HK1005623A1 - New(cyclo) aliphatic epoxy compounds - Google Patents

New(cyclo) aliphatic epoxy compounds

Info

Publication number
HK1005623A1
HK1005623A1 HK98104762A HK98104762A HK1005623A1 HK 1005623 A1 HK1005623 A1 HK 1005623A1 HK 98104762 A HK98104762 A HK 98104762A HK 98104762 A HK98104762 A HK 98104762A HK 1005623 A1 HK1005623 A1 HK 1005623A1
Authority
HK
Hong Kong
Prior art keywords
cyclo
new
epoxy compounds
aliphatic epoxy
contain
Prior art date
Application number
HK98104762A
Other languages
English (en)
Inventor
Bettina Steinmann
Jean-Pierre Wolf
Adrian Schulthess
Max Hunziker
Original Assignee
Ciba Geigy Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy Ag filed Critical Ciba Geigy Ag
Publication of HK1005623A1 publication Critical patent/HK1005623A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/38—Compounds containing oxirane rings with hydrocarbon radicals, substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
    • C07D303/40—Compounds containing oxirane rings with hydrocarbon radicals, substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals by ester radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Epoxy Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
HK98104762A 1992-12-23 1998-06-02 New(cyclo) aliphatic epoxy compounds HK1005623A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH394392 1992-12-23

Publications (1)

Publication Number Publication Date
HK1005623A1 true HK1005623A1 (en) 1999-01-15

Family

ID=4266828

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98104762A HK1005623A1 (en) 1992-12-23 1998-06-02 New(cyclo) aliphatic epoxy compounds

Country Status (11)

Country Link
US (2) US5468886A (fr)
EP (1) EP0604364B1 (fr)
JP (1) JPH06228271A (fr)
KR (1) KR100294774B1 (fr)
AT (1) ATE163438T1 (fr)
AU (2) AU672645B2 (fr)
CA (1) CA2112010C (fr)
DE (1) DE59308175D1 (fr)
ES (1) ES2114601T3 (fr)
HK (1) HK1005623A1 (fr)
TW (1) TW259797B (fr)

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TW259797B (fr) * 1992-12-23 1995-10-11 Ciba Geigy
JP3117394B2 (ja) * 1994-11-29 2000-12-11 帝人製機株式会社 光学的立体造形用樹脂組成物
US5639413A (en) * 1995-03-30 1997-06-17 Crivello; James Vincent Methods and compositions related to stereolithography
JPH08277321A (ja) * 1995-04-05 1996-10-22 Daicel Chem Ind Ltd 光硬化性樹脂組成物
EP0748684B1 (fr) * 1995-06-14 2000-08-30 United Technologies Corporation Méthode pour produire un objet solide et de dimensions stables
DE59701299D1 (de) * 1996-07-29 2000-04-27 Ciba Sc Holding Ag Flüssige, strahlungshärtbare Zusammensetzung, insbesondere für die Stereolithographie
US6008266A (en) * 1996-08-14 1999-12-28 International Business Machines Corporation Photosensitive reworkable encapsulant
US7332537B2 (en) * 1996-09-04 2008-02-19 Z Corporation Three dimensional printing material system and method
JP3724893B2 (ja) * 1996-09-25 2005-12-07 ナブテスコ株式会社 光学的立体造形用樹脂組成物
JP3626302B2 (ja) * 1996-12-10 2005-03-09 Ｊｓｒ株式会社 光硬化性樹脂組成物
US6124483A (en) * 1996-12-23 2000-09-26 Sartomer Technology Company Process for preparing unsaturated esters containing cyclic epoxy group
US5767150A (en) * 1997-04-10 1998-06-16 Sartomer Company Cycloaliphatic epoxide compounds
EP0887706A1 (fr) * 1997-06-25 1998-12-30 Wako Pure Chemical Industries Ltd Composition pour photoréserve contenant un agent réticulant spécifique
US6235363B1 (en) 1998-05-06 2001-05-22 Avery Dennison Corporation Composite construction containing barrier layer
US6150479A (en) * 1998-11-23 2000-11-21 Loctite Corporation Radical-curable adhesive compositions, reaction products of which demonstrate superior resistance to thermal degradation
US6342545B1 (en) 1998-11-23 2002-01-29 Loctite Corporation Radical-curable adhesive compositions, reaction products of which demonstrate superior resistance to thermal degradation
US6451948B1 (en) 1999-08-19 2002-09-17 Loctite Corporation Radical-curable adhesive compositions, reaction products of which demonstrate superior resistance to thermal degradation
EP1226019B1 (fr) 1999-11-05 2004-03-03 Z Corporation Procedes pour impression tridimensionnelle
WO2001051272A1 (fr) * 2000-01-14 2001-07-19 Abb Power T & D Company Inc. Structures epoxydiques transparentes
US20030200835A1 (en) * 2002-04-02 2003-10-30 Snecma Services Diffusion-brazing filler powder for parts made of an alloy based on nickel, cobalt or iron
US6833231B2 (en) * 2002-07-31 2004-12-21 3D Systems, Inc. Toughened stereolithographic resin compositions
US7087109B2 (en) * 2002-09-25 2006-08-08 Z Corporation Three dimensional printing material system and method
ATE530331T1 (de) * 2003-05-21 2011-11-15 Z Corp Thermoplastisches pulvermaterialsystem für appearance models von 3d-drucksystemen
US20090076183A1 (en) * 2005-05-04 2009-03-19 John Jun Chiao Radiation curable methacrylate polyesters
WO2007114895A2 (fr) * 2006-04-06 2007-10-11 Z Corporation production d'éléments tridimensionnels au moyen de radiations électromagnétiques
WO2008073297A2 (fr) 2006-12-08 2008-06-19 Z Corporation Système de matériaux d'impression tridimensionnelle et procédé utilisant un durcissement au peroxyde
US8167999B2 (en) 2007-01-10 2012-05-01 3D Systems, Inc. Three-dimensional printing material system with improved color, article performance, and ease of use
US7968626B2 (en) 2007-02-22 2011-06-28 Z Corporation Three dimensional printing material system and method using plasticizer-assisted sintering
CN104086748B (zh) * 2014-06-27 2017-04-05 京东方科技集团股份有限公司 改性环氧丙烯酸酯、光阻组合物及其制备方法和透明光阻
KR101853387B1 (ko) * 2015-03-27 2018-04-30 동우 화인켐 주식회사 플렉서블 디스플레이용 하드코팅 필름
KR102622843B1 (ko) * 2016-02-15 2024-01-11 삼성디스플레이 주식회사 플렉서블 표시장치 및 그것의 하드 코팅 고분자 제조방법
JP6618186B2 (ja) * 2016-05-12 2019-12-11 日本化薬株式会社 樹脂組成物および電子部品用接着剤
CN108196428B (zh) * 2018-01-29 2020-03-31 深圳市华星光电技术有限公司 一种光刻胶组合物及彩色滤光片

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Publication number Priority date Publication date Assignee Title
GB788531A (en) * 1954-03-25 1958-01-02 Union Carbide Corp Diepoxides and process of producing the same
US4100141A (en) * 1976-07-02 1978-07-11 Loctite (Ireland) Limited Stabilized adhesive and curing compositions
US4565859A (en) * 1984-01-30 1986-01-21 Daicel Chemical Industries, Ltd. Polyether compounds, epoxy resins, epoxy resin compositions, and processes for production thereof
US4816496A (en) * 1984-06-26 1989-03-28 Kabushiki Kaisha Toshiba Photocurable composition
US4575330A (en) * 1984-08-08 1986-03-11 Uvp, Inc. Apparatus for production of three-dimensional objects by stereolithography
US4929402A (en) * 1984-08-08 1990-05-29 3D Systems, Inc. Method for production of three-dimensional objects by stereolithography
DE3709230A1 (de) * 1987-03-20 1988-10-06 Desitin Arzneimittel Gmbh Neues calciumsalz der valproinsaeure
WO1989007620A1 (fr) * 1988-02-19 1989-08-24 Asahi Denka Kogyo K.K. Preparation a base de resine pour le modelage optique
EP0477666B1 (fr) * 1990-09-24 1995-06-28 Siemens Aktiengesellschaft Epoxy-résines réticulées à propriétés optiques non-linéaires
JP2899832B2 (ja) * 1990-11-14 1999-06-02 日本ペイント株式会社 新規熱硬化性樹脂組成物
JP3142610B2 (ja) * 1991-09-25 2001-03-07 株式会社日本触媒 不飽和エステル化合物の製造方法
TW259797B (fr) * 1992-12-23 1995-10-11 Ciba Geigy

Also Published As

Publication number Publication date
AU1009097A (en) 1997-03-06
EP0604364A2 (fr) 1994-06-29
CA2112010A1 (fr) 1994-06-24
ATE163438T1 (de) 1998-03-15
AU5263993A (en) 1994-07-07
JPH06228271A (ja) 1994-08-16
US5468886A (en) 1995-11-21
EP0604364B1 (fr) 1998-02-25
KR940014373A (ko) 1994-07-18
AU672645B2 (en) 1996-10-10
ES2114601T3 (es) 1998-06-01
KR100294774B1 (ko) 2001-09-17
US5599651A (en) 1997-02-04
AU683002B2 (en) 1997-10-23
TW259797B (fr) 1995-10-11
CA2112010C (fr) 2000-03-07
DE59308175D1 (de) 1998-04-02
EP0604364A3 (fr) 1995-01-04

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20031213

PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)