 그 제조 방법
CN102422533B (zh) 2009-07-27 2014-09-03 松江Elmec株式会社 共模过滤器
DE102012201847A1 (de) * 2012-02-08 2013-08-08 Würth Elektronik eiSos Gmbh & Co. KG Elektronisches Bauelement
KR101771740B1 (ko) * 2012-11-13 2017-08-25 삼성전기주식회사 박막형 칩 소자 및 그 제조 방법
US9954510B2 (en) 2014-11-28 2018-04-24 Samsung Electro-Mechanics Co., Ltd. Common mode filter
JP6911369B2 (ja) * 2017-02-15 2021-07-28 Tdk株式会社 積層コイル部品の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55156311A (en) * 1979-05-24 1980-12-05 Kokusai Electric Co Ltd Inductance element
JPS5896717A (ja) * 1981-12-04 1983-06-08 Nec Home Electronics Ltd 積層型コイル部品の製造方法
JPS59189212U (ja) * 1983-05-18 1984-12-15 株式会社村田製作所 チツプ型インダクタ
DE3423139A1 (de) * 1983-06-23 1985-01-10 Murata Eria N.A., Inc., Marietta, Ga. Monolithische induktivitaet mit transformatoranwendungen
JPS637017A (ja) * 1986-06-27 1988-01-12 Sharp Corp 無接点リレ−
DE3628021A1 (de) * 1986-08-19 1988-02-25 Siemens Ag Chip-bauteil mit wenigstens einer spule und verfahren zu dessen herstellung
JP2598940B2 (ja) * 1988-01-27 1997-04-09 株式会社村田製作所 Ｌｃ複合部品
US5039964A (en) * 1989-02-16 1991-08-13 Takeshi Ikeda Inductance and capacitance noise filter
US5126707A (en) * 1989-12-25 1992-06-30 Takeshi Ikeda Laminated lc element and method for manufacturing the same

Also Published As

Publication number Publication date
US5278526A (en) 1994-01-11
EP0435230A2 (en) 1991-07-03
US5126707A (en) 1992-06-30
KR910013536A (ko) 1991-08-08
KR100216095B1 (ko) 1999-08-16
DE69024185D1 (de) 1996-01-25
EP0435230B1 (en) 1995-12-13
EP0435230A3 (en) 1992-04-15
DE69024185T2 (de) 1996-08-14

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20091221