HK1004815A1 - Flame retardant high temperature polyphthalamides having improved thermal stability - Google Patents

Flame retardant high temperature polyphthalamides having improved thermal stability

Info

Publication number
HK1004815A1
HK1004815A1 HK98104058A HK98104058A HK1004815A1 HK 1004815 A1 HK1004815 A1 HK 1004815A1 HK 98104058 A HK98104058 A HK 98104058A HK 98104058 A HK98104058 A HK 98104058A HK 1004815 A1 HK1004815 A1 HK 1004815A1
Authority
HK
Hong Kong
Prior art keywords
high temperature
flame retardant
thermal stability
improved thermal
retardant high
Prior art date
Application number
HK98104058A
Other languages
English (en)
Inventor
Mark G Reichmann
Original Assignee
Bp Amoco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bp Amoco Corp filed Critical Bp Amoco Corp
Publication of HK1004815A1 publication Critical patent/HK1004815A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
HK98104058A 1996-05-14 1998-05-12 Flame retardant high temperature polyphthalamides having improved thermal stability HK1004815A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1761596P 1996-05-14 1996-05-14
US08/826,870 US5773500A (en) 1996-05-14 1997-03-26 Flame retardant high temperature polyphthalamides having improved thermal stability

Publications (1)

Publication Number Publication Date
HK1004815A1 true HK1004815A1 (en) 1998-12-11

Family

ID=26690105

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98104058A HK1004815A1 (en) 1996-05-14 1998-05-12 Flame retardant high temperature polyphthalamides having improved thermal stability

Country Status (6)

Country Link
US (1) US5773500A (xx)
EP (1) EP0807665B1 (xx)
JP (1) JPH1067932A (xx)
CA (1) CA2203346A1 (xx)
DE (1) DE69702479T2 (xx)
HK (1) HK1004815A1 (xx)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6207745B1 (en) * 1998-02-04 2001-03-27 Bp Amoco Corporation Flame retardant anti-drip polyamide compositions
NL1008443C2 (nl) * 1998-03-02 1999-09-03 Dsm Nv Hoogsmeltende polyamidesamenstelling voor electronicatoepassingen.
US6350802B2 (en) * 1998-03-18 2002-02-26 E. I. Du Pont De Nemours And Company Thermally stable flame retardant polyamides
TW539614B (en) * 2000-06-06 2003-07-01 Matsushita Electric Works Ltd Laminate
JP2002105311A (ja) * 2000-09-28 2002-04-10 Mitsui Chemicals Inc 難燃性ポリアミド組成物およびその用途
CA2535344C (en) * 2003-08-19 2015-10-06 Solvay Advanced Polymers, L.L.C. Impact-modified polyamide hollow body
JP4480718B2 (ja) 2004-04-27 2010-06-16 宇部興産株式会社 高温薬液及び／又はガス搬送用積層ホース
WO2007061883A2 (en) * 2005-11-18 2007-05-31 Research Foundation Of State University Of New York Flame retardant plastic compositions
US8357739B2 (en) * 2006-12-11 2013-01-22 Sabic Innovative Plastics Ip B.V. Low fluoride thermoplastic composition, method of manufacture and product made therefrom
CN101772550B (zh) * 2007-08-01 2012-10-10 可乐丽股份有限公司 聚酰胺组合物
TW201114837A (en) * 2009-04-09 2011-05-01 Solvay Advanced Polymers Llc Improved halogen free flame retardant polymide composition
CN101817978B (zh) * 2010-04-21 2012-08-08 深圳市科聚新材料有限公司 一种高温尼龙ppa增强材料及其制备方法
FR2976946B1 (fr) * 2011-06-24 2014-01-24 Arkema France Composition comprenant un polyamide semi-aromatique et ses utilisations, notamment pour un reflecteur a diode electroluminescente
JP6138321B1 (ja) * 2016-06-30 2017-05-31 ユニチカ株式会社 熱可塑性樹脂組成物およびそれを成形してなる成形体
KR102263527B1 (ko) 2017-04-25 2021-06-09 어드밴식스 레진즈 앤드 케미컬즈 엘엘씨 카프로락탐을 기재로 하는 반-방향족 코폴리아미드
CN109504074A (zh) * 2018-10-22 2019-03-22 滁州吉胜新材料科技有限公司 一种阻燃增强高温尼龙及其制备方法
CN110408193A (zh) * 2019-08-14 2019-11-05 东莞拓步特高分子材料有限公司 无卤阻燃高温尼龙

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4012445A (en) * 1974-04-23 1977-03-15 Union Carbide Corporation Beta-amino carbonyl catalysts for polyurethane preparation
DE2627342A1 (de) * 1976-06-18 1977-12-22 Dynamit Nobel Ag Verfahren zur herstellung von gegebenenfalls modifiziertem poly- (alkylpentamethylenterephthalamid)
US4111203A (en) * 1976-11-22 1978-09-05 Alza Corporation Osmotic system with means for improving delivery kinetics of system
US4831108A (en) * 1983-02-16 1989-05-16 Amoco Corporation Polycondensation process with mean dispersion residence time
USRE34447E (en) * 1983-02-16 1993-11-16 Amoco Corporation Crystalline polyamide composition from dicarboxylic acid mixture and diamine
DE3874359T2 (de) * 1987-01-27 1993-04-22 Asahi Chemical Ind Flammwidrige polyamidharzzubereitung.
CA1338392C (en) * 1987-04-20 1996-06-11 Mitsui Chemicals, Incorporated Fire-retardant polyamide composition having good heat resistance
US4952628A (en) * 1987-08-24 1990-08-28 E. I. Du Pont De Nemours And Company Barrier blends based on amorphous polyamide and ethylene/vinyl alcohol, unaffected by humidity
US5543452A (en) * 1988-03-15 1996-08-06 Asahi Kasei Kogyo Kabushiki Kaisha Flame-resistant polyamide resin compositions and flame retardants therefor
JP2724867B2 (ja) * 1988-03-15 1998-03-09 旭化成工業株式会社 難燃性ポリアミド組成物及び難燃剤
US5085807A (en) * 1989-05-15 1992-02-04 Toray Industries, Inc. Flame-retardant liquid crystal polyester composition, process for preparation thereof and injection-molded article composed thereof
US5256718A (en) * 1990-02-14 1993-10-26 Mitsui Petrochemical Industries, Ltd. Flame retardant polyamide thermoplastic resin composition
USH1030H (en) * 1990-03-21 1992-03-03 Shell Oil Company Flame retardant composition #2
US5112685A (en) * 1991-02-11 1992-05-12 Hoechst Celanese Corporation Dryer screen made from poly(2-methyl-1,5-pentylene) terephthalamide
US5302723A (en) * 1993-10-04 1994-04-12 Monsanto Company Process for preparing flame retardant bisimide compositions
US5393887A (en) * 1993-10-04 1995-02-28 Monsanto Company Bisimide compositions
JP3523312B2 (ja) * 1993-12-28 2004-04-26 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 難燃性ポリアミド樹脂組成物
US5614578A (en) * 1994-10-28 1997-03-25 Alza Corporation Injection-molded dosage form

Also Published As

Publication number Publication date
DE69702479T2 (de) 2001-03-15
EP0807665A3 (en) 1998-01-07
US5773500A (en) 1998-06-30
JPH1067932A (ja) 1998-03-10
CA2203346A1 (en) 1997-11-14
EP0807665A2 (en) 1997-11-19
DE69702479D1 (de) 2000-08-17
EP0807665B1 (en) 2000-07-12

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20050509